List of AMD Ryzen processors 9oooooooiiiiii

Amd Processor Details

1. List of AMD Ryzen processors
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7,
Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an
unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of
Zen 2 based mobile Ryzen.
Common features of Ryzen 1000 desktop CPUs:
Socket: AM4.
All the CPUs support DDR4-2666 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Node/fabrication process: GlobalFoundries 14 LP.
Branding and Model
Cores
(threads)
Thermal solution
Clock rate (GHz)
L3
cache
(total)
TDP
Core
config
[i]
Release
date
Base
PBO
1–2
(≥3)
XFR
[1]
1–2
Ryzen
7
1800X (https://www.amd.com/en/product/1221)
8 (16)
Wraith Max (OEM
only)
3.6
4.0
(3.7)
4.1
16 MB
95 W
2 × 4
March 2, 2017
PRO 1700X (https://www.amd.com/en/product/2
011)
Wraith Spire
3.4
3.8
(3.5)
3.9
June 29, 2017
1700X (https://www.amd.com/en/product/1226)
Wraith Max (OEM
only)
March 2, 2017
PRO 1700 (https://www.amd.com/en/product/20
16)
Wraith Spire
3.0
3.7
(3.2)
3.75 65 W
June 29, 2017
1700 (https://www.amd.com/en/product/1216)
Wraith Spire LED
(retail)
Wraith Spire (OEM)
March 2, 2017
Ryzen
5
1600X (https://www.amd.com/en/product/1246)
6 (12)
Wraith Max (OEM
only)
3.6
4.0
(3.7)
4.1 95 W
2 × 3
April 11, 2017
PRO 1600 (https://www.amd.com/en/product/20
21)
Wraith Spire
3.2
3.6
(3.4)
3.7
65 W
June 29, 2017
1600 (https://www.amd.com/en/product/1241)
April 11, 2017
1500X (https://www.amd.com/en/product/1236)
4 (8)
3.5
3.7
(3.6)
3.9
2 × 2
PRO 1500 (https://www.amd.com/en/product/20
26)
June 29, 2017
1400 (https://www.amd.com/en/product/1231)
Wraith Stealth
3.2
3.4
(3.4)
3.45
8 MB
April 11, 2017
Ryzen
3
1300X (https://www.amd.com/en/product/2041)
4 (4)
3.5
3.7
(3.5)
3.9
July 27, 2017
PRO 1300 (https://www.amd.com/en/product/20
31)
Wraith Spire June 29, 2017
PRO 1200 (https://www.amd.com/en/product/20
36)
3.1
3.4
(3.1)
3.45
1200 (https://www.amd.com/en/product/2046) Wraith Stealth July 27, 2017
i. Core Complexes (CCX) × cores per CCX
Common features of Ryzen 1000 HEDT CPUs:
Socket: TR4.
All the CPUs support DDR4-2666 in quad-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Desktop processors
Ryzen 1000 series
Summit Ridge (1000 series, Zen based)
Whitehaven (Threadripper 1000 series, Zen based)

2. No integrated graphics.
Node/fabrication process: GlobalFoundries 14LP.
Branding and Model
Cores
(threads)
Clock rate (GHz)
L3 cache
(total)
TDP Chiplets
Core
config
[i]
Release
date
MSRP
Base
PBO
1–4
(≥5)
XFR
[1]
1–2
Ryzen
Threadripper
1950X (https://www.amd.com/en/product/20
66)
16 (32) 3.4
4.0
(3.7)
4.2
32 MB
180 W
2 ×
CCD
[ii]
4 × 4
Aug 31,
2017
US
$999
1920X (https://www.amd.com/en/product/20
61)
12 (24) 3.5 4 × 3
US
$799
1900X (https://www.amd.com/en/product/30
11)
8 (16) 3.8
4.0
(3.9)
16 MB 2 × 4
US
$549
i. Core Complexes (CCX) × cores per CCX
ii. Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.
Common features of Ryzen 2000 desktop APUs:
Socket: AM4.
All the CPUs support DDR4-2933 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 14LP.
Branding and Model
CPU GPU
TDP
Release
date
MSRP
Cores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Model
Clock
(GHz)
Config
[i]
Processing
power
(GFLOPS)
[ii]
BaseBoost
Ryzen
5
2400G (https://www.amd.com/e
n/product/7221)
[a]
4 (8)
3.6 3.9
4 MB
RX Vega
11
1.25
704:44:16
11 CU
1760
46‑65 WFeb 12, 2018
US
$169
2400GE (https://www.amd.com/
en/product/7651)
[a]
3.2 3.8 35 W Apr 19, 2018OEM
Ryzen
3
2200G (https://www.amd.com/e
n/product/7226)
[a]
4 (4)
3.5 3.7
Vega 8 1.1
512:32:16
8 CU
1126
46‑65 WFeb 12, 2018US $99
2200GE (https://www.amd.com/
en/product/7646)
[a]
3.2
3.6
35 W
Apr 19, 2018
OEM
PRO 2100GE
[2]
2 (4) — Vega 3 1.0
192:12:4
3 CU
[3] 384 2019
i. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
ii. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. Model also available as PRO version; 2200GE (https://www.amd.com/en/product/7781), 2200G (https://www.amd.com/en/product/7776),
2400GE (https://www.amd.com/en/product/7786), 2400G (https://www.amd.com/en/product/7771), released on May 14, 2018 for OEM only.
[4]
Common features of Ryzen 2000 desktop CPUs:
Socket: AM4.
All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E and R5 2600E which support it at DDR4-2666 speeds.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: GlobalFoundries 12LP (14LP+).
Ryzen 2000 series
Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)
Pinnacle Ridge (2000 series, Zen+ based)

3. Branding and Model
Cores
(threads)
Thermal Solution
Clock rate
(GHz)
L3
cache
(total)
TDP
Core
config
[i]
Release
date
MSRP
Base PB2
Ryzen
7
2700X (https://www.amd.com/en/product/765
6)
[a]
8 (16)
Wraith Prism 3.7 4.3
16 MB
105 W
2 × 4
Apr 19,
2018
US
$329
2700 (https://www.amd.com/en/product/766
1)
[a]
Wraith Spire (LED) 3.2 4.1 65 W
US
$299
2700E (https://www.amd.com/en/product/826
6)
OEM 2.8 4.0 45 W
Sep 19,
2018
OEM
Ryzen
5
2600X (https://www.amd.com/en/product/767
1)
6 (12)
Wraith Spire (non
LED)
3.6 4.2 95 W
2 × 3
Apr 19,
2018
US
$229
2600 (https://www.amd.com/en/product/766
6)
[a] Wraith Stealth 3.4 3.9 65 W
US
$199
2600E (https://www.amd.com/en/product/826
1)
OEM 3.1 4.0 45 W
Sep 19,
2018
OEM
1600 (AF) (https://www.amd.com/en/product/9
121)
[b] Wraith Stealth 3.2 3.6
65 W
Oct 11,
2019
US $85
2500X (https://www.amd.com/en/product/821
6)
4 (8)
OEM
3.6
4.0
8 MB 1 × 4
Sep 10,
2018
OEM
Ryzen
3
2300X (https://www.amd.com/en/product/822
1)
4 (4)
3.5
1200 (AF)
[8][b]
Wraith Stealth 3.1 3.4
Apr 21,
2020
US $60
i. Core Complexes (CCX) × cores per CCX
a. Model also available as PRO version as 2600
[5]
, 2700
[6]
, 2700X
[7]
, released on September 19, 2018.
b. AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200
[9]
and 1600
[10]
with "AF" suffixes).
Common features of Ryzen 2000 HEDT CPUs:
Socket: TR4.
All the CPUs support DDR4-2933 in quad-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model
Cores
(threads)
Clock rate (GHz)
L3 cache
(total)
TDPChiplets
Core
config
[i]
Release
date
MSRP
Base PB2
Ryzen
Threadripper
2990WX
[11]
32 (64)
3.0 4.2 64 MB 250 W4 × CCD
8 × 4Aug 13, 2018US $1799
2970WX
[12]
24 (48) 8 × 3 Oct 2018 US $1299
2950X
[13]
16 (32)
3.5
4.4
32 MB 180 W2 × CCD
4 × 4Aug 31, 2018US $899
2920X
[14]
12 (24) 4.3 4 × 3 Oct 2018 US $649
i. Core Complexes (CCX) × cores per CCX
Common features of Ryzen 3000 desktop APUs:
Socket: AM4.
All the CPUs support DDR4-2933 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 12LP (14LP+).
Colfax (Threadripper 2000 series, Zen+ based)
Ryzen 3000 series
Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

