ANSYS Lab Manual: Fundamentals of FEM and Applied Engineering Simulation Experiments

STUDY OF BASICS IN ANSYS, STRESS ANALYSIS OF A PLATE WITH A CIRCULAR HOLE, STRESS ANALYSIS OF RECTANGULAR L BRACKET, STRESS ANALYSIS OF BEAM, MODE FREQUENCY ANALYSIS OF A 2D COMPONENTS, THERMAL STRESS ANALYSIS OF A 2D COMPONENTS, CONDUCTIVE HEAT TRANSFER ANALYSIS OF A 2D COMPONENTS, CONVECTIVE HEAT TRANSFER ANALYSIS OF A 2D COMPONENTS.

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STUDY OF BASICS IN ANSYS
EXPERIMENT NO: 1
DATE:
Aim: To study about the basic procedure to perform the analysis in ANSYS
Introduction to FEM
The Finite Element Method (FEM) is a powerful numerical technique that breaks down
complex structures into smaller, simpler parts called "finite elements" to analyze their behaviour.
Here's an image illustrating the concept of discretizing an object into finite elements:

Here's a breakdown of its core principles:
• Discretization: The fundamental idea is to break down a large, continuous system (like a
complex machine part, a bridge, or a fluid domain) into smaller, simpler, and
interconnected sub-regions called finite elements. These elements are typically simple
geometric shapes like triangles, quadrilaterals, tetrahedrons, or hexahedrons. The
network of these elements is known as a mesh.
• Nodes: The elements are connected at specific points called nodes. The behaviour of the
entire system is approximated by solving for values (e.g., displacement, temperature,
pressure) at these nodes.
• Approximation: Within each finite element, the unknown field variable (e.g.,
displacement, temperature) is approximated using simple mathematical functions, often
polynomials. These functions are defined in terms of the nodal values of the element.

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• Element Equations: Based on fundamental physical laws (like equilibrium equations for
structures, heat conduction equations, or fluid flow equations) and the chosen
approximation functions, a set of equations is formulated for each individual element.
These equations relate the nodal values to applied forces, heat sources, or other loads
acting on the element.
• Assembly: All the individual element equations are then assembled into a much larger
global system of equations that represents the behaviour of the entire structure or
system. This assembly process ensures that compatibility (elements fit together without
gaps or overlaps) and equilibrium (forces balance at the nodes) are maintained.
• Boundary Conditions: Real-world constraints, such as fixed supports, applied forces, or
prescribed temperatures, are applied to this global system of equations.
• Solution: The resulting system of algebraic equations is then solved (typically using
powerful computers and specialized software) to determine the unknown nodal values.
• Post-processing: Finally, these nodal values are used to calculate other quantities of
interest, such as stresses, strains, heat fluxes, or fluid velocities, and the results are often
visualized graphically to provide insights into the system's behaviour.
Why FEM is so crucial:
FEM allows engineers to:
• Analyze complex geometries and material properties.
• Predict how designs will perform under various real-world conditions (loads,
temperatures, vibrations).
• Optimize designs for performance, safety, and cost.
• Reduce the need for expensive and time-consuming physical prototypes.
It's an indispensable tool across diverse engineering disciplines, including civil, mechanical,
aerospace, biomedical, and automotive engineering.
Analysis software’s
FEM analysis software are sophisticated computational tools that implement the Finite Element
Method (FEM) to simulate and predict the behavior of products and systems under various
physical conditions. They allow engineers to virtually test designs, identify potential issues, and
optimize performance before costly physical prototyping.
Leading FEM Analysis Software:
The choice of software often depends on the specific industry, type of analysis, and budget. Some
of the most widely used and reputable FEM software packages include:

