PCB DESIGNING & MANUFACTURING

PCB DESIGNING & MANUFACTURING.
designing with CAD eda software and fabrication of pcb
view mate software

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CHAPTER -1
Overview of the Industry

Printed circuit boards (PCB) are one of the most important parts of electrical and electronic
devices. The increasing of integrated circuits, higher Packing density and smaller layout-
dimensions make high demands on PCB - manufacture.

1.1 Why PCB?
PCB Stands for "Printed Circuit Board." A PCB is a thin board made of fiber glass,
composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto
board, connecting different components on the PCB, such as transistors, resistors, and integrated
circuits.
There is a good improvement in the manufacturing of printed circuit boards over the past five
years. In printed circuit boards a new type of boards is developing right now i.e. 3d printed
circuit board.
Benefit’s General description
1.Environmentally friendly People want to preserve the earth’s resources
and reduce pollution; and to protecting the
environment.
2. Reliable, affordable and efficient. Printed circuit board are of low cost and
reliable. They are of low costs and efficient.


1.2 Meeting a global challenge
Planning to expand to meet the competition from chaina and also produce high
technology printed circuit boards. As printed circuit boards are of the important part of both
electric and electronic industry. To meet the competition from other countries we need to expand
our market and to produce high quality printed circuit boards which are reliable, affordable and
efficient.

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1.3 THE FUTURE OF PCB
What’s the future of printed circuit board? With demand continually increasing,
along with the need for new and clean sources, printed circuit board will definitely be an
important part of the future electronic industry. Developments in India illustrate that printed
circuit board is poised to soon become an important part of electronic industry.
The miniaturization of electronic products continues to drive printed circuit board manufacturing
towards smaller and more densely packed boards with increased electronic capabilities.
Advancements beyond the boards described here include three-dimensional molded plastic
boards and the increased use of integrated circuit chips. These and other advancements will keep
the manufacture of printed circuit boards a dynamic field for many years. But there is a good
improvement in the manufacturing of printed circuit boards over the past five years. In printed
circuit boards a new type of boards is developing right now i.e. 3d printed circuit board.

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Chapter -2
OVERVIEW OF THE COMPANY
2.1 ABOUT COMPANY
Sulakshana circuit limited is a leading Indian manufacturer of double sided and multilayer pcb
since 1990.It has quality customers in India and Europe. The major customers of sulakshana
circuits are Honda, Bajaj, TVS, BDL (Bharat dynamics limited), BEL (Bharat electronics
limited).SCL was established by Canadians of Indian origin in 1988with technical collaboration
of lazar tech (Canada).Sulakshana circuits limited provide a good quality of printed circuit board
and satisfy the customer requirement.SCL has experienced management, skilled manpower and
is led by Canadians and Americans of Indian origin. Industries served include automotive
electronics, instrumentation and control, railways, telecommunications, medical, aerospace,
defence, consumer electronics and contract electronics manufacturing.SCL utilizes high quality
imported materials, modern manufacturing processes, experienced managers, skilled personnel
and imported capital equipment to produce the highest quality boards for the lowest possible
costs.

Sulakshana circuit limited manufactures single sided, double sided and multi layer printed circuit
board. It is one among the top ten companies in India and produces a good quality of printed
circuit board and supplies to the customer in time and achieves the utmost the customer
satisfaction. They aim to achieve total customer satisfaction through manufacture and supply of
professional graded printed circuit boards conforming to the customer requirements. They strive
to attain a reputation for best manufacturing products and quality through continual improvement
of their processes and products. They are continually upgrading the machinery with the
technology changes and customer requirements.
There are different sections in the company and all the sections achieve their tasks in time and a
good quality product to the customer in time. There is a supply chain management process in

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sulakshana circuit limited. All departments together bring a good quality product in the end. SCL
is in the middle of an ambitious, multi-year growth plan
2.2 Quality policy of the company
They aim to achieve total customer satisfaction through manufacture and supply of professional
graded printed circuit boards conforming to the customer requirements. They strive to attain a
reputation for best manufacturing products and quality through continual improvement of their
processes and products. They are continually upgrading the machinery with the technology
changes and customer requirements.
There are different sections in the company and all the sections achieve their tasks in time and a
good quality product to the customer in time. There is a supply chain management process in
sulakshana circuit limited. All departments together bring a good quality product in the end.