4. Branding and Model
CPU GPU
TDP
Release
date
MSRP
Cores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Model
Clock
(GHz)
Config
[i]
Processing
power
(GFLOPS)
[ii]
BaseBoost
Ryzen
5
PRO 3400G (https://www.amd.co
m/en/product/8876)
4 (8)
3.7 4.2
4 MB
Radeon
RX Vega 11
1.4
704:44:8
11 CU
1971.2 65 W
Sep 30, 2019 OEM
3400G (https://www.amd.com/e
n/product/8476)
[15] Jul 7, 2019US $149
PRO 3400GE (https://www.amd.c
om/en/product/8886)
3.3
4.0 1.3
1830.4 35 WSep 30, 2019
OEM
PRO 3350G (https://www.amd.co
m/en/product/10271)
3.6
Radeon
Vega 10
640:40:8
10 CU
1664 65 W
Jul 21, 2020
PRO 3350GE (https://www.amd.c
om/en/product/10276)
4 (4)
3.3 3.9 1.2 1536 35 W
Ryzen
3
PRO 3200G (https://www.amd.co
m/en/product/8881)
3.6 4.0
Radeon
Vega 8
1.25
512:32:8
8 CU
1280 65 W
Sep 30, 2019
3200G (https://www.amd.com/e
n/product/8481)
[15]
Jul 7, 2019 US $99
3200GE (https://www.amd.com/e
n/product/8996)
3.3 3.8 1.2 1228.8 35 W
Jul 7, 2019
OEM
PRO 3200GE (https://www.amd.c
om/en/product/8891)
Sep 30, 2019
i. Unified shaders : Texture mapping units : Render output units and Compute units (CU)
ii. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Common features of Ryzen 3000 desktop CPUs:
Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Matisse (3000 series, Zen 2 based)

5. Branding and Model
Cores
(threads)
Thermal
Solution
Clock rate
(GHz)
L3
cache
(total)
TDP Chiplets
Core
config
[i]
Release
date
MSRP
BaseBoost
Ryzen
9
3950X (http
s://www.amd.
com/en/prod
uct/8486)
16 (32)
N/A
3.5
4.7
64 MB
105 W
[ii]
2 × CCD
1 × I/OD
4 × 4 Nov 25, 2019US $749
3900XT (http
s://www.amd.
com/en/prod
uct/9931)
12 (24)
3.8
4 × 3
Jul 7, 2020
US $499
3900X (http
s://www.amd.
com/en/prod
uct/8436)
Wraith
Prism
4.6 Jul 7, 2019
3900 (https://
www.amd.co
m/en/produc
t/8931)
[a]
OEM 3.1 4.3 65 W Oct 8, 2019 OEM
Ryzen
7
3800XT (http
s://www.amd.
com/en/prod
uct/9941)
8 (16)
N/A
3.9
4.7
32 MB
105 W
1 × CCD
1 × I/OD
2 × 4
Jul 7, 2020
US $399
3800X (http
s://www.amd.
com/en/prod
uct/8441)
Wraith
Prism
4.5
Jul 7, 2019
3700X (http
s://www.amd.
com/en/prod
uct/8446)
[a]
3.6 4.4 65 W
[iii]
US $329
Ryzen
5
3600XT (http
s://www.amd.
com/en/prod
uct/9936)
6 (12)
N/A
3.8
4.5
95 W
2 × 3
Jul 7, 2020
US $249
3600X (http
s://www.amd.
com/en/prod
uct/8451)
Wraith
Spire
(non-LED)
4.4
Jul 7, 2019
3600 (https://
www.amd.co
m/en/produc
t/8456)
[a]
Wraith
Stealth
3.6
4.2
65 W
US $199
3500X (http
s://www.amd.
com/zh-han
s/product/89
26)
[17]
6 (6) 4.1
Oct 8, 2019
China
¥1099
3500 (https://
www.amd.co
m/en/produc
t/8981)
OEM
16 MB
Nov 15, 2019
OEM
(West)
Japan
¥16000
[18]
Ryzen
3
3300X (http
s://www.amd.
com/en/prod
uct/12661)
4 (8)
Wraith
Stealth
3.8 4.3 1 × 4
Apr 21, 2020
US $119
3100 (https://
www.amd.co
m/en/produc
t/9676)
3.6 3.9 2 × 2 US $99
i. Core Complexes (CCXs) × cores per CCX
ii. Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.
[16]
iii. Ryzen 7 3700X may consume over 90 W under load.
[16]

6. a. Model also available as PRO 3600 (https://www.amd.com/en/product/8866), PRO 3700 (https://www.amd.com/en/product/8871), PRO 3900 (ht
tps://www.amd.com/en/product/8861), released on September 30, 2019 for OEMs.
Common features of Ryzen 3000 HEDT/workstation CPUs:
Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link
to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Branding and Model
Cores
(threads)
Clock rate
(GHz)
L3
cache
(total)
TDPChiplets
Core
config
[i]
Release
date
MSRP
BaseBoost
Ryzen
Threadripper
PRO
3995WX (https://www.am
d.com/en/product/10181)
64 (128)2.7
4.2
256 MB
280 W
[ii]
8 × CCD
1 × I/OD
16 × 4
Jul 14,
2020
3975WX (https://www.am
d.com/en/product/10176)
32 (64) 3.5 128 MB
4 × CCD
1 × I/OD
8 × 4
3955WX (https://www.am
d.com/en/product/10186)
16 (32) 3.9
4.3
64 MB
2 × CCD
1 × I/OD
4 × 4
3945WX (https://www.am
d.com/en/product/10191)
12 (24) 4.0 4 × 3
Ryzen
Threadripper
3990X (https://www.amd.
com/en/product/9111)
64 (128)2.9 256 MB
8 × CCD
1 × I/OD
16 × 4
Feb 7,
2020
US
$3990
3970X (https://www.amd.
com/en/product/8941)
32 (64) 3.7
4.5 128 MB
4 × CCD
1 × I/OD
8 × 4
Nov 25,
2019
US
$1999
3960X (https://www.amd.
com/en/product/8946)
24 (48) 3.8 8 × 3
US
$1399
i. Core Complexes (CCXs) × cores per CCX
ii. Ryzen Threadripper 3990X may consume over 490 W under load.
[19]
Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:
Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Bundled with AMD Wraith Stealth
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and
provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective
chip stock.
[20][21][22]
Branding and model
Cores
(threads)
Clock rate
(GHz)
L3
cache
(total)
TDP
Core
config
[i]
Release
date
MSRP
BaseBoost
AMD
4800S
[20][21]
8 (16) 4.0
8 MB
2 × 4
2022
bundled with desktop
kit4700S (https://www.amd.com/en/desktop-kits/amd-4700
s)
[22]
3.6
75 W 2021
Ryzen
5
4500 (https://www.amd.com/en/product/11816) 6 (12) 4.1
65 W
2 × 3
Apr 4, 2022
US $129
Ryzen
3
4100 (https://www.amd.com/en/product/11821) 4 (8) 3.8 4.0 4 MB 1 × 4 US $99
Castle Peak (Threadripper 3000 series, Zen 2 based)
Ryzen 4000 series
Renoir (4000 series, Zen 2 based)