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• Ansys: A comprehensive suite offering solutions for structural, fluid, thermal,
electromagnetic, and Multiphysics simulations. Highly regarded for its accuracy and
robust solvers.
• Dassault Systems SIMULIA (Abaqus): Known for its advanced nonlinear capabilities and
ability to simulate highly complex material behaviours (e.g., rubber, composites,
biological tissues) and complex contact scenarios.
• Siemens Simcenter (formerly NX Nastran): A powerful suite of simulation tools
integrated within the Siemens NX CAD/CAM/CAE environment, offering strong
capabilities for structural, thermal, and dynamic analysis.
• COMSOL Multiphysics: Particularly strong in Multiphysics simulations, allowing users to
couple different physics phenomena seamlessly through its equation-based modeling
approach.
• Altair Hyper Works (Hyper Mesh, Opti Struct, Radios): A broad platform for simulation,
including pre-processing (Hyper Mesh is a leading masher), structural analysis, crash
simulation, and optimization.
• SolidWorks Simulation (Dassault Systems): Often favoured by designers and mechanical
engineers for its user-friendly interface and integration directly within the SolidWorks
CAD environment, suitable for a wide range of linear and some nonlinear structural
analyses.
• Autodesk Fusion 360 / Inventor Nastran: Autodesk offers integrated FEA capabilities
within its design software, making it accessible for product design and manufacturing.
• MSC Nastran: A long-standing and highly respected structural analysis solver, especially
in aerospace and automotive industries, known for its robustness.
• STAAD.Pro / ETABS (Bentley Systems / CSI): Widely used in civil and structural
engineering for building and infrastructure analysis and design.
ANSYS
Ansys is a global leader in engineering simulation software, widely recognized for its
comprehensive suite of tools that enable engineers across diverse industries to analyze, predict,
and optimize product and system performance. At its core, Ansys leverages advanced numerical
methods like the Finite Element Method (FEM) for structural analysis, Computational Fluid
Dynamics (CFD) for fluid flow, and specialized solvers for electromagnetics, optics, and more.
What Ansys Does:
Ansys essentially creates a "digital twin" of a physical product or system, allowing engineers to
conduct virtual experiments and understand complex behaviours without the need for expensive
and time-consuming physical prototypes. This includes:
• Structural Analysis (Ansys Mechanical): Simulating how structures, machine
components, or electronics respond to forces, heat, and vibrations. This covers stress,

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strain, deformation, fatigue, fracture, buckling, and impact analysis. It's built upon the
Finite Element Method.
• Fluid Dynamics (Ansys Fluent, Ansys CFX): Analyzing fluid flow, heat transfer within
fluids, chemical reactions, and multiphase flows. This is crucial for designing everything
from aerodynamic vehicles to efficient cooling systems and pumps.
• Electromagnetics (Ansys HFSS, Ansys Maxwell): Simulating electromagnetic fields for
antenna design, signal integrity, power electronics, electric motors, and more.
• Multiphysics Coupling: A standout feature of Ansys is its ability to simulate interactions
between different physics phenomena. For example, it can model how fluid flow impacts
a structure's deformation (Fluid-Structure Interaction - FSI), or how heat generated by
electrical currents affects a component's structural integrity (Electro-Thermal).
• Semiconductor Analysis: Specialized tools for chip-package-system co-simulation, power
integrity, and thermal analysis at the microchip level.
• Optics: Tools for designing and analysing optical systems, including illumination, imaging,
and laser applications.
• Embedded Software: Tools for developing, verifying, and validating embedded software
for various control systems.
• Additive Manufacturing: Simulating the 3D printing process to predict distortions,
residual stresses, and optimize build strategies.
Structural analysis - One dimensional, two dimensional and three-dimensional Elements Based
Problems
Structural analysis determines how objects deform, stress, and react to loads.
1. 1D Elements (Line Elements):
o Description: Used for slender structures where the behaviour is predominantly
along one axis. They capture axial, shear, bending, and torsional forces.
o Types:
▪ Bar/Truss Elements: Only transmit axial forces (tension/compression).
Ideal for simple trusses.
▪ Beam Elements: Transmit axial, shear, and bending forces, plus torsion.
Used for frames, shafts, and long slender components.
o Problem Example: Analyzing the deflection of a building column, forces in a bridge
truss member, or stress in a rotating shaft.
o Benefit: Very computationally efficient for appropriate problems.
2. 2D Elements (Surface Elements):
o Description: Used for flat or curved thin structures, or problems that can be
simplified to a plane.
o Types:
▪ Shell Elements: Model thin-walled structures (e.g., car bodies, aircraft
skins, pressure vessel walls). They capture both in-plane (membrane) and
out-of-plane (bending) behaviour.