2.3 AWARDS & RECOGNITION
 Winner of the prestigious ZERO DEFECT APPRECIATION FROM BEL (BHART
ELECTRONICS LIMITED)
 Best manufacturing industry for the year 1992 and 1993
 Stood one among top ten companies in printed circuit board manufacturing companies in
India.

2.4 PRODUCTS
Sulakshana circuits Manufactures three types of printed circuits boards .They are single sided ,
double sided and Multi layer printed circuits boards.

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CHAPTER- 3 PCB RELATIONSHIP
3.1 How PCB is related to electronic engineering?
 Electronics engineering is an engineering discipline which utilizes non-linear and active
electrical components (such as electron tubes, and semiconductor devices,
especially transistors, diodes and integrated) to design electronic
circuits, devices and systems. The discipline typically also designs passive electrical
components, usually based on printed circuit boards.
 Term "electronic engineering" denotes a broad engineering field that covers subfields
such as electronics, digital, consumer electronics, embedded systems and power
electronics. Electronics engineering deals with implementation of applications, principles
and algorithms developed within many related fields, for example solid-state
physics, radio engineering, telecommunications, control systems, signal
processing, systems engineering, computer engineering, instrumentation
engineering, electric power control, robotics, and many others
 In the field of electronic engineering, engineers design and test circuits that use
the electromagnetic properties of electrical components such as resistors,
capacitors, inductors, diodes and transistors to achieve a particular functionality.
The tuner circuit, which allows the user of a radio to filter out all but a single station, is
just one example of such a circuit.
3.2 How PCB is related to VLSI?
 In designing an integrated circuit, electronics engineers first construct
circuit schematics that specify the electrical components and describe the
interconnections between them.
 When completed, VLSI engineers convert the schematics into actual layouts, which map
the layers of various conductor and semiconductor materials needed to construct the
circuit. The conversion from schematics to layouts can be done
by software (see electronic design automation) but very often requires human fine-tuning
to decrease space and power consumption. Once the layout is complete, it can be sent to

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a fabrication plant for manufacturing. Integrated circuits and other electrical components
can then be assembled on printed circuit boards to form more complicated circuits.
 Today, printed circuit boards are found in most electronic devices
including televisions, computers and audio players.
3.3 Design Rules for vlsi engineer:-
 Design rules specify geometric constraints on the layout artwork.
 Provide a communication channel between the IC designer and the fabrication process
engineer.
3.4 Objectives of vlsi:-
 To obtain a circuit with optimum yield.
 To minimize the area of the circuit.
 To provide long term reliability of the circuit.
3.5 Design rules represent the best compromise between performance and yield:
 More conservative rules increase yield.
 More aggressive rules increase performance.
 Design rules represent a tolerance that ensures high probability of correct fabrication -
rather than a hard boundary between correct and incorrect fabrication.













Vlsi enginner makes required tracks and
layout through software for integrated
circuits
Then send the design for fabrication
process. Final required device is obtained.
Pcb designing through CAD making
schematic ,components to
layouts,pcb layouts,gerbber views
Pcb manufacturing include
CAM work
application

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CHAPTER -4
INTRODUCTION OF PRINTED CIRCUIT BOARD
4.1 What is PCB?
PCB Stands for "Printed Circuit Board." A PCB is a thin board made of fiberglass, composite epoxy, or
other laminate material. Conductive pathways are etched or "printed" onto board, connecting different
components on the PCB, such as transistors, resistors, and integrated circuits.
In other words, A printed circuit board (PCB) mechanically supports and electrically
connects electronic components using conductive tracks, pads and other features etched from copper
sheets laminated onto a non-conductive substrate.

Fig. Double sided PCB after finishing components placement.
PCBs are used in both desktop and laptop computers. They serve as the foundation for many internal
computer components, such as video cards, controller cards, network interface cards, and expansion
cards. These components all connect to the motherboard, which is also a printed circuit board. While
PCBs are often associated with computers, they are used in many other electronic devices besides PCs.
Most TVs, radios, digital cameras, cell phones, and tablets include one or more printed circuit boards.
While the PCBs found in mobile devices look similar to those found in desktop computers and large
electronics, they are typically thinner and contain finer circuitry.

