Minimal Fab for Semiconductor Fabfrication.pdf

Semiconductor

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Room-sized Minimal FAB
Traditional MAGA FAB
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77
200m
2m
10m
0.3m
Minimal Manufacturing Technologies Minimal Manufacturing Technologies
Saving energy&resources, cost, but high performance Saving energy&resources, cost, but high performance
No clean room
wafer size: 0.5”
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88
12” 8” 6” 4”
0.5”
1chip
80chips
180chips
300chips
1975~
1980~
1991~
2001~
2010~
18”
700chips
MAGA-trend
Minimal way
2020?
1600chips
Estimated by a chip size of 1cm
2

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Assembly
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1 wafer/min
1,000 chips/min
Transistor Processes
JISSO Processes
half-inch wafer
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1 wafer/min
5:1& 5:1&
5:1&
5:1&
1,000products/min
1 chip/min
1 chip/min
1 car/min
1 body/min1~10 parts/min

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Assembly
Machining is high cost.
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Machining is better.
Nanotechnology
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Machining is must.
Note that “Machining” here is
Chambers for chemical processes,
not mechanical machines.
Cell production system
Wafer process
(+MEMS£
¢Dicing, Molding, Packaging, ... £
(Atom and Molecules)

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Minimal Hermetic-Seal Transfer System
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Minimal
Lithography
Minimal
Plasma
Minimal
I/I
Minimal
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Minimal
Analyzer
Minimal
High-tech.
Analyzer
Minimal
High-tech.
Process
minimal PLAD
minimal PLAD
minimal PLAD
Minimal
Inspection
minimal PLAD
Minimal
High-tech.
Fabrication
minimal PLAD
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minimal PLAD
minimal PLAD
Minimal
Specific
process
Minimal
Specific
Process
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MInimal
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Minimal
Wet Cleaner
minimal PLAD
minimal PLAD
minimal PLAD
minimal PLAD
minimal PLAD
minimal PLAD
minimal PLAD
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Ultra rapid RD, and P
Minimal Shuttle

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Flow Flow Flow Flow Flow Job Job Equipment layout
1 1 1 32 350 7,500 17,000 Wafers of work in progress (wafers)
Litho-less Litho-less Mask-less Litho-less Mask-less 34 34 number of Masks
~30 32 350 32 350 500 600 number of Processes
Minimal Minimalnanotech Present Present Improved Present Type of manufacturing processes
100%
500$
250,000$
2x10
-6
500
0.057
18 hours
90%
250,000$
20
0.2%36$
300,000$
7x10
-6
1,400
0.17
8 hours
90%
300,000$
20
5m

Pilot FAB
Multiple process per equipment
120 days 32 hours 17 hours 10 days 30 days Days for production
Production FAB
One process per equipment
100%
36$
300,000$
4x10
-5
8,400
1
50%
450,000$
32 1 system 350 100 300 Number of equipment
90% 40% ~1% ~1%
Wafer operation rate
(process time/total time)
100% 0.2% 0.2% 0.1% Efficiency of resources
100,000$
1.7$
29$
12$
Chip price (Sales / produced chip no.)
300,000$ 0.5M$ 0.2B$ 10B$ Sales
1.5x10
-8
0.1% 3.5% 70% Capacity for PC Mass product
3
0.5million
7million
140million
Year capacity (1cm
2
chip)
4x10
-4
24 1,000 17,000 production capacity (300mm)
10$ 0.5M$ 0.1B$ 5B$ Factory investment
- 30cm 1m 3m Width of an equipment
1 1 300 600 Chips/wafer (1chip=1cm
2
)
0.5"
0.5"
8"
12"
Wafer diameter
1m

10m

30m

150m

Fab area
Desk-top
FAB
Room-sized FAB
Mini-fab
(HALCA)
project
Present
Mega FAB
Assumption
·cycle time=1min/wafer
·processes=500(metal 8 layers)
·design rule=90nm
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1717
Version: August 22, 2010.

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Parts, materials
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Takashima
Hitachi Toshiba Olympus Murata Manufacturing Omron
to create ideal fab-system in the 21th century
1818
Taisei Asahikogyosha
Nanotech Design Network KOYU Unimac
Uni3 system
Ochanimizu IPB KATO EML
Yokohama Nat. Univ. Univ. of Tokyo Waseda Univ. Nagano PGIRC.
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founded on 2010.1.
AIST Consortium
Sanmei Okamoto Glass CKD Fujikin
Logic Research
Pre-tech Litho Tech Japan PMT Shin-Etsu Polymer
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Sanyo Semiconductor manufacturing
Dainichi Shoji
SHOEI Engineering
JEM
Fujikoshi machinery
FUJI IMVAC
Komatsuseiki Kosakusho
TAKEWA PO
TOOLJEDAT
Asbil
NEC
Hokkaido Univ. Kyushu Univ.
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