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▪ Plate Elements: Primarily for bending of flat, thin structures. Often
considered a subset of shell elements.
▪ Plane Stress Elements: For very thin objects where stress perpendicular to
the plane is negligible (e.g., thin sheet metal).
▪ Plane Strain Elements: For very long objects where deformation along the
length is constrained (e.g., dams, tunnels).
▪ Axisymmetric Elements: For 3D objects with rotational symmetry and
axisymmetric loads, reducing the problem to 2D (e.g., pressure vessels,
pipes).
o Problem Example: Stress in a laptop casing, deformation of a thin concrete slab,
or analysis of a pressure tank cross-section.
o Benefit: Good balance of accuracy and computational cost for suitable
geometries.
3. 3D Elements (Solid Elements):
o Description: Used for bulky, volumetric objects where stresses and strains vary
significantly in all three dimensions.
o Types:
▪ Tetrahedral Elements (Tets): Good for complex geometries due to easy
meshing.
▪ Hexahedral Elements (Bricks): Generally, provide more accurate results
and faster convergence for simpler, regular geometries but are harder to
mesh automatically.
o Problem Example: Stress distribution in an engine block, impact analysis of a
complex machine part, or thermal stress in a turbine blade.
o Benefit: Most accurate for general 3D structures, capturing full volumetric
behaviour.
o Consideration: Most computationally expensive.
Fluid analysis - One dimensional, two dimensional and three-dimensional Elements Based
Problems
Fluid analysis (CFD) simulates fluid flow, heat transfer, and related phenomena. While the Finite
Volume Method (FVM) is very common in CFD, FEM is also used, especially for complex
geometries or coupled physics.
1. 1D Elements (Line Elements):
o Description: Used for simplified fluid flow in pipes or networks where flow is
primarily unidirectional.

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o Types:
▪ Pipe/Channel Elements: Represent flow through pipes, ducts, or channels.
Focus on pressure drop, flow rate, and velocity along the length.
o Problem Example: Calculating pressure drop in a piping system, flow distribution
in a ventilation network, or transient flow in a simple pipe.
o Benefit: Highly efficient for network-type problems.
2. 2D Elements (Surface Elements):
o Description: Used for fluid flow in a plane, or when the flow is uniform in one
direction, simplifying a 3D problem.
o Types:
▪ Planar Fluid Elements (Triangles, Quadrilaterals): Model 2D flow domains.
▪ Axisymmetric Fluid Elements: For fluid flow problems with rotational
symmetry, reducing a 3D flow to 2D (e.g., flow through a nozzle).
o Problem Example: Airflow around a 2D airfoil cross-section, flow in a thin
microfluidic channel, or heat transfer within a fluid in a rectangular duct cross-
section.
o Benefit: Offers a balance of accuracy and computational cost for planar or
axisymmetric flows.
3. 3D Elements (Solid Elements):
o Description: Used for complex, truly three-dimensional fluid flows where effects
in all directions are significant.
o Types:
▪ Solid Fluid Elements (Tetrahedrons, Hexahedrons, Prisms): Model the
fluid volume. Tetrahedrons are common for complex fluid domains, while
hexahedrons are preferred for structured meshes for better accuracy.
o Problem Example: Simulating turbulent airflow around an entire vehicle, fluid
mixing in a chemical reactor, blood flow in complex arteries, or heat transfer in
electronic cooling systems with intricate channels.
o Benefit: Most accurate for complex, real-world fluid dynamics.
o Consideration: Most computationally demanding, often requiring significant
computing power.
Thermal Analysis - Conduction, Convection and Radiation heat transfer Problems
Thermal analysis involves studying how heat energy is transferred within and between systems.
The three primary modes of heat transfer are conduction, convection, and radiation.
Understanding and solving problems related to these modes are fundamental in various
engineering and scientific applications.
Here's a breakdown of each mode, their governing equations, and common problem types:

