content seminar for engineering and technology.pptx

technical concepts

1. Chiplet Technology: Architecture, Evolution, and Future Seminar Presentation Presented by: Bhanu A. Nair B.Tech, Electronics and Communication Engineering

2. Introduction Chiplets are smaller functional blocks of a system-on-chip (SoC). They allow integration of multiple dies into a single package. Emerging as a solution to limitations of monolithic SoCs. Benefits: flexibility, cost-effectiveness, heterogeneous integration.

3. History and Evolution 1990s-2000s Origins: Evolved from multi-chip modules (MCMs) in the 1990s–2000s; gained traction in 2010s for heterogeneous integration 2017 AMD’s EPYC processors introduce Infinity Fabric to link chiplets 2018-2019 Intel’s Foveros (3D stacking) and EMIB (2.5D bridges) for efficient interconnects 2020s Standardization with UCIe alliance (2022) by Intel, AMD, TSMC; widespread in AI chips like NVIDIA Blackwell Recent Focus on yield and cost, with academic studies on thermal management (e.g., Kang et al., 2018)

4. Architecture of Chiplets Components: Compute chiplet, Memory chiplet, I/O chiplet, Interconnect Comparison with Monolithic SoC: - Chiplets: modular, scalable, better yield - Monolithic: large die, yield issues, limited scalability

5. Interconnect Technologies AMD Infinity Fabric (2017): high-speed interconnect Intel Foveros (2018): 3D stacking technology Intel EMIB (2019): 2.5D embedded bridges UCIe (2022): industry-wide standard

6. Advantages of Chiplets Improves scalability and flexibility Reduces manufacturing costs and increases yield Enables heterogeneous integration Supports power/performance optimization

7. Challenges in Chiplet Design Thermal management (heat dissipation issues) Interconnect latency and bandwidth concerns Design complexity (multi-vendor integration) Lack of universal standards until UCIe (2022)

8. Applications High-performance CPUs – AMD EPYC, Intel Xeon GPUs – NVIDIA Blackwell AI accelerators for data centers Cloud & HPC (High-Performance Computing) systems

9. Future Trends Widespread adoption of UCIe standard Advanced 3D stacked heterogeneous systems AI in chiplet design automation Expansion into consumer electronics and IoT

10. Conclusion Chiplets = future of semiconductor design Overcome limitations of monolithic SoCs Key driver for AI, HPC, and next-gen computing Ongoing research in interconnects, thermal, yield improvement

11. References IEEE Xplore Digital Library Blogs: SemiEngineering, AnandTech Company reports: AMD, Intel, TSMC, NVIDIA Research papers on chiplet architectures and UCIe

12. Q&A Thank you! Any questions?