How to apply underfill adhesive dispensing to the bottom of chips on a PCB board?
secondautomation
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25 slides
Sep 10, 2025
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About This Presentation
Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages).
Below, I will explain the procedure in detail, covering its purpose, materials, equipment, steps, and precautio...
Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages).
Below, I will explain the procedure in detail, covering its purpose, materials, equipment, steps, and precautions.
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单击添加标题 PleaseaddaclearbusinesstemplateforthetitlecontentyouwanttoaddPleaseaddaclebusinessPleaseaddaclearbusinesstemplatePPleaseaddaclearbusinesstemplateforthetitle PART 02
单击添加标题 PleaseaddaclearbusinesstemplateforthetitlecontentyouwanttoaddPleaseaddaclebusinessPleaseaddaclearbusinesstemplatePPleaseaddaclearbusinesstemplateforthetitle PART 03
单击添加标题 PleaseaddaclearbusinesstemplateforthetitlecontentyouwanttoaddPleaseaddaclebusinessPleaseaddaclearbusinesstemplatePPleaseaddaclearbusinesstemplateforthetitle PART 04