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1. Conduction
• Definition: Heat transfer through direct contact between particles, primarily significant
in solids.
• Key Law: Fourier's Law of Heat Conduction.
• Formula (1D steady-state through a plane wall): Q=−kAdxdT or Q=LkA(T1−T2)
o Q: Heat transfer rate (W)
o k: Thermal conductivity (W/m·K)
o A: Area normal to heat flow (m²)
o dT/dx: Temperature gradient (K/m)
o L: Thickness (m)
• Common Problems: Heat flow through walls (single or composite), fins, heat generation
within solids, steady-state vs. transient analysis.
2. Convection
• Definition: Heat transfer between a solid surface and a moving fluid (liquid or gas).
Involves both diffusion and bulk fluid motion.
• Key Law: Newton's Law of Cooling.
• Formula: Q=hA (Ts−Tf)
o Q: Heat transfer rate (W)
o h: Convective heat transfer coefficient (W/m²·K) - this is highly dependent on
fluid properties, flow regime (laminar/turbulent), and geometry.
o A: Surface area exposed to fluid (m²)
o Ts: Surface temperature (K or °C)
o Tf: Fluid temperature (K or °C)
• Types:
o Natural (Free) Convection: Fluid motion due to density differences (buoyancy).
o Forced Convection: Fluid motion induced by external means (fan, pump, wind).
• Common Problems: Cooling of electronic components, heat exchangers, fluid flow over
heated surfaces.
3. Radiation
• Definition: Heat transfer through electromagnetic waves, does not require a medium,
can occur in a vacuum.
• Key Law: Stefan-Boltzmann Law.
• Formula (for a blackbody): Eb=σT4
o Eb: Emissive power of a blackbody (W/m²)
o σ: Stefan-Boltzmann constant (5.67×10−8 W/m²·K⁴)
o T: Absolute temperature (K)
• For real surfaces (gray bodies): E=ϵσT4, where ϵ is emissivity (0<ϵ≤1).
• Net Radiation Exchange between two surfaces: Q1−2=F1−2A1σ(T14−T24)
o F1−2: View factor (geometric factor).
• Common Problems: Heat loss from uninsulated pipes, spacecraft thermal control, solar
energy collection, heat transfer in furnaces.

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STRESS ANALYSIS OF A PLATE WITH A CIRCULAR HOLE
EXPERIMENT NO: 2
Date:
AIM: To conduct the stress Analysis of a plate with a circular hole using ANSYS software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
1. Start Workbench & Create Project: Open ANSYS Workbench and drag a "Static
Structural" analysis system into the Project Schematic.
2. Define Material: Double-click "Engineering Data" to specify material properties (e.g.,
Young's Modulus, Poisson's Ratio) for your plate.
Young’s Modulus = 200 GPa
Poisson’s Ratio = 0.3
3. Create Geometry: Use Design Modeler or Space Claim (via "Geometry") to sketch and
extrude a plate with a circular hole. Consider symmetry for efficiency.

4. Set Up Model (ANSYS Mechanical):
• Double-click "Model" to open ANSYS Mechanical.
• Assign Material: Ensure the created geometry has the correct material.
1 N/mm2

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• Mesh: Generate a mesh, critically refining it around the hole to capture stress
concentration accurately.
• Apply Boundary Conditions: Add a fixed support to one end and a tensile
force/pressure to the opposite end. Apply symmetry boundary conditions if a
symmetric model was used.
5. Solve: Add "Equivalent (von-Mises) Stress" and "Total Deformation" to the Solution,
then right-click "Solution" and select "Solve."
6. Review Results: Examine the contour plots for stress and deformation, particularly
noting the maximum von-Mises stress at the hole to determine the stress concentration
factor.






