What is Photomask Types, Applications and Inspection

Viewmm 11 views 6 slides May 01, 2025
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About This Presentation

Photomask are critical in semiconductor and MEMS fabrication, enabling precise pattern transfer at nanoscale levels. This guide explores their types, key applications, and inspection methods that ensure flawless micro-patterning. Learn how photomasks drive innovation in electronics, optics, and biom...


Slide Content

What is Photomask? Types, Applications and
Inspection


In the era of nanotechnology and semiconductor advancement,
photomasks serve as a cornerstone in the microfabrication process.

These precision-engineered optical templates are crucial to
lithography-based patterning, which defines the microstructures in
integrated circuits, MEMS, and other micro-scale devices.

Understanding photomasks and their role provides insight into how
precision and repeatability are achieved at submicron levels across
modern manufacturing.

What is Photomask?

A photomask is a quartz or glass plate with an opaque pattern used
to transfer micro-patterns onto semiconductor wafers via a
photolithography process. The photomask functions as a stencil,
allowing light or radiation to pass through transparent regions and
blocking it elsewhere to define circuit pathways or component
layouts. The precision of the photomask directly affects the
resolution and quality of microelectronic devices.

Types of Photomasks

1. Binary Masks
These are traditional chrome-on-glass masks that use completely
opaque and transparent regions to define circuit patterns. Light
passes through clear areas only, forming sharp images ideal for
standard photolithography in microelectronics.

2. Phase-Shift Masks (PSM)
Phase-shift masks manipulate light by introducing phase
differences between transparent regions. This creates interference
patterns that sharpen edges and improve resolution, allowing for
finer feature definition in advanced semiconductor devices.

3. Embedded Attenuated PSMs
These masks use semi-transparent materials that both reduce light
intensity and shift phase. The combination enables higher contrast
and precision when printing dense patterns, especially for deep
submicron lithography requirements.

4. EUV Masks (Extreme Ultraviolet)
EUV masks are built with reflective multilayer stacks and are used
with 13.5 nm EUV light. They support next-generation
semiconductor nodes by enabling patterning at atomic scales with
minimal diffraction.

5. Reticles
Reticles are enlarged photomasks, typically 4x or 5x the target
design size, used in stepper or scanner systems. Optical reduction
projects the pattern onto the wafer with submicron precision and
high repeatability.

Applications of Photomasks

1. Semiconductor Fabrication
Photomasks transfer microscopic circuit layouts onto silicon wafers,
enabling precise etching of transistors and interconnects critical to
microprocessors, memory chips, and logic devices.

2. MEMS Manufacturing
Used to define ultra-fine patterns on substrates, photomasks enable
the creation of microscale mechanical structures like cantilevers,
pressure sensors, and microvalves in MEMS devices.

3. Flat-Panel Displays
Photomasks guide the formation of thin-film transistor arrays and
pixel electrodes on glass substrates, essential in manufacturing
LCD, OLED, and next-gen display technologies.

4. Photonic and Optoelectronic Components
For waveguides, laser diodes, and photonic crystals, photomasks
pattern optical paths and layer interfaces with submicron precision
to ensure efficient light control and transmission.

5. Biomedical Devices
Photomasks help fabricate microfluidic chips and implantable
sensors by patterning polymer or silicon layers, ensuring sterile,
high-resolution paths for biological analysis and drug delivery.

Photomask Metrology & Inspection

Due to their direct influence on device yield and functionality,
photomask metrology focuses on ensuring critical dimension (CD)
uniformity, defect-free surfaces, and pattern fidelity. Common
metrology practices include:

CD Measurement
Critical Dimension (CD) measurement involves using high-
resolution optical or laser-based systems to measure line widths on

photomasks with nanometer-level accuracy to ensure consistent
pattern fidelity.

Overlay Metrology
Overlay metrology checks the alignment between successive
photomask layers, ensuring that patterns across multiple exposures
are accurately positioned to avoid device defects or functional
mismatches.

Defect Inspection
Photomask defect inspection identifies foreign particles, scratches,
or pattern irregularities using brightfield and darkfield optical
methods, crucial for maintaining clean, precise feature transfer
during lithography.

Flatness & Surface Roughness
Surface flatness and roughness are analyzed using interferometry
techniques to detect minute height variations, ensuring uniform light
exposure and reducing distortion during wafer patterning.

Pattern Transfer Accuracy
High-precision metrology ensures the photomask pattern transfers
exactly to the wafer, maintaining design integrity and minimizing
functional errors across mass production semiconductor batches.

Key Photomask Metrology Systems and Tools

Modern photomask metrology systems integrate high-precision
hardware with automated software analytics. Some key tools
include:

1. Optical Measurement Systems
These systems use light to assess the surface characteristics of
photomasks. They measure surface profile, roughness, and critical

dimensions (CD), ensuring high precision in pattern transfer during
photolithography.

2. CD-SEM (Critical Dimension Scanning Electron Microscopy)
A high-resolution electron microscope that precisely measures line
widths and feature dimensions on the photomask to ensure pattern
accuracy and process control at nanoscale.

3. Aerial Imaging Measurement Systems
These simulate actual lithographic exposure conditions, showing
how light behaves through a photomask pattern, helping predict
how the pattern will transfer onto the wafer.

4. Confocal Microscopes
Use focused laser scanning and pinhole optics to capture detailed
3D images, ideal for analyzing topographical depth and surface
uniformity of mask structures.

5. Actinic Inspection Tools
Work at the same wavelength used in photolithography (e.g., EUV)
to detect phase defects or mask errors that are otherwise invisible
to visible light tools.

Each system addresses unique photomask features, contributing to
a robust metrology ecosystem for pattern validation.

VIEW – Leading Optical Metrology for Photomask

Precision in photomask inspection directly impacts device yield,
especially in high-resolution semiconductor and micro-optical
domains. VIEW Micro-Metrology offers industry-leading optical
metrology systems for high-throughput, non-contact, and ultra-
precise inspection tasks.

Our systems are designed to integrate seamlessly into production
environments, ensuring real-time, in-line feedback for photomask
quality control—whether in IC fabs, MEMS lines, or photonic device
manufacturing.

Conclusion

Photomasks form the backbone of photolithographic precision.
Their ability to accurately define micro and nano-scale patterns
makes them indispensable to modern technology.

As semiconductor nodes shrink and demand for higher precision
increases, photomask quality and its metrology become non-
negotiable.

Would you like to explore how VIEWMM can help optimize
photomask inspection and measurement in your facility? Let’s
connect.






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