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4.2 HISTORY OF PCB:-
Development of the methods used in modern printed circuit boards started early in the 20th
century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to
an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of
plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch
method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal
onto a board through a patterned mask. Charles Durcase in 1927 patented a method of
electroplating circuit patterns.
The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working
in England around 1936. Around 1943 the USA began to use the technology on a large scale to
make proximity fuses for use in World War II. After the war, in 1948, the USA released the
invention for commercial use. Printed circuits did not become commonplace in consumer
electronics until the mid-1950s, after the Auto-Seemly process was developed by the United
States Army. At around the same time in Britain work along similar lines was carried out
by Geoffrey Dummer, then at the RRDE.

A PCB as a design on a computer (left) and realized as a board assembly populated with components
(right). The board is double sided, with through-hole plating, green solder resist and a white legend. Both
surface mount and through-hole components have been used. Before printed circuits (and for a while after
their invention), point-to-point construction was used. For prototypes, or small production runs, wire
wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit,
was John Sargrove's 1936–1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto
a Bakelite plastic board. The ECME could produce 3 radios per minute.During World War II, the
development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being
fired from a gun, and could be produced in quantity. The Central lab Division of Globe Union submitted a
proposal which met the requirements: a ceramic plate would be screen printed with metallic paint for
conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes

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soldered in place.
[33]
The technique proved viable, and the resulting patent on the process, which was
classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of
Electrical and Electronics Engineers (IEEE) awarded Mr. Harry W. Rubinstein, the former head of Globe
Union's Centralia Division, its coveted Cledo Brunetti Award for early key contributions to the
development of printed components and conductors on a common insulating substrate.
[34]
As well, Mr.
Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his
innovations in the technology of printed electronic circuits and the fabrication of capacitors.
Originally, every electronic component had wire leads, and the PCB had holes drilled for each
wire of each component. The components' leads were then passed through the holes
and soldered to the PCB trace. This method of assembly is called through-hole construction. In
1949, Moe Abramson and Stanislaus F. Danko of the United developed the Auto-
Assembly process in which component leads were inserted into a copper foil interconnection
pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army. With
the development of board lamination and etching techniques, this concept evolved into the
standard printed circuit board fabrication process in use today. Soldering could be done
automatically by passing the board over a ripple, or wave, of molten solder in a wave-
soldering machine. However, the wires and holes are wasteful since drilling holes is expensive
and the protruding wires are merely cut off.
From the 1980s small surface mount parts have been used increasingly instead of through-hole
components; this has led to smaller boards for a given functionality and lower production costs,
but with some additional difficulty in servicing faulty boards.
Historically many measurements related to PCB design were specified in multiples of
a thousandth of an inch, often called "mils". For example, DIP and most other through-hole
components have pins located on a grid spacing of 100 mils, in order to be breadboard-friendly.
Surface-mount SOIC components have a pin pitch of 50 mils. SOP components have a pin pitch
of 25 mils. Level B technology recommends a minimum trace width of 8 mils, which allows
"double-track" – two traces between DIP pins.

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CHAPTER- 5
MAKING OF PCB
5.1 How to make a PCB?
Today we are using different types of electronic devices like cell phones, landlines, televisions, laptops,
computers, printer, setup box, micro processors and micro controllers in different electronic applications,
in motor vehicles….etc many electronic equipments in industry are using PCB madden electronics.
For all this, there is a sequential method to make these equipments.
5.2 SEQUENTIAL METHOD: -
Sequential method is nothing but following sequence steps to make electronic application. This method
may be classified into four steps. They are given below.
1. PCB designing.
2. PCB manufacturing.
3. Components placement on PCB.
4. Electronic application output.
Let us explain each step how to make and how to forward to next step.
1. PCB designing: - in this step we have to decide how much quality and quantity PCB board is
necessary. This step is done in a software .PCB design means initially making a tracks or
schematic diagram for connecting a component without getting errors in tracks. This tracks or
layouts are making manually with the help of a tool name called CAD & CAM tools for PCB
designing. fig.PCB design with help
ofCAD&CAM.

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2. PCB manufacturing: - after finishing PCB designing, the design is sent to manufacturing
company. In this step we have to manufacture the PCB board with the help of raw materials and
some hardware technical works.

Fig. PCB initial step and final step of manufacturing process.

3. Component placement on PCB: - after receiving PCB board, now we have to place the
component in allotted section through auto or manual using latest technology.

Fig.after placing the components on PCB board.

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4. Electronic application output: - after finishing placement of component, we have to give
required support to the device like covering with plastic cover, securing from outer source,
connecting outer required devices with wires etc. final PCB electronic device is given below.