RESULT
Thus, the Stress Analysis of a plate with a circular hole was done and evaluated by using
the ANSYS software

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STRESS ANALYSIS OF RECTANGULAR L BRACKET
EXPERIMENT NO: 3
DATE:
AIM: To conduct the stress Analysis of rectangular L bracket using ANSYS software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
1. Start Workbench & Create Project: Open ANSYS Workbench and drag a "Static
Structural" analysis system into the Project Schematic.
2. Define Material: Double-click "Engineering Data" to specify material properties (e.g.,
Young's Modulus, Poisson's Ratio) for your plate.
Young’s Modulus = 200 GPa
Poisson’s Ratio = 0.3
3. Create Geometry: Use Design Modeler or Space Claim (via "Geometry") to sketch and
extrude a plate with a circular hole. Consider symmetry for efficiency.

4. Set Up Model (ANSYS Mechanical):
• Double-click "Model" to open ANSYS Mechanical.
• Assign Material: Ensure the created geometry has the correct material.
1000 N

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• Mesh: Generate a mesh, critically refining it around the hole to capture stress
concentration accurately.
• Apply Boundary Conditions: Add a fixed support to one end and a tensile
force/pressure to the opposite end. Apply symmetry boundary conditions if a
symmetric model was used.
5. Solve: Add "Equivalent (von-Mises) Stress" and "Total Deformation" to the Solution,
then right-click "Solution" and select "Solve."
6. Review Results: Examine the contour plots for stress and deformation, particularly
noting the maximum von-Mises stress at the hole to determine the stress concentration
factor.


RESULT
Thus, the Stress Analysis of rectangular L bracket was done and evaluated by using the
ANSYS software

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STRESS ANALYSIS OF BEAM
EXPERIMENT NO: 4
DATE:
AIM: To conduct the stress Analysis of beam using ANSYS software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
1. Start Workbench & Create Project: Open ANSYS Workbench and drag a "Static
Structural" analysis system into the Project Schematic.
2. Define Material: Double-click "Engineering Data" to specify material properties (e.g.,
Young's Modulus, Poisson's Ratio) for your plate.
Young’s Modulus = 200 GPa
Poisson’s Ratio = 0.3
3. Create Geometry: Use Design Modeler or Space Claim (via "Geometry") to sketch and
extrude a plate with a circular hole. Consider symmetry for efficiency.

4. Set Up Model (ANSYS Mechanical):
• Double-click "Model" to open ANSYS Mechanical.
• Assign Material: Ensure the created geometry has the correct material.
• Mesh: Generate a mesh, critically refining it around the hole to capture stress
concentration accurately.

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• Apply Boundary Conditions: Add a fixed support to one end and a tensile
force/pressure to the opposite end. Apply symmetry boundary conditions if a
symmetric model was used.
5. Solve: Add "Equivalent (von-Mises) Stress" and "Total Deformation" to the Solution,
then right-click "Solution" and select "Solve."
6. Review Results: Examine the contour plots for stress and deformation, particularly
noting the maximum von-Mises stress at the hole to determine the stress concentration
factor.