7. i. Core Complexes (CCX) × cores per CCX
Common features of Ryzen 4000 desktop APUs:
Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.
Branding and model
CPU GPU
TDP
Release
date
Release
priceCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
Config
[i]
Model
Clock
(GHz)
Config
[ii]
Processing
power
[iii]
(GFLOPS)
BaseBoost
Ryzen
7
4700G (https://www.amd.c
om/en/product/10196)
[a]
8 (16)
3.6 4.4
8 MB
2 × 4
Radeon
Graphics
[b]
2.1
512:32:16
8 CU
2150.4 65 W
Jul 21,
2020
OEM
4700GE (https://www.am
d.com/en/product/1021
1)
[a]
3.1 4.3 2.0 2048 35 W
Ryzen
5
4600G (https://www.amd.c
om/en/product/1020
1)
[a][23]
6 (12)
3.7
4.2 2 × 3 1.9
448:28:14
7 CU
1702.4
65 W
Jul 21,
2020
(OEM) /
Apr 4,
2022
(retail)
OEM /
US $154
4600GE (https://www.am
d.com/en/product/1021
6)
[a]
3.3 35 W
Jul 21,
2020
OEM
Ryzen
3
4300G (https://www.amd.c
om/en/product/10206)
[a]
4 (8)
3.8
4.0 4 MB 1 × 4 1.7
384:24:12
6 CU
1305.6
65 W
4300GE (https://www.am
d.com/en/product/1022
1)
[a]
3.5 35 W
i. Core complexes (CCXs) × cores per CCX
ii. Unified shaders : Texture mapping units : Render output units and Compute units (CU)
iii. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. Model also available as PRO version as 4350GE,
[24]
4350G,
[25]
4650GE,
[26]
4650G,
[27]
4750GE,
[28]
4750G,
[29]
released on July 21, 2020 for
OEM only.
[30]
b. All of the iGPUs are branded as AMD Radeon Graphics.
Common features of Ryzen 5000 desktop CPUs:
Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)
Ryzen 5000 series
Vermeer (5000 series, Zen 3 based)

8. Branding and model
Cores
(threads)
Thermal
solution
Clock rate
(GHz)
L3
cache
(total)
TDPChiplets
Core
config
[i]
Release
date
MSRP
BaseBoost
Ryzen
9
5950X (https://www.amd.com/en/pro
duct/10456)
16 (32)
—
3.4 4.9
64 MB
105 W
2 × CCD
1 × I/OD
2 × 8
Nov 5, 2020
US $799
5900X (https://www.amd.com/en/pro
duct/10461)
12 (24)
3.7 4.8
2 × 6
US $549
5900 (https://www.amd.com/en/prod
uct/10796)
3.0 4.7 65 W
Jan 12, 2021
OEM
PRO 5945 (https://www.amd.com/en/
product/12181)
Sep 2022
[31]
Ryzen
7
5800X3D (https://www.amd.com/en/p
roduct/11576)
8 (16)
3.4 4.5 96 MB
105 W
1 × CCD
1 × I/OD
1 × 8
Apr 20, 2022
US $449
5800X (https://www.amd.com/en/pro
duct/10466)
3.8 4.7
32 MB
Nov 5, 2020
5800 (https://www.amd.com/en/prod
uct/10791)
3.4 4.6 65 W Jan 12, 2021 OEM
5700X3D (https://www.amd.com/en/p
roduct/14101)
3.0 4.1 96 MB105 W Jan 31, 2024
[32]
US $249
5700X (https://www.amd.com/en/pro
duct/11826)
3.4 4.6 32 MB 65 W
Apr 4, 2022 US $299
PRO 5845 (https://www.amd.com/en/
product/12176)
Sep 2022 OEM
Ryzen
5
5600X3D (https://www.amd.com/en/p
roduct/13541)
6 (12)
3.3 4.4 96 MB105 W
1 × 6
Jul 7, 2023
US Only
[33] US $229
[34]
5600X (https://www.amd.com/en/pro
duct/10471)
Wraith
Stealth
3.7 4.6
32 MB 65 W
Nov 5, 2020 US $299
5600 (https://www.amd.com/en/prod
uct/11831)
3.5 4.4 Apr 4, 2022 US $199
PRO 5645 (https://www.amd.com/en/
product/12186)
— 3.7 4.6 Sep 2022 OEM
i. Core Complexes (CCX) × cores per CCX
Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:
Socket: AM4.
CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Branding and model
Cores
(threads)
Thermal
solution
Clock rate
(GHz)
L3
cache
(total)
TDP
Core
config
[i]
Release
date
MSRP
(USD)
BaseBoost
Ryzen 7
5700 (https://www.amd.com/en/product/1392
6)
[35] 8 (16)
Wraith
Stealth
3.7 4.6
16 MB
65 W
1 × 8
Apr 4, 2022 (OEM),
Dec 21, 2023
(retail)
$179
Ryzen 55500 (https://www.amd.com/en/product/11811) 6 (12) 3.6
4.2
1 × 6 Apr 4, 2022 $159
Ryzen 35100
[36][37][38]
4 (8) – 3.8 8 MB 1 × 4 2023 OEM
i. Core Complexes (CCX) × cores per CCX
Common features of Ryzen 5000 desktop APUs:
Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.
Cezanne (5000 series, Zen 3 based)
Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

9. Branding and model
CPU GPU
[a]
Thermal
solution
TDP
Release
date
MSRP
Cores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i]
Clock
(MHz)
Config
[ii]
Processing
power
[iii]
(GFLOPS)
BaseBoost
Ryzen
7
5700G (https://www.a
md.com/en/product/11
171)
[b]
8 (16)
3.8
4.6
16 MB
1 × 8 2000
512:32:8
8 CU
2048
Wraith
Stealth
65 W
Apr 13,
2021 (OEM),
Aug 5,
2021 (retail)
US $359
5700GE (https://www.a
md.com/en/product/11
186)
[b]
3.2 35 W Apr 13, 2021 OEM
Ryzen
5
5600GT (https://www.a
md.com/en/product/14
051)
6 (12)
3.6
1 × 6 1900
448:28:8
7 CU
1702.4
65 W
Jan 31,
2024
[39]
US $140
5600G (https://www.a
md.com/en/product/11
176)
[b]
3.9
4.4
Apr 13,
2021 (OEM),
Aug 5,
2021 (retail)
US $259
5600GE (https://www.a
md.com/en/product/11
191)
[b]
3.4 35 W Apr 13, 2021 OEM
5500GT (https://www.a
md.com/en/product/14
056)
3.6
65 W
Jan 31,
2024
[39] US $125
Ryzen
3
5300G (https://www.a
md.com/en/product/11
181)
[b]
4 (8)
4.0
4.2 8 MB 1 × 4 1700
384:24:8
6 CU
1305.6 OEM Apr 13, 2021 OEM
5300GE (https://www.a
md.com/en/product/11
196)
[b]
3.6 35 W
i. Core Complexes (CCX) × cores per CCX
ii. Unified shaders : texture mapping units : render output units and compute units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. All of the iGPUs are branded as AMD Radeon Graphics.
b. Model also available as PRO version as 5350GE,
[40]
5350G,
[41]
5650GE,
[42]
5650G,
[43]
5750GE,
[44]
5750G,
[45]
released June 1, 2021.
[46]
Common features of Ryzen 5000 workstation CPUs:
Socket: sWRX8.
All the CPUs support DDR4-3200 in octa-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Branding and Model
Cores
(threads)
Clock rate (GHz)
L3 cache
(total)
TDPChiplets
Core
config
[i]
Release
date
MSRP
BaseBoost
Ryzen
Threadripper
PRO
5995WX (https://www.amd.com/en/product/11786)64 (128) 2.7
4.5
256 MB
280 W
8 × CCD
1 × I/OD
8 × 8
Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $6500
5975WX (https://www.amd.com/en/product/11791)32 (64) 3.6
128 MB
4 × CCD
1 × I/OD
4 × 8
Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $3300
5965WX (https://www.amd.com/en/product/11796)24 (48) 3.8 4 × 6
Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $2400
5955WX (https://www.amd.com/en/product/11801)16 (32) 4.0
64 MB
2 × CCD
1 × I/OD
2 × 8
Mar 8, 2022 OEM
5945WX (https://www.amd.com/en/product/11806)12 (24) 4.1 2 × 6
i. Core Complexes (CCX) × cores per CCX
Common features of Ryzen 7000 desktop CPUs:
Chagall (Threadripper 5000 series, Zen 3 based)
Ryzen 7000 series
Raphael (7000 series, Zen 4/RDNA2 based)