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CHAPTER -6
Types of PCB’s
6.1 Classification of PCB’s
Depending upon requirement generally PCB may be three types. They are given below
I. SSB (single side bond) PCB.
II. DSB (double sided bond)PCB.
III. ML (multi layer bond)PCB.

6.2 SSB(single side bond) PCB:-
In PCB which has only one side copper layer is called SSB PCB. Other side is insulated
material. That means we have only one sided copper to manufacture the device, other
side is leaving because copper is good conductive material where as other is not.

6.3 DSB(double sided bond)PCB:-
In PCB which has two side copper layers is DS PCB. In this type of PCB, it have three
layers. Both ends have copper coated material and middle part is insulating materials.
Hence we can use both ends for design, manufacturing and components placement. For
this copper claded material manufacturing will discuss in next chapter.

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6.4 ML (multi layer bond) PCB: - in PCB which has more than two copper layers is
called M L PCB. In this type copper is placing in different required layer. It is typical
designing and manufacturing process, so present this material is using rarely


From the above types of PCB, this are using now a day’s mostly, other than this there are many types but
that are not using any more.

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CHAPTER -7 PCB DESIGNING
7.1 What is PCB designing?
PCB design means initially making a tracks or schematic diagram for connecting the components
without getting errors in tracks. This tracks or layouts are making manually with the help of a software
tool name called EDA tools for PCB designing.
 In PCB designing, we have software called EDA SUITE. EDA means electronic design
automation.
EDA suite is a concentration of two terms CAD&CAM.
1. CAD means computer aided design.
A system where engineers create a design and see the proposed product in front of them on a graphics
screen or in the form of a computer printout or plot in electronics, the result would be a printed circuit
layer.
Example for EDA CAD suite are kicad eda suite, eagle eda suite etc.
There are many software’s available in market the main popular software’s are ki-cad eda suite.
2. CAM means Circuit CAM is a Computer Aided Manufacturing (CAM) system for Printed
Circuit Boards (PCB) and other related technologies from LKSoft. It is supporting technologies for both
prototyping and line production.
Example for EDA CAM suite are cam designer for cam work, target cam eda suite etc.
Before us making PCB designing, we have to plane about the application of the device example let us
know about device name called mobile, in mobile we required small size of pcb boarded, as in making
process will doing this small pcb takes more time for each device to making. So we have to design the
device with large pcb board, then this board will be divide into smaller size according to over required
pcb boarded. Hence by this we can reduce the cost and time.




CHAPTER-8

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CAD DESIGNING
8.1 What is CAD designing?
Computer-aided design (CAD) is the use of computer systems to assist in the creation,
modification, analysis, or optimization of a design. CAD software is used to increase the
productivity of the designer, improve the quality of design, improve communications through
documentation, and to create a database for manufacturing. CAD output is often in the form of
electronic files for print, machining, or other manufacturing operations.
Computer-aided design is used in many fields.
1. Its use in designing electronic systems is known as electronic design automation, .
2. In mechanical design it is known as mechanical design automation (MDA)
or computer-aided drafting (CAD), which includes the process of creating a technical
drawing with the use of computer software. CAD software for mechanical design
uses either vector-based graphics to depict the objects of traditional drafting, or may
also produce raster graphics showing the overall appearance of designed objects.
However, it involves more than just shapes.
3. As in the manual drafting of technical and engineering drawings, the output of CAD
must convey information, such as materials, processes, dimensions, and tolerances,
according to application-specific conventions.
CAD may be used to design curves and figures in two-dimensional (2D) space; or curves,
surfaces, and solids in three-dimensional (3D) space.
8.2 Applications of CAD in different sectors:-
1.CAD is an important industrial art extensively used in many applications, including
automotive, shipbuilding, and aerospace industries, industrial and architectural
design, prosthetics, and many more.
2.CAD is also widely used to produce computer animation for special effects in
movies, advertising and technical manuals, often called DCC digital content creation., CAD has
been a major driving force for research in computational geometry, computer graphics (both
hardware and software), and discrete differential geometry.

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The design of geometric models for object shapes, in particular, is occasionally called computer-
aided geometric design.
8.3 How CAD can be design?
We can learn CAD design with the help of KiCAD software.
8.4 About KI-CAD eda suite software:-
 KiCad is an open source software suite for Electronic Design Automation (EDA).
 KiCad provides a suite of programs for Schematic Capture, and PCB Layout
with Gerber output.
 The first release date was in 1992 by its original author, Jean-Pierre Charras, but is now
currently under development by the KiCad Developers Team. The suite runs on
Windows, Linux and OS X and is licensed under GNU GPL v2.
 Important points about KICAD:-
 With KiCad you can create schematic diagrams and printed circuit board up to 16
layers. KiCad comes with a rich set of libraries with 3D models as well.
KiCad is a mature EDA software tool under active development by a team of developers
and a vibrant user group. KiCad team counts three main developers and a dozen of
regular contributors.