RESULT
Thus, the Stress Analysis of a beam was done and evaluated by using the ANSYS software

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MODE FREQUENCY ANALYSIS OF A 2D COMPONENTS
EXPERIMENT NO: 5
DATE:
AIM: To conduct the mode frequency analysis of a 2D components using ANSYS software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
The three main steps to be involved are
1. Preprocessing
2. Solution
3. Postprocessing
Start - All Programs – ANSYS 16.2 - Mechanical APDL Product Launcher – Set the Working
Directory as E Drive, User - Job Name as Roll No., Ex. No. – Click Run.
PREPROCEDURE
1. Preprocessor - Element type - Add/Edit/Delete – Add – Beam, 2D elastic 3 – Ok– Close.
2. Real constants - Add/Edit/Delete – Add – Ok – Area 0.1e-3, Izz 0.833e-9, Height 0.01– Ok
–Close.
3. Material props - Material Models –Structural – Linear – Elastic - Isotropic – EX206e9, PRXY
0.25 – Ok –Density – DENS 7830 –Ok.
4. Modeling –Create–Key points–Inactive CS–Enter the coordinate values-Ok. Lines -lines –
Straight Line – Join the two key points – Ok.
5. Meshing – Size Controls – manual size – lines – all lines – Enter the value of no of element
divisions 25 – Ok. Mesh – Lines – Select the line –Ok.

SOLUTION
• Solution – Define Loads – Apply – Structural – Displacement - On nodes – Select the node
point –Ok – All DOF – Ok. Analysis type – New analysis – Modal – Ok. Analysis type –
Analysis options – Block Lanczos – enter the value no of modes to extract as 3 or 4 or 5 –
Ok – End Frequency 10000 –Ok.

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• Solve – Current LS – Ok – Solution is done –Close.
POSTPROCEDURE

First Step Result:

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Second Step Result:





RESULT
Thus, the mode frequency analysis of a 2D components was done and evaluated by using
the ANSYS software.

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THERMAL STRESS ANALYSIS OF A 2D COMPONENTS
EXPERIMENT NO: 6
Date:
AIM: To conduct the thermal stress analysis of a 2D components using ANSYS software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
The three main steps to be involved are
1. Preprocessing
2. Solution
3. Postprocessing
Start - All Programs – ANSYS 16.2 - Mechanical APDL Product Launcher – Set the Working
Directory as E Drive, User - Job Name as Roll No., Ex. No. – Click Run.
PREPROCEDURE
1. Preference – Thermal - h-Method -Ok.
2. Preprocessor-Element Type-Add/Edit/Delete–Add–Solid, Quad4node42–Ok – Options –
plane strsw/thk – Ok – Close.
3. Real constants - Add/Edit/Delete – Add – Ok – THK 100 – Ok –Close.
4. Material props - Material Models –Structural – Linear – Elastic - Isotropic – EX 2e5, PRXY
0.3 – Ok –Thermal expansion – Secant coefficient – Isotropic – ALPX 12e-6 – Ok.
5. Modeling – Create – Areas - Rectangle – by 2 corners – Enter the coordinate values,
height, width -Ok.
6. Meshing – Mesh tool – Areas, set – select the object – Ok – Element edge length 10 - Ok
– Mesh tool- Tri, free - mesh – Select the object–Ok.
SOLUTION
7. Solution – Define Loads – Apply – Structural – Displacement - On lines – Select the
boundary on the object –Ok – Temperature – Uniform Temp – Enter the temp. Value 50
–Ok.

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8. Solve – Current LS – Ok – Solution is done –Close.
POSTPROCEDURE
9. General post proc – Plot results – Contour plot – Nodal solution – Stress – 1st principal
stress – Ok – Nodal solution – DOF Solution – Displacement vector sum -Ok.
FOR REPORT GENERATION
10. File – Report Generator – Choose Append – OK – Image Capture – Ok –Close

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RESULT
Thus, the mode frequency analysis of 2D components was done and evaluated by using
the ANSYS software.