10. Socket: AM5.
All the CPUs support DDR5-5200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)
[i]
. Models with "F" suffixes
are without iGPUs.
Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Branding and model
Cores
(threads)
Clock rate
(GHz) L3 cache
(total)
Thermal
solution
Chiplets
Core
config
[ii]TDP
Release
date
MSRP
BaseBoost
Ryzen
9
7950X3D (https://www.amd.com/en/pr
oduct/12741)
16 (32)
4.2
5.7
128 MB
[iii]
—
2 × CCD
1 × I/OD
2 × 8
120 WFeb 28, 2023
US $699
7950X (https://www.amd.com/en/prod
uct/12151)
4.5 64 MB 170 WSep 27, 2022
7900X3D (https://www.amd.com/en/pr
oduct/12736)
12 (24)
4.4
5.6
128 MB
[iii]
2 × 6
120 WFeb 28, 2023US $599
7900X (https://www.amd.com/en/prod
uct/12156)
4.7
64 MB
170 WSep 27, 2022US $549
7900 (https://www.amd.com/en/produc
t/12746)
3.7 5.4
Wraith
Prism
65 W
Jan 10, 2023
US
$429
[49]
PRO 7945 (https://www.amd.com/en/pr
oduct/13496)
Wraith Spire Jun 13, 2023 OEM
Ryzen
7
7800X3D (https://www.amd.com/en/pr
oduct/12731)
8 (16)
4.2 5.0 96 MB
—
1 × CCD
1 × I/OD
1 × 8
120 W Apr 6, 2023 US $449
7700X (https://www.amd.com/en/prod
uct/12161)
4.5 5.4
32 MB
105 WSep 27, 2022US $399
7700 (https://www.amd.com/en/produc
t/12751)
3.8
5.3
Wraith
Prism
65 W
Jan 10, 2023
US
$329
[49]
PRO 7745 (https://www.amd.com/en/pr
oduct/13501)
Wraith Spire Jun 13, 2023 OEM
Ryzen
5
7600X (https://www.amd.com/en/prod
uct/12166)
6 (12)
4.7 —
1 × 6
105 WSep 27, 2022US $299
7600 (https://www.amd.com/en/produc
t/12756)
3.8 5.1
Wraith
Stealth
65 W
Jan 10, 2023
US
$229
[49]
PRO 7645 (https://www.amd.com/en/pr
oduct/13506)
Wraith Spire Jun 13, 2023 OEM
7500F (https://www.amd.com/en/produ
ct/13551)
3.7 5.0
Wraith
Stealth
Jul 22, 2023
US
$179
[50]
i. Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
ii. Core Complexes (CCX) × cores per CCX
iii. Only one of the two CCXes has additional 64 MB 3D V-Cache.
[47]
Only the CCX without 3D V-Cache will be able to reach the maximum boost
clocks. The CCX with 3D V-Cache will clock lower.
[48]
Common features of Ryzen 7000 HEDT/workstation CPUs:
Socket: sTR5.
Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode
with ECC support.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all
processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 5FF.
Storm Peak (Threadripper 7000 series, Zen 4 based)

11. Branding and model
Cores
(threads)
Clock rate
(GHz)
L3
cache
(total)
TDPChiplets
Core
config
[i]
Release
date
MSRP
BaseBoost
Ryzen
Threadripper
PRO
7995WX (https://www.am
d.com/en/product/1384
1)
[51]
96 (192)2.5
5.1
384 MB
350 W
12 ×
CCD
1 × I/OD
12 × 8
Nov 21,
2023
US
$9999
7985WX (https://www.am
d.com/en/product/1386
6)
[51]
64 (128)3.2 256 MB
8 × CCD
1 × I/OD
8 × 8
US
$7349
7975WX (https://www.am
d.com/en/product/1386
1)
[51]
32 (64) 4.0
5.3
128 MB
4 × CCD
1 × I/OD
4 × 8
US
$3899
7965WX (https://www.am
d.com/en/product/1385
6)
[51]
24 (48) 4.2 4 × 6
US
$2649
7955WX (https://www.am
d.com/en/product/1385
1)
[51]
16 (32) 4.5
64 MB
2 × CCD
1 × I/OD
2 × 8
US
$1899
7945WX (https://www.am
d.com/en/product/1384
6)
[51]
12 (24) 4.7 2 × 6
US
$1399
Ryzen
Threadripper
7980X (https://www.amd.c
om/en/products/cpu/amd-
ryzen-threadripper-7980
x)
[51]
64 (128)3.2 5.1 256 MB
8 × CCD
1 × I/OD
8 × 8
US
$4999
7970X (https://www.amd.c
om/en/products/cpu/amd-
ryzen-threadripper-7970
x)
[51]
32 (64) 4.0
5.3 128 MB
4 × CCD
1 × I/OD
4 × 8
US
$2499
7960X (https://www.amd.c
om/en/products/cpu/amd-
ryzen-threadripper-7960
x)
[51]
24 (48) 4.2 4 × 6
US
$1499
i. Core Complexes (CCXs) × cores per CCX
Common features of Ryzen 8000G desktop APUs:
Socket: AM5.
All the CPUs support DDR5-5200 RAM in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are
reserved as link to the chipset.
Includes integrated RDNA 3 GPU.
Includes XDNA AI Engine (Ryzen AI) on upper end models as indicated in table below.
Fabrication process: TSMC 4 nm FinFET.
Ryzen 8000 series
Phoenix (8000 series, Zen 4/XDNA based)
Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

