Additional Details PPT Template.pptxAdditional Details PPT Template.pptx
tripathyananta69
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Jun 07, 2024
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Additional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional Details PPT Template.pptxAdditional D...
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A system for super large scale integration VLSI method thereof The present invention relates to a very large scale integrated (VLSI) circuit chips and more specifically to a method and apparatus for fabricating power VLSI diode devices. The invention more particularly relates to a system for super large-scale integration VLSI and method thereof.
Details about Innovation Field of the Invention: The invention relates to VLSI circuit chips, specifically methods and apparatus for fabricating power VLSI diode devices. This system addresses challenges in chip complexity and scale by improving synthetic operations in VLSI development. Background: The development in digital integrated electronic circuits has led to increased chip complexity and scale. The invention aims to overcome issues such as multiple logic levels and extensive gate circuits in super large-scale integration. Technical Problem and Solution: The invention solves the problem of providing a system for super large-scale integration VLSI that can handle different timing conditions of test chips using a programmable parallel port sequence testing circuit based on FPGA. System and Method Description: The proposed system includes a plurality of submodules divided by logic function, boundary condition, and block size. It integrates submodules into executable scripts for synthetic operation. The system also involves forming electrical contacts on multiple metallization layers of VLSI substrates to fabricate power semiconductor diodes. Innovative Aspects: The system is designed to be low power and economical, with easy equipment implementation, making it more compact and efficient than current systems. It uses a combination of physical VLSI placement, communication with processors, and AI-trained embedded software to enhance performance and integration.
Technicalities that you want to share with us for validation System for Super Large-Scale Integration VLSI: The system includes multiple submodules divided by logic function, boundary condition, and block size. This modular approach facilitates the integration of different parts of the VLSI system. Methodology: The method involves creating executable scripts, special scripts, and generic scripts for each submodule, which are integrated in a predetermined order to start synthetic operations. This scripting approach enhances automation and efficiency in the VLSI design process. Technical Problem Addressed: The system addresses issues such as high complexity and large scale in VLSI chip design. It provides a solution for managing multiple logic levels and extensive gate circuits, which are common challenges in super large-scale integration. Innovative Solutions: The invention proposes a programmable parallel port sequence testing circuit based on FPGA for high and low bias tests of different timing conditions. This innovation ensures better handling of voltage and current ratios in VLSI diode devices. Integration with AI and Processing Units: The system leverages AI-trained embedded software and algorithms to optimize the integration and performance of VLSI circuits. It involves communication between physical VLSI placement and processing units, enhancing the overall system efficiency. Power Efficiency and Compact Design: One of the main aspects of the invention is to provide a low-power, economical solution that is easy to implement. The system's design focuses on being more compact and efficient compared to existing methods. Applications and Versatility: The proposed system can be implemented on various platforms such as FPGAs, PCs, microcontrollers, and other processors. This versatility allows the system to support a wide range of application domains where VLSI integration challenges are prevalent. Schematic and Detailed Description: The document includes schematic diagrams and detailed descriptions of the system components and their interactions. Figures 1 and 2 illustrate the system's architecture and integration process, providing a clear understanding of the innovative approach.
About the Solution(s) Super Large-Scale Integration VLSI System: The proposed system includes methods and systems for integrating diode devices, discrete semiconductors, and power VLSI diode devices, particularly focusing on power semiconductor devices. It involves forming a plurality of electrical contacts on multiple metallization layers, creating a VLSI integrated device structure that allows current flow between the surfaces. Equipment Implementation: The solution is divided into at least two sets of equipment implementation phases: First Set: Physical placement of components on the VLSI chip and their communication with the processor. Second Set: Implemented with the help of a processing unit on the VLSI circuitry, using an AI-trained embedded software and algorithm. Application Domain: The system and method are applicable to Field Programmable Gate Arrays (FPGAs), PCs, microcontrollers, and other known processors. This flexibility allows support for various application domains that require such solutions. Scripting and Execution: The system involves creating executable scripts, special scripts, and generic scripts that can be added in a predetermined order to start the synthetic operation. This scripting module interacts with a comprehensive platform, facilitating easier integration and management of various submodules. Modular Integration: The solution emphasizes modularity, with submodules divided according to logic function, boundary condition, and block size. This approach ensures that each submodule is capable of integration, thereby enhancing the overall flexibility and scalability of the VLSI system. Advanced Verification: The system includes advanced verification features such as sending pumping signals to a logic checking environment, receiving verification messages, and recording error-detecting data. This ensures robust and reliable operation of the VLSI assembly. Technical Details Processor and Memory Interfaces: The processor is designed to communicate with various memory devices using interfaces like SATA, IDE, IEEE-1394, USB, and more. This supports a wide range of memory types including RAM, ROM, HDD, SSD, and cloud-based storage. Connectivity and Communication Protocols: The system supports various communication protocols and interfaces such as audio, digital, HDMI, Bluetooth, GSM, LTE, WiMax , and more. This ensures compatibility with diverse devices and systems.
How prototype looks like -Some Photos of your innovation - So that we can understand the Innovation Maturity level.
Any Video link about your Innovation - If possible, please https://www.youtube.com/watch?v=gaj_yiaXgi4
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