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CONDUCTIVE HEAT TRANSFER ANALYSIS OF A 2D COMPONENTS
EXPERIMENT NO: 7
Date:
AIM: To conduct the conductive heat transfer analysis of a 2D components using ANSYS
software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
The three main steps to be involved are
4. Preprocessing
5. Solution
6. Postprocessing
Start - All Programs – ANSYS 16.2 - Mechanical APDL Product Launcher – Set the Working
Directory as E Drive, User - Job Name as Roll No., Ex. No. – Click Run.
PREPROCEDURE
1. Preference – Thermal - h-Method -Ok.
2. Preprocessor - Element type - Add/Edit/Delete – Add – Solid, Quad 4 node 55 – Ok– Close
– Options – plane thickness –Ok.
3. Real constants - Add/Edit/Delete – Add – Ok – THK 0.5 – Ok –Close.
4. Material props - Material Models –Thermal – Conductivity – Isotropic – KXX 10 –Ok.
5. Modeling – Create – Areas - Rectangle – by 2 corners – Enter the coordinate values, width
-Ok.
6. Meshing – Mesh tool – Areas, set – select the object – Ok – Element edge length 0.05 -
Ok – Mesh tool- Tri, free - mesh – Select the object–Ok.
SOLUTION
7. Solution – Define Loads – Apply – Thermal – Temperature - On lines – Select the right and
left side of the object –Ok – Temp. Value 100 – On lines – select the top and bottom of
the object – Ok –Temp 500 –Ok.

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8. Solve – Current LS – Ok – Solution is done –Close.
POSTPROCEDURE
9. General post proc – Plot results – Contour plot – Nodal solution – DOF solution – Nodal
Temperature –Ok.
FOR REPORT GENERATION
10. File – Report Generator – Choose Append – OK – Image Capture – Ok -Close.

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RESULT
Thus, the conductive heat transfer analysis of 2D components was done and evaluated by
using the ANSYS software.

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CONVECTIVE HEAT TRANSFER ANALYSIS OF A 2D COMPONENTS
EXPERIMENT NO 8
Date:
AIM: To conduct the convective heat transfer analysis of a 2D components using ANSYS
software.
SYSTEM CONFIGURATION
Ram: 16 GB
Processor: AMD A10 PRO-7822B R7
Operating System: Windows 10 Pro
Software: ANSYS 16.2
PROCEDURE
The three main steps to be involved are
1. Preprocessing
2. Solution
3. Postprocessing
Start - All Programs – ANSYS 16.2 - Mechanical APDL Product Launcher – Set the Working
Directory as E Drive, User - Job Name as Roll No., Ex. No. – Click Run.
PREPROCEDURE
1. Preference – structural - h-Method -Ok.
2. Preprocessor - Element type - Add/Edit/Delete – Add – Solid, Quad 4 node 55 – Ok– Close.
3. Real constants - Add/Edit/Delete – Add –Ok.
4. Material props - Material Models –Thermal – Conductivity – Isotropic – KXX 16 – Ok.
5. Modeling – Create – Key points - In active CS – enter the key point number and X, Y, Z
location for 8 key points to form the shape as mentioned in the drawing. Lines – lines -
Straight line - Connect all the key points to form as lines. Areas – Arbitrary -by lines - Select
all lines - ok. [We can create full object (or) semi-object if it is a symmetrical shape]
6. Meshing – Mesh tool – Areas, set – select the object – Ok – Element edge length 0.05 -
Ok – Mesh tool- Tri, free mesh – Select the object–Ok.

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SOLUTION
7. Solution – Define Loads – Apply – Thermal – Temperature - On lines – Select the right and
left side of the object –Ok – Temp. Value 100 – On lines – select the top and bottom of
the object – Ok –Temp 500 –Ok.
8. Solve – Current LS – Ok – Solution is done –Close.
POSTPROCEDURE
9. General post proc – List results – Nodal Solution – DOF Solution – Nodal temperature–
Ok.
10. Plot results – Contour plot – Nodal solution – DOF solution – Nodal Temperature –Ok.
FOR REPORT GENERATION:
11. File – Report Generator – Choose Append – OK – Image Capture – Ok -Close

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RESULT
Thus, the conductive heat transfer analysis of 2D components was done and evaluated by
using the ANSYS software.