Prosedur Bonding pada material resin komposit

bonding

1. Bonding Siti Sunarintyas Biomaterial, FKG - UGM

2. PRINCIPLE OF ADHESION (BONDING)

3. Adhesion can be measured from the spreading of liquid droplets on enamel surfaces.

4. Adherend 1 Adherend 2 Adhesive System or Luting Cement Interface 2 Interface 1 DENTAL JOINT Adhesive Interface 1 DENTAL ADHESION

5. FORMING GOOD ADHESION (1) Clean adheren (2) Good wetting (3) Close adaptation (4) Bonding (5) Good curing physical bonding chemical bonding mechanical bonding + –

6. (1) OPERATOR Technical skill , ages, view, ... (2) Desain Bevel, Outline Form, …. (3) MATERIALS Composition , expire date, T, %RH, ... (4) INTRAORAL LOCATION Anterior-Posterior, Maxillary-Mandibular, Lingual-Facial, Premolar-Molar, ... (5) PATIENT F-exposure, Diet, Oral Hygiene, IQ, Caries Risk, ... Factor influencing the appearance

7. EMAIL BONDING SYSTEM 89v/o HA, 6% Organic, 5% Water FROSTY APPEARANCE SBS = 20 MPa

8. “Removing of smear layer ” and “hybrid layers” DENTIN BONDING SYSTEM

9. BONDED COMPOSITE RESIN

10. Designing Bonding Systems BONDING AGENT PRIMER ETCHANT E+n P + B US Companies 2 = 1 =  E+n P B Japanese Companies = 2 = 1 or nE P + B Self-Etching Primer ???  nE P B Self-Etching Adhesive hydrophilic tooth structure hydrophobic “restorative material” Total Etch Systems

11. E + n P + B or nE P + B  E + n P B  nE P B Self-Etching Primer Self-Etching Adh n P = HEMA, … , (Polymers), Alcohol, H 2 O, Acet E = H 3 PO 4 , H 2 O B = Bis-GMA, TEGDMA Acetone or Alcohol E = H 3 PO 4 , H 2 O n PB = HEMA, … , TEGDMA (Polymers), Alcohol, H 2 O, Acet B = MMA, Bis-GMA, TEGDMA, (Polymers), Acetone or Alcohol Acid Monomer, HEMA, H 2 O n EP = Acid Monomer, HEMA, Polymer, (TEGDMA), H 2 O, Alcohol n EP =

12. BONDING SYSTEM: pH 3-Component ( E +P+B), Total Etch 10% H 3 PO 4 0.8 35% H3PO4 0.1 2-Component ( E + PB ), Total Etch One-Step 0.8 Bond 1 0.8 SingleBond 0.8 Optibond S 0.8 Prime&Bond NT 0.8 Cabrio 0.8 PQ1 0.8 2-Component ( EP +B), Self-Etching Primer SE Bond 2.6 1-Component ( EPB ), Self-Etching Adhesive Panavia 2.9 iBond 2.4 One-Up 2.3 Prompt L-Pop 1.3 Xeno III 1.1 7.0 5.0 4.0 3.0 2.0 1.0 0.0 -1.0 6.0 Basic Acidic Etching Variable

13. E+n P + B E+ nPB nEP + B Self-Etching Primer nEP B Self-Etching Adhesive Total-Etch Systems Self-Etch Systems Hybrid Layer Hybrid Layer Hybrid Layer Hybrid Layer hydrophilic hydrophobic

14. BONDING SYSTEM 2-COMPONENT SYSTEMS (nEP + B) Clearfil SE Bond & LinerBond 2v (Kuraray) Tyrian SPE (Bisco) Optibond Solo SE Plus (Kerr) Fluoro Bond (Shofu) UniFil Bond (GC) Mac Bond II (Tokuyama) NanoBond (Pentron) 1-COMPONENT SYSTEMS (nEPB) AQBond (Sun Medical) or Touch-and-Bond (Parkell) Adper Prompt or LP3 (3M-ESPE) Solist (One-bottle-bond) (DMG Hamburg) iBond (Hereaus-Kulzer) Xeno III (Dentsply) 3-COMPONENT SYSTEMS (E + nP + B) Scotchbond Multipurpose Plus (3M) Permaquick (Ultradent) Bond-It (Jeneric / Pentron) All-Bond 2 (BISCO) Tenure A/B/S (Denmat) ProBond (Dentsply) 2-COMPONENT SYSTEMS (E + nPB) Syntac Single Component (Ivoclar) Ecusit Primer/Mono (DMG Hamburg) One Coat Bond (Coltene / Whaledent) Bond-1 (Jeneric / Pentron) Tenure Quik with Fluoride (Denmat) Solid Bond (Hereaus-Kulzer) Imperva Bond (Shofu) EG Bond (Sun Chemical) PQ1 (Ultradent) Easy Bond (Parkell) Paama 2 and Stae (SDI) Prime&Bond NT (Dentsply) Single-Bond (3M) Optibond Solo and Solo Plus (Kerr) One-Step (BISCO) Excite (Ivoclar/Vivadent) OSB Bonding System (ESPE) IntegraBond (Premier)