KiCad includes a project manager and four main independent software tools:
1.Eeschema,- schematic editor.
2.Pcbnew, -printed circuit board editor.
3.Gerbview,- GERBER file viewer.
4.Cvpcb, -footprint selector for components association.

KiCad in 4 Steps

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KiCad allows you to develop your printed circuit board via three interconnected and independent main
applications: Eeschema, Cvpcb, Pcbnew,gerbiview. This is, simply put, done in three steps.
STEP 1, schematic capture. With the KiCad schematic editor Eeschema, you can create a sophisticated
electronic sheet or a group of hierarchical sheets. Several schematic components come with the default
KiCad library. A Electrical Rules Check tool (ERC) is available.
STEP 2, component association. Pcbnew allows you to associate each single schematic component with
its footprint component. A very large component footprint library comes with KiCad.
STEP 3, PCB layout. The Pcbnew board editor can handle up to 16 copper layers plus 12 technical
layers (silk screen, solder mask, etc.) and allows you to layout the final printed circuit board.
STEP 4, Gerbicview.For the generation of the necessary compliant files for manufacturing your printed
circuit board (GERBER files for photo-plotters, drilling files and component location files) Pcbnew and
Gerbview are used. Postscript or PDF file generation is also possible.

After generating tracks, schematic capture, component association,pcb layout,gerbiview.
Kicad software will generates
After generating all this circuit will send to CAM working zone.

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8.5 Designing using KICAD software with example:-
We will be considering a simple a stable multivibrator circuit using 555 timer IC.
We will be designing a pcb for this well known simple circuit.
Simple a stable multivibrator circuit using 555 timer IC. Circuit diagram is given below

Astable Multivibrator can be designed by using 555 timer IC, Op Amps and also using transistors.
The 555 IC provide accurate time delay from mille seconds to hours.The frequency of oscillation can be
controlled manually by simple modification.
555 is suitable for circuit designers with a relatively stable, cheap, and user-friendly integrated
circuit for both monostable and astable applications.The 555 timer IC was first introduced
around 1971 by the Signetics Corporation as theSE555/NE555.This is a simple 555 timer circuit
project. Astable Multivibrator is simply an oscillator circuit that produces continuous pulses. The
frequency can be controlled by changing the values of R1, R2 and C1.
1. NE 555 or SE 555
2. Resistor (1MΩx2, 1KΩ)
3. Capacitors (0.01Fµ, 1Fµ)
4. LED

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8.6 The kiCAD software mainly has the following utilities:
1. Eeschema - Schematic editor
2. Cvpcb - Components to modules
3. Pcbnew - Pcb editor
4. Gerbview - Gerber viewer

The main window of the kicad looks like this:

 Your recent project might have been listed in the project tree. To start a new project selects the
“New Project Descry”. The most important thing that you should take care of is that, all the files
generated by while doing the project should be saved in a single folder, and the title of all the files
should be the same.
o So let us save this new project in our project folder. The extension should be .pro

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Let us start with editing the schematic.
8.7 Editing the schematic
 Now you need to convert the required circuit diagram into the schematic in kicad.
 For that you need to select the schematic editor.The schematic editor window is shown below:


 Before start drawing the schematic, we have to do a few important things;
 Page settings – To set the page size, title etc.
 Page settings window: When you press OK, you can see the title of your work sheet has
been changed like this: Now we need to set the preference General options window: Press
OK and then save the preferences: To make our design process faster we have to use a lot
of shortcut keys. We can have a list of currently using shortcuts like the following.
Current hotkey list:

 Now we have set most of the necessary things, so we can start drawing the schematic.
 It’s all about selecting the right component, placing the component, connecting them and do the
annotation.

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 First we add all the components. To add a component to the worksheet, press A, and the
component selection window will open up. If you know the key word for the component, just
enter the key word and press OK.
 The key word for resistor is R and the capacitor is C, like thatComponent selection window:

 Use insert key to add the same component again. Press M to move a component after placing the
cursor on it. Use ctrl + scroll to move entire page left/right, shift + scroll to move the entire page
up/down

 So far we have added the resistors and capacitors to the schematic, now we have to add the 555
IC, LED and 3 pin connector. If you don’t know the key word of the component you can use “by
library browser” button, which will list you all the library components.

