Magnetron sputtering

5,878 views 17 slides Dec 30, 2019
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In this presentation,
The author gives the working principle of the PVD and Sputtering methods. But you can also find an information about the thin film and plasma phase of a matter.
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Slide Content

Kutluhan Utku TÜMEN 2019 / 2020 MAGNETRON SPUTTERING

Thin Film Synthesis of Thin Films Plasma Physical Vapor Deposition Sputtering Method Magnetron Sputtering Content K.U.TÜMEN – 2019/2020 1

Thin Film K.U.TÜMEN – 2019/2020 2 A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The act of applying a thin film to a surface is  thin-film deposition  – any technique for depositing a thin film of material onto a substrate . It is useful in the manufacture of optics, electronics (layers of insulators, semiconductors, and conductors form integrated circuits), packaging (i.e., aluminium -coated PET film). https://en.wikipedia.org/wiki/Thin_film / https://www.avantes.com/solutions/thin-film 7 https://www.susumu.co.jp/germany/tech/know_how_02.php

Synthesis of Thin Films K.U.TÜMEN – 2019/2020 3 https://www.researchgate.net/figure/Classification-of-thin-film-deposition-methods_fig3_320849346

Plasma K.U.TÜMEN – 2019/2020 4 States of Matter - Solid - Liquid - Gas - Plasma https://www.nasa.gov/mission_pages/themis/auroras/sun_earth_connect.html

Physical Vapor Deposition K.U.TÜMEN – 2019/2020 5 https://en.wikipedia.org/wiki/Physical_vapor_deposition Deposition of a material in the vapor phase onto a solid in a vacuum. The coating method involves purely physical processes such as high-temperature vacuum evaporation with subsequent condensation, or plasma . Evaporated atoms travel through the evacuated space between the source and the sample and stick to the sample. Usually no chemical reactions take place . Carried out in a vacuum atmosphere . Used for thin and uniform coating or films .

Sputtering Method K.U.TÜMEN – 2019/2020 6 Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. First discovered in 1852, and developed as a thin film deposition technique by Langmuir in 1920. Metallic films : Al- alloys , Ti, Tantalum , Nickel , Cobalt , Gold , etc . https://www.sciencedirect.com/topics/chemical-engineering/reactive-sputtering Requirements : Vacuum , Inert gas , Power supply , Sputtering gas

Sputtering Method K.U.TÜMEN – 2019/2020 7 I onize an Ar ; or ionize an impurity atom, for example O, to generate O - (for Ar , always positive ion Ar + ) Ions are generated and directed at a target. The ions sputter targets atoms. The ejected atoms are transported to the substrate. Atoms condense and form a thin film. https://www.slideshare.net/HotLookingCoolGuy/sputtering-process

Sputtering Method K.U.TÜMEN – 2019/2020 8 https://www.slideshare.net/SandeepNair41/sputtering-60950269 Sputtered atoms have velocities of 3-6 E 5 cm/sec and energy of 10-40 eV .

Sputtering Yield K.U.TÜMEN – 2019/2020 9 https://www.slideshare.net/SandeepNair41/sputtering-60950269 Mass & Size of Atoms Molecule size – need to be about the same size as the sputtered material Energy of the Bombarding Ions Ion energy Vs. sputter yield : Direction In oblique angle (45º-90º) there is higher probability for sputtering, which occur closer to the surface.

K.U.TÜMEN – 2019/2020 10 https://en.wikipedia.org/wiki/Sputter_deposition Sputtering Method Applications Thin film deposition : - Microelectronics - Decorative coating - Protective coating Etching of targets : - Microelectronics patterning - CMOS, NMOS, PMOS fabrication Surface treatment : - Hardening Types of the Sputtering Deposition DC Diode Sputtering Magnetron Sputtering RF Sputtering Reactive Gas Sputtering Ion Beam Sputtering Pulse DC/AC Sputtering

K.U.TÜMEN – 2019/2020 11 https://www.physlab.org/wp-content/uploads/2016/04/Murtaza_presentaion.pdf Magnetron Sputtering Here magnets are used to increase the percentage of electrons that take part in ionization events, increase probability of electrons striking Ar , increase electron path length, so the ionization efficiency is increased significantly. Another reasons to use magnets: – Lower voltage needed to strike plasma. – Controls uniformity. – Reduce wafer heating from electron bombardment. – Increased deposition rate – Good control over reactive sputtering

Magnetron Sputtering K.U.TÜMEN – 2019/2020 12 https://www.dentonvacuum.com/products-technologies/magnetron-sputtering/ Magnetron sputtering is a highly versatile  thin film depositio n  technique for coating films with excellent adhesion and high density. A type of physical vapor deposition (PVD) coating technology, magnetron sputtering is a plasma-based coating process where a magnetically confined plasma is created near the surface of a target material. Positively charged energetic ions from the plasma collide with the negatively charged target material, and atoms from the target are ejected or “sputtered”, which then deposit on a substrate. (s trong electric and magnetic fields )

K.U.TÜMEN – 2019/2020 13 Magnetron Sputtering https://farotex.com/technology.html

Magnetron Sputtering K.U.TÜMEN – 2019/2020 14 The magnetron device has a dipole magnetic configuration to trap the electrons emitted at the cathode. In this way the excitation and ionization rates are enhanced, allowing the operation of the discharge at low pressures, below 10 -2 mbar. To create this dipole configuration, usually three rows of permanent magnets are arranged in the following order, N-S-N or S-N-S, that is, the inner row must have an opposite polarization in relation to the outer rows. On the balanced magnetrons, the magnets have the same strength. On the unbalanced magnetron the inner magnet is weakened. In this way, more electrons are lost to the plasma, resulting in an increase of the plasma length, towards the substrate. In this way, the substrate current increases dramatically, as well as the coating quality.

K.U.TÜMEN – 2019/2020 15 https://www.youtube.com/watch?v=ixx3ISj_kpg

THANK YOU FOR PARTICIPATING AND LISTENING K.U.TÜMEN – 2019/2020 16