12. Branding
and model
CPU GPU
NPU
Thermal
solution
TDP
Release
date
MSRP
Cores (threads)
Clock rate
(GHz) L3
cache
(total)
Core
config
[a]
Model
Clock
(GHz)
Total
Zen
4
Zen
4c
BaseBoost
Ryzen
7
8700G (https://www.
amd.com/en/produ
ct/14066)
[52]
8
(16)
8
(16)
—
4.2 5.1
16 MB
1 × 8
780M
12
CUs
2.9
Ryzen AI
Up to 16
TOPS
Wraith
Spire
65 W
Jan 31,
2024
US
$329
Ryzen
5
8600G (https://www.
amd.com/en/produ
ct/14071)
[52]
6
(12)
6
(12)
4.3 5.0 1 × 6
760M
8 CUs
2.8
Wraith
Stealth
US
$229
8500G (https://www.
amd.com/en/produ
ct/14086)
[52]
2 (4)4 (8)
4.1 /
3.2
[b]
5.0 /
3.7
[c] 2 + 4
740M
4 CUs
No
US
$179
Ryzen
3
8300G (https://www.
amd.com/en/produ
ct/14091)
[52]
4 (8)1 (2)3 (6)
4.0 /
3.2
[b]
4.9 /
3.6
[c] 8 MB 1 + 3 2.6
Jan 2024
(OEM) /
Q1 2024
(retail)
OEM /
TBA
a. Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
b. Zen 4 cores' base frequency / Zen 4c cores' base frequency
c. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency
Common features of Ryzen 2000 notebook APUs:
Socket: FP5.
The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 12 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 14LP.
Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i]Model
[a]Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen
7
2800H (https://www.amd.com/
en/product/8251)
4 (8)
3.3
3.8
4 MB
1 × 4
RX Vega 11
1.3
704:44:16
11 CUs
1830.4
35–
54 W
Sep 10, 2018
2700U (https://www.amd.com/
en/product/5306)
[b]
2.2 RX Vega 10
640:40:16
10 CUs
1664
12–
25 W
Oct 26, 2017
Ryzen
5
2600H (https://www.amd.com/
en/product/8256)
3.2
3.6 Vega 8
1.1
512:32:16
8 CUs
1126.4
35–
54 W
Sep 10, 2018
2500U (https://www.amd.com/
en/product/5311)
[b]
2.0
12–
25 W
Oct 26, 2017
Ryzen
3
2300U (https://www.amd.com/
en/product/7236)
[b]
4 (4)
3.4
Vega 6
384:24:8
6 CUs
844.8
Jan 8, 2018
2200U (https://www.amd.com/
en/product/7231)
2 (4) 2.5 1 × 2 Vega 3
192:12:4
3 CUs
422.4
i. Core Complexes (CCX) × cores per CCX
ii. Unified shaders : Texture mapping units : Render output units and Compute units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
b. Model also available as PRO version as 2300U (https://www.amd.com/en/product/7216), 2500U (https://www.amd.com/en/product/7211),
2700U (https://www.amd.com/en/product/7206), released on May 15, 2018.
Common features of Ryzen 3000 notebook APUs:
Socket: FP5.
Mobile processors
Ryzen 2000 series
Raven Ridge (Zen/GCN5 based)
Ryzen 3000 series
Dalí (Zen/GCN5 based)

13. All the CPUs support DDR4-2400 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 12 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 14LP.
Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i]Model
Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen
3
3250U (https://www.amd.com/en/pro
duct/9051)
2 (4) 2.6 3.5 4 MB 1 × 2
Vega
3
1.2
192:12:4
3 CUs
460.8
12–
25 W
Jan 6, 2020
3250C (https://www.amd.com/en/pro
ducts/apu/amd-ryzen-3-3250C)
Sep 22, 2020
3200U (https://www.amd.com/en/pro
ducts/apu/amd-ryzen-3-3200u)
Jan 6, 2019
i. Core Complexes (CCX) × cores per CCX
ii. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Common features of Ryzen 3000 notebook APUs:
Socket: FP5.
All the CPUs support DDR4-2400 in dual-channel mode.
L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate (GHz)
L3 cache
(total)
Core
config
[i] Model
Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen 7
3780U
[53]
4 (8)
2.3 4.0
4 MB 1 × 4
RX Vega 11
1.4
704:44:16
11 CU
1971.2 15 W Oct 2019
3750H
[54]
RX Vega 10
640:40:16
10 CU
[55] 1792.0
35 W Jan 6, 2019
3700C
[56]
15 W
Sep 22, 2020
3700U
[a][57]
Jan 6, 2019
Ryzen 5
3580U
[58]
2.1
3.7
Vega 9 1.3
576:36:16
9 CU
1497.6 Oct 2019
3550H
[59]
Vega 8
1.2
512:32:16
8 CU
[60]
1228.8
35 W Jan 6, 2019
3500C
[61]
15 W
Sep 22, 2020
3500U
[a][62]
Jan 6, 2019
3450U
[63]
3.5
Jun 2020
Ryzen 3
3350U
[64]
4 (4) Vega 6
384:24:8
6 CU
[65] 921.6
Jan 6, 2019
3300U
[a][66]
Jan 6, 2019
i. Core Complexes (CCX) × cores per CCX
ii. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. Model also available as PRO version
[67][68][69]
, released April 8, 2019.
Common features of Ryzen 4000 notebook APUs:
Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
Picasso (Zen+/GCN5 based)
Ryzen 4000 series
Renoir (Zen 2/GCN5 based)

14. L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.
Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i]Model
Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen
9
4900H (https://www.amd.com/en/
product/9651)
8 (16)
3.3 4.4
8 MB
2 × 4
Radeon
Graphics
[a]
1.75
512:32:8
8 CU
1792
35–
54 W
Mar 16, 2020
4900HS (https://www.amd.com/e
n/product/9206)
3.0 4.3 35 W
Ryzen
7
4800H (https://www.amd.com/en/
product/9081)
[70]
2.9 4.2 1.6
448:28:8
7 CU
1433.6
35–
54 W
4800HS (https://www.amd.com/e
n/product/10511)
35 W
4980U (https://www.amd.com/en/
product/11286)
[b]
2.0 4.4 1.95
512:32:8
8 CU
1996.8
10–
25 W
Apr 13, 2021
4800U (https://www.amd.com/en/
product/9091)
1.8 4.2 1.75 1792
Mar 16, 2020
4700U (https://www.amd.com/en/
product/9096)
[c] 8 (8) 2.0 4.1 1.6
448:28:8
7 CU
1433.6
Ryzen
5
4600H (https://www.amd.com/en/
product/9086)
[71]
6 (12)
3.0
4.0 2 × 3 1.5
384:24:8
6 CU
1152
35–
54 W
4600HS
[72]
35 W
4680U (https://www.amd.com/en/
product/11291)
[b]
2.1
448:28:8
7 CU
1344
10–
25 W
Apr 13, 2021
4600U (https://www.amd.com/en/
product/9116)
[c]
384:24:8
6 CU
1152
Mar 16, 2020
4500U (https://www.amd.com/en/
product/9101)
6 (6) 2.3
Ryzen
3
4300U (https://www.amd.com/en/
product/9106)
[c]
4 (4) 2.7 3.7 4 MB 1 × 4 1.4
320:20:8
5 CU
896
i. Core Complexes (CCX) × cores per CCX
ii. Unified shaders : texture mapping units : render output units and compute units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. All of the iGPUs are branded as AMD Radeon Graphics.
b. Only found on the Microsoft Surface Laptop 4.
c. Model also available as PRO version as 4450U,
[73]
4650U,
[74]
4750U,
[75]
released May 7, 2020.
Common features of Ryzen 5000 notebook APUs:
Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.
Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i]
Model
Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen
7
5700U (https://www.amd.com/en/
product/10846)
8 (16) 1.8 4.3
8 MB
2 × 4
Radeon
Graphics
[a]
1.9
512:32:8
8 CU
1945.6
10–
25 W
Jan 12, 2021
Ryzen
5
5500U (https://www.amd.com/en/
product/10856)
[76]
6 (12) 2.1 4.0 2 × 3 1.8
448:28:8
7 CU
1612.8
Ryzen
3
5300U (https://www.amd.com/en/
product/10861)
4 (8) 2.6 3.8 4 MB 1 × 4 1.5
384:24:8
6 CU
1152
i. Core Complexes (CCX) × cores per CCX
ii. Unified shaders : texture mapping units : render output units and compute units (CU)
Ryzen 5000 series
Lucienne (Zen 2/GCN5 based)

15. iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. All of the iGPUs are branded as AMD Radeon Graphics.
Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:
Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.
Branding and model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i] Model
Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen
9
5980HX (https://www.amd.com/
en/product/10801)
8 (16)
3.3
4.8
16 MB
1 × 8
Radeon
Graphics
[a]
2.1
512:32:8
8 CUs
2150.4
35–
54 W
Jan 12, 2021
5980HS (https://www.amd.com/
en/product/10806)
3.0 35 W
5900HX (https://www.amd.com/
en/product/10811)
3.3
4.6
35–
54 W
5900HS (https://www.amd.com/
en/product/10816)
3.0 35 W
Ryzen
7
5800H (https://www.amd.com/e
n/product/10821)
[77] 3.2
4.4
2.0 2048
35–
54 W
5800HS (https://www.amd.com/
en/product/10826)
2.8 35 W
5825U (https://www.amd.com/e
n/product/11601)
[b][c] 2.0 4.5 15 W Jan 4, 2022
5800U (https://www.amd.com/e
n/product/10841)
[b] 1.9 4.4
10–
25 W
Jan 12, 2021
Ryzen
5
5600H (https://www.amd.com/e
n/product/10831)
[87]
6 (12)
3.3
4.2
1 × 6
1.8
448:28:8
7 CUs
1612.8
35–
54 W
5600HS (https://www.amd.com/
en/product/10836)
3.0 35 W
5625U (https://www.amd.com/e
n/product/11631)
[b][c]
2.3
4.3 15 W Jan 4, 2022
5600U (https://www.amd.com/e
n/product/10851)
[b] 4.2
10–
25 W
Jan 12, 2021
5560U (https://www.amd.com/e
n/product/11876)
4.0
8 MB
1.6
384:24:8
6 CUs
1228.8
5500H (https://www.amd.com/e
n/product/13616)
4 (8)
3.3 4.2
1 × 4
1.8 1382.4
35–
54 W
Jun 23, 2023
Ryzen
3
5425U (https://www.amd.com/e
n/product/11611)
[b][c] 2.3 4.3
1.6 1228.8
15 W Jan 4, 2022
5400U (https://www.amd.com/e
n/product/10866)
[b][88]
2.7 4.1
10–
25 W
Jan 12, 2021
5125C (https://www.amd.com/e
n/product/11881)
2 (4) 3.0 — 1 × 2 1.2
192:12:8
3 CUs
460.8 15 W May 5, 2022
i. Core Complexes (CCX) × cores per CCX
ii. Unified shaders : texture mapping units : render output units and compute units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. All of the iGPUs are branded as AMD Radeon Graphics.
b. Model also available as PRO version as 5450U,
[78]
5650U,
[79]
5850U,
[80]
released on March 16, 2021 and as 5475U,
[81]
5675U,
[82]
5875U,
[83]
released on April 19, 2022.
c. Model also available as Chromebook optimized version as 5425C,
[84]
5625C,
[85]
5825C,
[86]
released on May 5, 2022.
Common features of Ryzen 6000 notebook APUs:
Socket: FP7, FP7r2.
Cezanne and Barceló (Zen 3/GCN5 based)
Ryzen 6000 series
Rembrandt (Zen 3+/RDNA2 based)

16. All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 4.0 lanes.
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC 6 nm FinFET.
Branding and model
CPU GPU
TDP
Release
dateCores
(threads)
Clock (GHz) L3
cache
(total)
Core
config
[i]Model
Clock
(GHz)
Config
[ii]
Processing
power
(GFLOPS)
[iii]
BaseBoost
Ryzen
9
6980HX (https://www.amd.com/en/pr
oduct/11531)
8 (16)
3.3
5.0
16 MB
1 × 8 680M
2.4
768:48:8
12 CUs
3686.4
45 W
Jan 4, 2022
[89]
6980HS (https://www.amd.com/en/pr
oduct/11536)
35 W
6900HX (https://www.amd.com/en/pr
oduct/11541)
[a]
4.9
45 W
6900HS (https://www.amd.com/en/pr
oduct/11561)
[a] 35 W
Ryzen
7
6800H (https://www.amd.com/en/prod
uct/11546)
[a]
3.2
4.7 2.2 3379.2
45 W
6800HS (https://www.amd.com/en/pr
oduct/11581)
[a] 35 W
6800U (https://www.amd.com/en/prod
uct/11591)
[a] 2.7
15–
28 W
Ryzen
5
6600H (https://www.amd.com/en/prod
uct/11551)
[a]
6 (12)
3.3
4.5 1 × 6 660M 1.9
384:24:8
6 CUs
1459.2
45 W
6600HS (https://www.amd.com/en/pr
oduct/11586)
[a] 35 W
6600U (https://www.amd.com/en/prod
uct/11596)
[a] 2.9
15–
28 W
i. Core Complexes (CCX) × cores per CCX
ii. Unified shaders : texture mapping units : render output units and compute units (CU)
iii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
a. Model also available as PRO version (6650U
[90]
, 6650H
[91]
, 6650HS
[92]
, 6850U
[93]
, 6850H
[94]
, 6850HS
[95]
, 6950H
[96]
, 6950HS
[97]
), released
on April 19, 2022.
The table below denotes the naming scheme for AMD's mobile CPU lineups starting with the 7000 series.
[98]
Portfolio
model number
Market segment Architecture Feature isolation (if needed) Form factor/TDP
7xxx -> 2023
8xxx -> 2024
9xxx -> 2025
etc.
x1xx -> Athlon Silver
x2xx -> Athlon Gold
x3xx -> Ryzen 3
x4xx -> Ryzen 3
x5xx -> Ryzen 5
x6xx -> Ryzen 5
x7xx -> Ryzen 7
x8xx -> Ryzen 7/9
x9xx -> Ryzen 9
There are some
exceptions, such as the
Ryzen 5 7235HS
xx1x -> Zen 1/1+
xx2x -> Zen 2
xx3x -> Zen 3/3+
xx4x -> Zen 4
xx5x -> Zen 5
etc.
xxx0 -> Lower model within segment
(variants may use 1-4)
xxx5 -> Upper model within segment
(variants may use 6-9)
HX -> 55W+ (Max Performance)
HS -> ~35W+ (Thin Gaming/Creator)
U -> 15-28W (Premium Ultrathin)
C -> 15-28W (Chromebook)
e -> 9W (Fanless variant of "U")
Common features of Ryzen 7020 notebook APUs:
Socket: FT6
All the CPUs support LPDDR5-5500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 4 PCIe 3.0 lanes.
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC 6 nm FinFET.
New naming scheme for future mobile processors
Ryzen 7000 series
Mendocino (7020 series, Zen 2/RDNA2 based)

17. Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[i]Model
Clock
(GHz)
Processing
power
[ii]
(GFLOPS)
BaseBoost
Ryzen
5
7520U (https://www.amd.com/en/prod
uct/12196)
[iii]
4 (8)
2.8 4.3
4 MB 1 × 4
610M
2 CU
1.9 486.4 15 WSeptember 20, 2022
[99]
Ryzen
3
7320U (https://www.amd.com/en/prod
uct/12201)
[iii] 2.4 4.1
i. Core Complexes (CCX) × cores per CCX
ii. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
iii. Model also available as Chromebook optimized version as 7520C
[100]
and 7320C
[101]
released on May 23, 2023
Common features of Ryzen 7030 notebook APUs:
Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7nm FinFET.
Branding and Model
CPU GPU
TDP
Release
dateCores
(threads)
Clock rate
(GHz)
L3
cache
(total)
Core
config
[a]Model
Clock
(GHz)
Processing
power
[b]
(GFLOPS)
BaseBoost
Ryzen
7
(PRO (https://www.amd.com/en/product/1298
6)) 7730U (https://www.amd.com/en/product/13
001)
8 (16)
2.0 4.5 16 MB
1 × 8
Vega
8 CU
2.0
2048
15 W
January 4, 2023
[102]
Ryzen
5
(PRO (https://www.amd.com/en/product/1299
1)) 7530U (https://www.amd.com/en/product/13
006)
6 (12) 1 × 6
Vega
7 CU
1792
Ryzen
3
(PRO (https://www.amd.com/en/product/1299
6)) 7330U (https://www.amd.com/en/product/13
011)
4 (8) 2.3 4.3 8 MB 1 × 4
Vega
6 CU
1.8 1382.4
a. Core Complexes (CCX) × cores per CCX
b. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Common features of Ryzen 7035 notebook APUs:
Socket: FP7, FP7r2.
All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 4.0 lanes.
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC 6 nm FinFET.
Barcelo-R (7030 series, Zen 3/GCN5 based)
Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

18. Branding and model
CPU GPU
TDP
Release
date
[103]Cores
(threads)
Clock (GHz) L3
cache
(total)
Core
config
[a]Model
Clock
(GHz)
Processing
power
[b]
(GFLOPS)BaseBoost
Ryzen
7
7735HS (https://www.amd.com/en/product/
12941)
8 (16)
3.2 4.75
16 MB
1 × 8
680M
12 CU
2.2 3379.2
35–
54 W
April 30, 2023
7735H (https://www.amd.com/en/product/1
3091)
7736U (https://www.amd.com/en/product/1
3086)
2.7
4.7
15–
28 W
January 4, 2023
7735U (https://www.amd.com/en/product/1
2951)
4.75
15–
30 W
7435HS (https://www.amd.com/en/product/
14301)
3.1 4.5 —
35–
54 W
2024
[104]
7435H (https://www.amd.com/en/product/1
4311)
Ryzen
5
7535HS (https://www.amd.com/en/product/
12946)
6 (12)
3.3
4.55 1 × 6
660M
6 CU
1.9 1459.2
April 30, 2023
7535H (https://www.amd.com/en/product/1
3096)
7535U (https://www.amd.com/en/product/1
2956)
2.9
15–
30 W
January 4, 2023
7235HS (https://www.amd.com/en/product/
14306)
4 (8)
3.2 4.2
8 MB 1 × 4
—
35–
53 W
2024
[105]
7235H (https://www.amd.com/en/product/1
4316)
Ryzen
3
7335U (https://www.amd.com/en/product/1
2961)
3.0 4.3
660M
4 CU
1.8 921.6
15–
30 W
January 4, 2023
a. Core Complexes (CCX) × cores per CCX
b. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Common features of Ryzen 7040 notebook APUs:
Socket: FP7, FP7r2, FP8.
All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes.
Includes integrated RDNA 3 GPU.
Includes XDNA AI Engine (Ryzen AI).
Fabrication process: TSMC 4 nm FinFET.
Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

19. Branding and model
CPU GPU
NPU TDP
Release
date
[106]Cores
(threads)
Clock (GHz) L3
cache
(total)
Core
config
[a]Model
Clock
(GHz)
BaseBoost
Ryzen
9
(PRO (https://www.amd.com/en/product/1346
6)) 7940HS (https://www.amd.com/en/product/
13036)
8 (16)
4.0 5.2
16 MB
1 × 8
780M
12 CU
2.8
Ryzen AI
Up to 10
TOPS
35–
54 W
April 30, 2023
[b]
7940H (https://www.amd.com/en/product/1306
6)
[c]
Ryzen
7
(PRO (https://www.amd.com/en/product/1347
1)) 7840HS (https://www.amd.com/en/product/
13041)
3.8
5.1 2.7
7840H (https://www.amd.com/en/product/1307
1)
[c]
(PRO (https://www.amd.com/en/product/1348
1)) 7840U (https://www.amd.com/en/product/1
3186)
3.3
15–
30 W
May 3, 2023
[b]
Ryzen
5
(PRO (https://www.amd.com/en/product/1347
6)) 7640HS (https://www.amd.com/en/product/
13046)
6 (12)
4.3 5.0
1 × 6
760M
8 CU
2.6
35–
54 W
April 30, 2023
[b]
7640H (https://www.amd.com/en/product/1307
6)
[c]
(PRO (https://www.amd.com/en/product/1348
6)) 7640U (https://www.amd.com/en/product/1
3196)
3.5
4.9
15–
30 W
May 3, 2023
[b]
(PRO (https://www.amd.com/en/product/1392
1)) 7545U (https://www.amd.com/en/product/1
3886)
3.2
2 + 4
740M
4 CU
2.8
No
November 2, 2023
(PRO (https://www.amd.com/en/product/1349
1)) 7540U (https://www.amd.com/en/product/1
3211)
1 × 6
2.5 May 3, 2023
[b]
Ryzen
3
7440U (https://www.amd.com/en/product/1321
6)
4 (8) 3.0 4.7 8 MB 1 + 3
a. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
b. PRO versions launched on 13 June 2023.
c. China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
Common features of Ryzen 7045 notebook CPUs:
Socket: FL1.
All the CPUs support DDR5-5200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes.
Includes integrated RDNA 2 GPU on the I/O die.
Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O and graphics die).
Branding and model
CPU GPU
TDP
Release
dateCores
(threads)
Clock (GHz) L3
cache
(total)
Chiplets
Core
config
[a]Model
Clock
(GHz)
BaseBoost
Ryzen
9
7945HX3D (https://www.amd.com/en/produc
t/13556)
16 (32)
2.3
5.4
128 MB
[i]
2 × CCD
1 × I/OD
2 × 8
610M
2 CU
2.2
55–
75 W
July 27, 2023
7945HX (https://www.amd.com/en/product/1
3016)
2.5
64 MB
February 28, 2023
[107]
7845HX (https://www.amd.com/en/product/1
3021)
12 (24) 3.0 5.2 2 × 6
45–
75 W
Ryzen
7
7745HX (https://www.amd.com/en/product/1
3026)
8 (16) 3.6 5.1
32 MB
1 × CCD
1 × I/OD
1 × 8
Ryzen
5
7645HX (https://www.amd.com/en/product/1
3031)
6 (12) 4.0 5.0 1 × 6
a. Core Complexes (CCX) × cores per CCX
i. Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost
clocks. The CCX with 3D V-Cache will clock lower.
Dragon Range (7045 series, Zen 4/RDNA2 based)
Ryzen 8000 series
Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