 Once you have selected the required component you can use the export to schematic link
to add the component to your schematic.
 Selecting 555 IC from the component list:

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When you finish adding the components for the particular circuit, the schematic editor will look like this.

Now we need to do the connections. You can keep the cursor at any point and press W to add a wire.

 After you have finished the connections, it would be better if you add some text labels at
the necessary areas. You can do that by using the T button as shown in the above figure.
 Now our schematic diagram is almost finished. Next step is to annotate the components. We can
automatically annotate the components using schematic annotation button. It will open up the
following window..Press annotate key to automatically annotate the components.

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Our finished schematic will look like this:

 For this particular tutorial it is not important whether the circuit is correct or not, all I’m
trying to explain you nothing but, how to convert your circuit to a pcb.
 Now if you wish you can do the ERC (Electric Rules Check) using the “schematic electric rules
check” button.Press “Test Erc” button for the following window:

 If there are errors, which mean you have violated some rules. The errors will be shown in
the schematic using markers and you can easily identify and correct those errors. If you

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have no idea about the ERC, don’t worry, it is not going to affect most of the simple
circuits in anyway.Now you must save the schematic .
 Components to modules .
Next step is to generate a netlist of the components using “Netlist generation” button:

 Click the button “Netlist” for the following window:

 Save the netlist file using the extension .net:
 Now run cvpcb by to convert the components to modules which we can use, while we actually
design the circuit board:
 The cvpcb window will look like this.For each component listed we must select the required
footprint. It would be better if you list the entire footprint without filtering:

 How could I identify which footprint will be appropriate for a particular component??

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 Which all footprint you will select, it should match up with the physical dimensions of the
components in your collection. You can view the entire available footprint in a pdf format using
the button as shown below.
Here is the footprint in detail:

If you want to see the component in 3D, you can press the 3D button.3D view of the component:


Close both the windows and double click the required footprint to get it selected. If you finish
selecting the footprints, the page will look like the following:

 Save the netlist using the save button:
 Now run the pcb editor using the button “Run Pcbnew” either from schematic editor or from the
main window.

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8.8 PCB Editing
Here is the PCBNEW window:

 Before we proceed further I recommend you to do the required page settings like we have done
for the schematic editor. After that it would be better if we draw an initial outline for the board,
which we may change later if required.Select the current working layer as “Edges Pcb”.

 Use the graphic line button to draw the edges. You can set the coordinates at any corner as both
zero by keeping the mouse pointer over it and pressing the space bar. Double click to finish the
outline as you complete drawing it.Here I’ve drawn a square outline for the pcb.

 Now we are going to link the schematic and the pcb editor by reading the netlist.
 Press “read” button for the following window.In the following figure you can see that the
modules corresponding to the components in the schematics have been added to the pcb editor.
Now press the cancel button.Now arrange the components by moving them into appropriate
positions and orientations. Use M to select a component to move with the cursor.

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After rearranging the components:

 Now it seems that the outline of the pcb is too large for the circuit. Now I will show you
how to delete items, in this case we are deleting the outline only..Drag the cursor across
the block holding the left button down and then release so that the entire block will get
selected. Now right click and select the option delete block.
 For this particular case, select the “include edge layer” and press OK. You can use the
same technique to delete the tracks, modules, zones, texts, drawings etc.
 After deleting the current outline, we will draw a much smaller one. After rearranging the
components and redesigning the outline, the pcb editor will look like this.

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 At this point you should make sure that your arrangement of components in the board is
physically realizable. If it is not, you will run into a lot of troubles while assembling the
components. In order to avoid such issues, there is an option for the 3D view of your board. Click
the 3D display button.

 If you are happy with the arrangement of the components in your board, you can startrouting.
 Before that you have to set a few things. Go to general options, where you can set the number of
layers required, maximum links shown etc.I’m going to make a 2 layered board, which is actually
not required for this simple circuit, but I can show you how to add vias and adding tracks in both
the layers. Press OK button to save the settings.
 Now we will be working mainly on the two important layers of our board
1. Copper layer – normal bottom layer if we consider a single layer board, where we do the soldering.
2. Component layer – The opposite side of the board, where we place the components.
Now your pcb editor window will look like this.

