Physical vapor deposition

1. By Muhammad Ali Asghar
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

2. Michael Faraday used PVD in 1838

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

3. Deposition
Applying a thin film on a surface ranges from nano
meters to micro meters.
Thin film is deposited on Substrates.
Different techniques are used for deposition PVD,
CVD, sputtering, electroplating & coating.

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

4. Physical vapor deposition
Physical coating process involve,
condensation & evaporation of material
PVD is used for high melting point & low
vapor pressure materials.
 PVD is carried out at high temperature and
vacuum.
 In contrary to PVD, CVD is a method in which
chemical adhesion or chemical deposition occurs.
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

5. High temperature
is required to
vaporize the material
Vacuum of different
ranges is used which
depends on the mean
free path required in
the system.

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

6. PVD methods are commonly used in followings:
Circuit & IC fabrications.
Aerospace in TBC & transparent coatings.
Reflectors and optics

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

7. Evaporative deposition
Electron beam vapor deposition
Pulsed laser deposition
Sputter deposition
Ion induced deposition
Cathode Arc Deposition
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

8. Evaporative deposition
Resistive heating method is used.
deposition is performed at high
temperature & low vacuum
Vacuum decreases the content
of Contamination
Voltage & current is manually
controlled.
Material is kept in boats.






MUHAMMAD ALI ASGHAR
VC&ML NINVAST

9. Resistive heating unit
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

10. Electron beam is generated
by tungsten filament.
Material is placed in
Graphite or tungsten crucible
Deposition mechanism is same
 deposition is carried out
under high vacuum.
Deposition is controlled, and
Uniform

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

11. MUHAMMAD ALI ASGHAR
VC&ML NINVAST

12. Pulsed laser deposition
High power laser is used for deposition.
Argon or neon is used for inert atmosphere.
High vacuum is formed
 laser is focused by lens, target decides the position of
the deposition .
MUHAMMAD ALI ASGHAR
VC&ML NINVAST

13. Sputter deposition
Sputtering works on the bases of momentum principle,
formed by the collision of the atoms and molecules.
Plasma glow, ion accelerator or radioactive emitting is
used to evaporate material.
 argon gas is used for inert atmosphere.

Types of sputtering
Chemical and etching sputtering
Electronic sputtering
Potential sputtering

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

14. In this process ions are deposited
on the substrates.
This process is used for IC
fabrication, micro circuit printing
nano printing or pattering . &
lithography.
It will be discussed in detail with
nano pattering.

MUHAMMAD ALI ASGHAR
VC&ML NINVAST

15. PVD advantages & Disadvantages
Environment friendly then
paint & electroplating.
 more than one PVD
technique can be used for
coating.
Usually topcoats are not
required.
Good strength and
durability.
Cooling systems are required.
Mostly high temperature and
vacuum control needs skill &
experience.
PVD coated materials has no
chemical interaction with the
surface that


MUHAMMAD ALI ASGHAR
VC&ML NINVAST

16. MUHAMMAD ALI ASGHAR
VC&ML NINVAST

17. MUHAMMAD ALI ASGHAR
VC&ML NINVAST