Kaizen SMT_MI_PCBA for Quality Engineerspptx

Please go through Kaizen

1. Kaizen-1 BEFORE AFTER Before Condition : Components damage due to deep line partition, causing disruption in handling and flow of line. After Condition : After line partition removal we found control on component damage due to mishandling and striking to it. Benefit: No component damage, No production hamper, Smooth flow of line.

2. Kaizen-2 BEFORE AFTER Before Condition : Lead uplift/less solder at T3 & TR1 Less solder found due to part issue asymmetric lead length causing dry in leads. After Condition : Stencil was upgraded to 4mils to 8 mils in order to paste enough solder on pads. After upgrading stencil solderibiliity of the component improved Benefit: Good Solder ability, No such case related TR1 and T3

3. Kaizen-3 BEFORE AFTER 1. 2. Before Condition : Label issue Wrong year generation on RAC card. Wrongly printed TPN on RFPC. After Condition : Variable “YY” in E-label has been fetched with the L-label instead of default fetching by the current system time. Manual Re-print has been disabled and TPN has been fetched with USN through MES. (PIC2. ). Benefit: Minimum manual interpretation, No duplicate SN, No wrong year generation, Actual TPN print on label.

4. Kaizen-4 BEFORE AFTER Manual Mounting Before Condition: IC Mishandling Prior there was no tray to mount IC (U90), the operator used to mount it manually. Due to manual mounting we faced several defects such as shifting, wrong polarity, shorting etc. After Condition : IC tray has been applied to mount the ICs. Mishandling defect reduced at the location U90. Benefit: Minimum manual interpretation, No reverse polarity, shifting, shorting, uplift defects reduced

5. Kaizen-5 BEFORE AFTER Before Condition: 1 . No/Wrong identification of NG cards, pasting of blank label to write the defect. After Condition : Applied NC identification tag to identify the NG cards in SMT and Testing line. Benefit: Time saved to identify and Traceability improved.

6. Kaizen-6 BEFORE AFTER NA Before Condition: No proper fixture spare parts track record and minimum OK spare parts maintenance. After Condition : Extra OK parts for testing jigs are maintained by Testing Team also they are maintaining material replacement record to avoid production loss. Benefit: Improve productivity and minimized the down time.

7. Kaizen-1 BEFORE AFTER Before Condition: 1. Previously Humidity and Temperature was monitored in hygrometer. After Condition : 1. Digital screening and online data logger of Temperature and humidity in SMT floor to monitor real-time status of Temperature and Humidity. Benefit: Transparency in Temperature and Humidity monitoring, real-time monitoring of Temperature and Humidity.

8. Kaizen-2 BEFORE AFTER Before Condition : 1. Previously leads were trimmed without hood leading to stuck in PCBAs After Condition : No w excess leads are being trimmed under glass hood. Benefit: No foreign trimmed lead in cards, Operator safety

9. Kaizen-3 BEFORE AFTER No specific stage defined for PDI Before Condition : 1. Previously PDI stage was not defined specifically, PDI was being done at packing stage. After Condition : 1. PDI stage has been defined to perform pre dispatch inspection. Benefit: Process improvement, No production hamper, safety of data

10. Kaizen-4 BEFORE AFTER Before Condition : 1. Previously boards were being stored on ESD FLOOR PALLET for rework. After Condition : 1. Now, racks are being used to store the PCBAs Benefit: Space utilization

11. Kaizen-6 BEFORE AFTER NA Before Condition: There was no cavity in wave pallet leading to part damage resulting in ADRV failure. After Condition : Cavity generated in wave pallet resulting improved yield. Benefit : Yield improved, failure decreased, TRC pending decreased

12. Kaizen-1 BEFORE AFTER NA Before Condition: 1. Previously mounting of droppage was not being monitored. After Condition : 1. Mounting of droppage is being monitored and controlled by QC. Benefit: wastage decreased, rework minimized.

13. Kaizen-2 BEFORE AFTER Before Condition : Metal splicer not in system. Machine doesn’t halt while reloading with tape slicing due to which unverified spools parts may be mounted. After Condition : Metal splicer is being used to mount spare parts. Due to metal splicer application re-verification of the re-loaded spools are done, eliminating wrong loading occurrence. Reloading spools with spare parts will make mounter to ask for reverification. Benefit: Eliminates wrong loading problem, quality process improvement, double verification of reloaded reels.

14. Kaizen-3 BEFORE AFTER SMT OQC stage was before routing SMT OQC stage has been reframed after routing. Before Condition : 1. SMT OQC stage was before routing. After Condition : 1. SMT OQC stage has been reframed after routing. Benefit: Improved testing yield, rejection inventory decreased, feedback system improved, quality improvement

15. Kaizen-4 BEFORE AFTER At inspection table marking done to measure the lux level. Before Condition : 1. At IQC inspection table no area defined to measure the lux level. After Condition : At inspection table marking done to measure the lux level. Benefit : standardization of process, Time saving in making observations

16. Kaizen-1 BEFORE AFTER Not in previous system Before Condition : Previously there was no scanning of feeders by IPQC. After Condition : IPQC scans the mounters with auto feeder scanner every 4 hour. (refer sheet 1. for process information) Benefit : Prevention of wrong loading, Quality improvement

17. Kaizen-2 BEFORE AFTER Before Condition : Fuse sleeve Sizes were coming out different in manual cutting due to which the sleeve on the fuse was not proper After Condition : We took a pipe roll and cut it to the size of the sleeve from 34.00mm to 34.50mm and made the size perfect. Benefit : UPH & Sleeve Size improvement

18. Kaizen-3 BEFORE AFTER Before Condition – Pre forming stage Manually two manpower done bend and cutting process. Component (GDT fuse) bending and cutting not proper. After Condition : Pre forming stage Auto cutting machine implemented for GDT fuse bending and cutting to improvement. Benefit : UPH and product Quality improvement.

19. Kaizen- 4 BEFORE AFTER Before Condition : Touch up and after wave solder all sharp edge uncovered. PCBA hit on sharp edge during movement cause Component or connector damge After Condition : sharp edge covered by ESD foam to prevent the component or connector damge issue in MI line Benefit : improve and Control the component damge and connectors damage Defect in MI line.

20. Kaizen-5 BEFORE AFTER Before Condition : Reprint tool unlocked. After Condition : Reprint tool has been password protected also reprint record has been implemented. Benefit: No duplicity in label printing process, reprint process transparency Reprint record