20. Common features of Ryzen 8040 notebook APUs:
Socket: FP7, FP7r2, FP8.
All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes.
Includes integrated RDNA 3 GPU.
Includes XDNA AI Engine (Ryzen AI).
Fabrication process: TSMC 4 nm FinFET.
Branding and model
CPU GPU
NPU TDP
Release
dateCores
(threads)
Clock (GHz) L3
cache
(total)
Core
config
[a]Model
Clock
(GHz)
BaseBoost
Ryzen
9
8945HS (https://www.amd.com/en/pr
oduct/13951)
8 (16)
4.0 5.2
16 MB
1 × 8
780M
12 CU
2.8
Ryzen AI
Up to 16
TOPS
35–
54 W
December 6, 2023
[108]
Ryzen
7
8845HS (https://www.amd.com/en/pr
oduct/13956)
3.8
5.1 2.7
8840HS (https://www.amd.com/en/pr
oduct/14016)
3.3
20–
30 W
8840U (https://www.amd.com/en/prod
uct/13966)
15–
30 W
Ryzen
5
8645HS (https://www.amd.com/en/pr
oduct/13961)
6 (12)
4.3 5.0
1 × 6
760M
8 CU
2.6
35–
54 W
8640HS (https://www.amd.com/en/pr
oduct/14021)
3.5
4.9
20–
30 W
8640U (https://www.amd.com/en/prod
uct/13971)
15–
30 W
8540U (https://www.amd.com/en/prod
uct/13976)
3.2 2 + 4
740M
4 CU
2.8
No
Ryzen
3
8440U (https://www.amd.com/en/prod
uct/13981)
4 (8) 3.0 4.7 8 MB 1 + 3 2.5
a. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
Common features of Ryzen Z1 handheld APUs:
Socket: FP7, FP7r2, FP8.
All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 20 PCIe 4.0 lanes.
Includes integrated RDNA 3 GPU.
Fabrication process: TSMC 4 nm FinFET.
Branding and model
CPU GPU
TDP
Release
dateCores
(threads)
Clock (GHz)
L3 cache
(total)
Core
config
[a]
Model
Clock
(GHz)
BaseBoost
Ryzen
Z1 Extreme (https://www.amd.com/en/product/13226)8 (16) 3.3 5.1
16 MB
1 × 8
780M
12 CU
2.7
9–30 WMay 2023
[109]
Z1 (https://www.amd.com/en/product/13221) 6 (12) 3.2 4.9 2 + 4
740M
4 CU
2.5
Handheld gaming PC processors
Ryzen Z1 series (Zen 4/RDNA3 based)

21. a. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
Model
Release
date
Fab
CPU GPU
Memory
support
TDP
Junction
temp.
range
(°C)
Cores
(threads)
Clock rate
(GHz)
Cache
ModelConfig
[i]Clock
(GHz)
Processing
power
(GFLOPS)
[ii]
BaseBoost L1 L2L3
V1202B (http
s://www.amd.c
om/en/product/
7291)
February
2018
GloFo
14LP
2 (4) 2.3 3.2
64 KB
inst.
32 KB
data
per core
512
KB
per
core
4
MB
Vega
3
192:12:16
3 CU
1.0 384
DDR4-
2400
dual-
channel
12–
25 W
0–105
V1404I (https://
www.amd.co
m/en/product/9
126)
December
2018
4 (8)
2.0 3.6
Vega
8
512:32:16
8 CU
1.1 1126.4 -40–105
V1500B (http
s://www.amd.c
om/en/product/
8496)
2.2 — —
0–105
V1605B (http
s://www.amd.c
om/en/product/
7281)
February
2018
2.0
3.6
Vega
8
512:32:16
8 CU
1.1 1126.4
V1756B (http
s://www.amd.c
om/en/product/
7276)
3.25
DDR4-
3200
dual-
channel
35–
54 W
V1780B (http
s://www.amd.c
om/en/product/
8491)
December
2018
3.35
—
V1807B (http
s://www.amd.c
om/en/product/
7271)
February
2018
3.8
Vega
11
704:44:16
11 CU
1.3 1830.4
i. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
ii. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Model
Release
date
Fab
CPU GPU
Memory
support
TDP
Cores
(threads)
Clock rate
(GHz)
Cache
ModelConfig
[i]Clock
(GHz)
Processing
power
(GFLOPS)
[ii]
BaseBoost L1 L2 L3
R1102G (https://www.a
md.com/en/product/922
6)
February
25, 2020
GloFo
14LP
2 (2) 1.2 2.6
64 KB
inst.
32 KB
data
per core
512
KB
per
core
4
MB
Vega
3
192:12:4
3 CU
1.0 384
DDR4-
2400
single-
channel
6 W
R1305G (https://www.a
md.com/en/product/922
1)
2 (4)
1.5 2.8
DDR4-
2400
dual-
channel
8-
10 W
R1505G (https://www.a
md.com/en/product/843
1)
April 16,
2019
2.4 3.3
12–
25 W
R1606G (https://www.a
md.com/en/product/842
6)
2.6 3.5 1.2 460.8
i. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
Embedded processors
1000 series
Great Horned Owl (V1000 series, Zen/GCN5 based)
Banded Kestrel (R1000 series, Zen/GCN5 based)

22. ii. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Model
Release
date
Fab
CPU GPU
Socket
PCIe
support
Memory
support
T
Cores
(threads)
Clock rate
(GHz)
Cache
Archi-
tecture
Config
[i]
Clock
(GHz)
Processing
power
[ii]
(GFLOPS)
BaseBoost L1 L2 L3
V2516
(http
s://w
ww.a
md.c
om/e
n/pro
duct/1
055
1)
[110]
November
10,
2020
[111]
TSMC
7FF
6 (12)
2.1 3.95
32 KB inst.
32 KB data
per core
512 KB
per core
8 MBGCN 5
384:24:8
6 CU
1.5 1152
FP6
20
(8+4+4+4)
PCIe 3.0
DDR4-
3200
dual-channel
LPDDR4X-
4266
quad-
channel
1
2
V2546
(http
s://w
ww.a
md.c
om/e
n/pro
duct/1
054
1)
[110]
3.0 3.95
3
5
V2718
(http
s://w
ww.a
md.c
om/e
n/pro
duct/1
054
6)
[110]
8 (16)
1.7 4.15
448:28:8
7 CU
1.6 1433.6
1
2
V2748
(http
s://w
ww.a
md.c
om/e
n/pro
duct/1
053
6)
[110]
2.9 4.25
3
5
i. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
ii. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Model
Release
date
Fab
CPU
Socket
PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache
BaseBoost L1 L2 L3
V3C14
[112][113]
September 27, 2022
[114]TSMC
7FF
4 (8)
2.3 3.8
32 KB inst.
32 KB data
per core
512 KB
per core
8 MB
FP7r2
20
(8+4+4+4)
PCIe 4.0
DDR5-4800
dual-channel
15 W
V3C44
[112][113]
3.5 3.8 45 W
V3C16
[112][113]
6 (12) 2.0 3.8
16 MB
15 W
V3C18I
[112][113]
8 (16)
1.9 3.8 15 W
V3C48
[112][113]
3.3 3.8 45 W
Common features of Ryzen Embedded 7000 series CPUs:
2000 series
Grey Hawk (V2000 series, Zen 2/GCN5 based)
River Hawk (R2000 series, Zen+ based)
3000 series
(V3000 series, Zen 3+ based)
7000 series
(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

23. Socket: AM5.
All the CPUs support ECC DDR5-5200 dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Processor
branding
Model
Cores
(threads)
Clock rate (GHz)
L3 cache
(total)
Chiplets
Core
config
[i]TDP
Release
date
BaseBoost
Ryzen
Embedded
7945 (https://www.amd.com/en/product/13891) 12 (24) 3.7 5.4 64 MB
2 × CCD
1 × I/OD
2 × 6
65 W
Nov 14, 2023
[115]
7745 (https://www.amd.com/en/product/13901)
8 (16)
3.8 5.3
32 MB
1 × CCD
1 × I/OD
1 × 8
7700X (https://www.amd.com/en/product/13911) 4.5 5.4 105 W
7645 (https://www.amd.com/en/product/13906)
6 (12)
3.8 5.1
1 × 6
65 W
7600X (https://www.amd.com/en/product/13916) 4.7 5.3 105 W
i. Core Complexes (CCX) × cores per CCX
Table of AMD processors
List of AMD Athlon processors
List of AMD processors with 3D graphics
List of AMD CPU microarchitectures
List of AMD chipsets
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