SAHIL ppt training about syrma sgs report.pptx

Syrma sgs pvt ltd.

1. YEAR-2024 SYRMA SGS TECHNOLOGYPVT.LTD. BAWAL(REWARI) SUBMITTED BY:- NAME :- SAHIL ROLL NO . :- ( 20EC12) 20140 1018002 BRANCH :- ELECTRONICS and COMMUNICATION ENGINEERING [ TRAINING REPORT ]

2. PRESENTED BY :- SAHIL SUBMITTED TO :- SANDEEP YADAV ACKNOWLEDGEMENT I acknowledge my gratitude to my mentor, Mr . Ritesh Sharma ( Assistant Manager .) SYRMA SGS TECHNOLOGY PVT.LTD. BAWAL ( DEPT : Quility ). The s upervision and support that he gave truly help the p[progression and smoothness of the training program. The cooperation is much indeed appreciated. My grateful thanks also go to Mr . RITESH SHARMA(Senior Assitent Manager ) and MR.R aghav S aini ( Junior Engineer ) in QUILITY department . A big contribution andduring six month is very great indeed. Besides this training period makes me realize the value of working together as a team and a new experience in working environment, which challenges us every minute . Not forget appreciation go to the rest of SYRMA SGS staff that help me from time to time during my training .

3. CERTIFICATE

4. PRESENTED BY :- SAHIL SUBMITTED TO :- SANDEEP YADAV CERTIFICATE OF COMPLETION This is to certify that training report is titled by LEARNING ABOUT ASSEMBLING OF PCB’s MAINTENECE and PCB Quility Check (Components Value Check and then assemble at proper location) . This report is submitted by SAHIL. Institute Name :- RAO PAHLAD SINGH COLLEGE OF ENGINEERING and TECHNOLOGY, BALANA, MOHINDERGARH. This Training Report is done under supervision and guidance of Mr . RAGHAV SAINI ( Quility Engineer ) and MR. RITESH SHARMA ( Quility Assistant Manager ) in Quility Department .

5. SMT Surface Mount Technology

6. SMT Surface Mount Technology

7. SMT Surface Mount Technology

8. PC B Lo a der Y J - LINK Auto width adjustment High speed magazine change Jam detection Width synchronization Line control ESD powder coating (RAL 7035) Located at the first stage of SMT line, this unit transfers PCBs stacked in a magazine rack to the downstream machine using a pneumatic pusher one by one. SMT Surface Mount Technology

9. PC B C l e a ne r Y J - LI N K Removes dust and particle on a PCB by sticky roller and ionizer while being transferred to next process. Options Analog speed controller (1~200mm/sec) Auto width adjustment Width synchronization Line control ESD powder coating (RAL 7035) SMT Surface Mount Technology Features Touch screen (Operating panel) Tower lamp Manual width adjustment Ionizer SMEMA interface Controlled by PLC

10. Screen Printer GPX-C FUJI Solder paste is used to mount the component which is applied in the screen printer with the help of stencil Solder supply and cleaning can be automated and the machine was designed considering work efficiency. Reduces the load on operators and minimizes the work time for changeover and maintenance. It has a sheet of stainless steel with laser cut opening used to place solder paste on a P CBA bo a rd f o r SMT c o m pon e n ts SMT Surface Mount Technology

11. SMT Surface Mount Technology SAC= Stanus + Silver +copper are used as soldering paste it have 2 type SAC 305 & SAC 307 which are most commonly used. The life of Paste is very low once it opened and have to store it in low temp 2degree to 10 degree C for 4 months. Size of stencil varies from 3 mil thick 4 mil thick 5 mil thick( Most commonly used) - 6 mil thick Type of soldering paste Type 3 25-45 un Type 4 20-35 un Type 5 15-35 un Type 6 10-30 un

12. Screen Printer Inspection Konyoung It defects error during the solder paste printing process. We check presence & alignment /placement Height Area Volume In SPI machine we upload data manually , while programing, component ID ,PAD ID X,Y,Z . In order to ensure the desired amount of solder paste has been deposited without defects and that the process is repeatable SMT Surface Mount Technology There are 2 major solder paste defects Missing pad Excess paste

13. Pick & Place FUJI - NXT 3 In pick and place machine , the nozzle will pick the component , In each module there are 24 nozzle, check the component the right component is mounted on the PCB and the defective component is placed in drop box The NEW NXT III Following feature Highly productive Multi-functional modular placing machine Built for speed, a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. SMT Surface Mount Technology

14. It have high-speed head achieves 37,500 cph (chips per hour) (Productivity priority mode) per module, a 44% improvement from the fastest speed of the NXT II. By improving machine rigidity and further refining its independent servo control and vision recognition technology, Fuji has achieved a placing accuracy for small chip parts of +/- 0.025 mm* (3sigma, Cpk≥1.00). SMT Surface Mount Technology

15. Reflow oven A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards . In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door. Typical reflow profile comprise four distinct Session Pre heat Soak Reflow Cooling SMT Surface Mount Technology

16. Reflow oven SMT Surface Mount Technology Preheat zone – it heat up the board temp depending on the paste requirement evaporates off the flux volatiles.(124°C - 179°C) Soak zone – acts as flux activation zone ,stabilizes the temp across entire board(179°C-230°C). Reflow zone – temp zone that spent above liquids(230°C -250°C ). Cooling zone - PCBA is cooled from peak temp. to solidifies , rapid cooling is required to min the intermetallic and obtain fine grain solder joints(250°C - 47°C ).

17. Automatic Optical Inspection (Zenitn Lite) AOI is an automated visual inspection which use to defects on PCBA It s c a n s P CBA w i t h ca m e r a s a n d d e te c ts 2 type of Failures Catastrophic failures(Missing components ) Quality failures Benefits of using AOI Non – contact test method Accurately detects a specific category of programmed defects on SMT Surface Mount Technology

18. Automatic Optical Inspection (Zenitn Lite) Type of Defects Soldering Defects Open circuits Solder bridges Solder Void Solder quality Component Defects Lifted lead Missing Component Faulty component SMT Surface Mount Technology