 You can click on any pins to highlight the corresponding connected pins after you have clicked
the “Net highlight” button as shown above.
 In the following pins a set of highlighted pins are shown. Now you can add tracks connecting
those pins using the “Add tracks and vias” tool. Make sure that you have selected the “Copper
(page up)” from the drop down list as marked in the figure.

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 Now you can place track connecting the pins. Use END key to release the track once you
have reached the end point.

 In the following figure it is shown that I’m having trouble connecting the pin7 and the
pins of two resistors R2 and R1.

 So I’m going to place a part of the track in the component layer and connect the rest in
the copper layer through vias.First connect the two ends of the resistors normally. Now
start adding track from pin 7, and once you have reached the point where you wish to add
the via, right click and select “place Via” or just press V.

 Now you can just route through the component layer and connect both the parts through
another via as shown in the following figure.

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 Keep in mind that your component’s pin can also act as a via, as it is Printed Through Hole
(PTH), connecting both the layers.I’ve finished routing and my design is shown below.

Now let us have a 3D view of our board.





Generating Gerber file
 Select plot after clicking the file, to open the plot window. Do the things in the plot window as
shown in the following figure:

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 Now go to the main window and click the “gerbview” button to open up the Gerber viewer.The
following figure shows the Gerview window. Select “Load Gerber file”Let us view the copper
layer first.
Gerber view for the copper layer:

 In order to view another file without mixing the view with the previous one, use the option
“Clear and Load gerber file”.This time we select the component layer:The Gerber view of
component layer will look like in above figure.In order to view all the layers at once use the
option “Inc Layer and Load gerber file”.Gerber view of the selected layers will look like the
following:Now you select the option “Save setup”.

 Save the gerview file as the extension. cnf now clicks the save button and we finished.
Next step is to send the Gerber files to your PCB manufacturer. Which all files you have
to send depends on the pcb manufacturing process they have.

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8.9 Important point:-
I. While opening Ki-CAD, it’s better to disable the internet access because software will be
directly access to web browser.
II. During Ki-CAD standing, we have to save each and every file like given below
a. Save project desc and save project files.
b. In schematic editor, we have to save schematic project,save current sheet and save
current sheet as “xxx.sch”. save prefaces and plot post script,HPGL,SVG .
c. In cvpcb(components to modules), we have to save as “xxx.net” file.
d. In pcb new (pcb editor), at post process we have create modules pos, create drill
file, create cmp files. We have to save as “xxx.brd” file.
e. In gerber view, we have save “xxx.whl” file.
With this over CAD working is finished. This design is send to PCB manufacturing and there for
the convenience they modify CAM work.
So requirements for the CAM file is is specified formats they are
a) Gerbber format.
b) Excellon format.
These files have to send to CAM work for pcb manufacturing.

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CHAPTER -9
CAM (computer aided manufacturing) working zone for PCB manufacturing
9.1 What is CAM working zone?
Computer Aided Manufacturing (CAM) system is a software for Printed Circuit Boards (PCB) and other
related technologies. It is supporting technologies for both prototyping and line production.
CAM is the use of computer software to control machine tools and related machinery in
the manufacturing of work pieces.

9.2 CAM applications in different fields
 primary purpose is to create a faster production process and components and tooling with more
precise dimensions and material consistency, which in some cases, uses only the required
amount of raw material (thus minimizing waste), while simultaneously reducing energy
consumption. CAM has been considered as a numerical control (NC) programming tool, where
in two-dimensional (2-D) or three-dimensional (3-D) models of components generated
in CADAs with other “Computer-Aided” technologies, CAM does not eliminate the need for
skilled professionals such as manufacturing engineers, NC programmers, or machinists.
 CAM, in fact, leverages both the value of the most skilled manufacturing professionals through
advanced productivity tools, while building the skills of new professionals through visualization,
simulation and optimization tools.

9.3 Working of CAM working zone:-
 CAM has been considered as a numerical control (NC) programming tool, where in two-
dimensional (2-D) or three-dimensional (3-D) models of components generated in CADAs with
other “Computer-Aided” technologies, CAM does not eliminate the need for skilled professionals
such as manufacturing engineers, NC programmers, or machinists.
 CAM, in fact, leverages both the value of the most skilled manufacturing professionals through
advanced productivity tools, while building the skills of new professionals through visualization,
simulation and optimization tools.
In cam work, cam convert the cad to d- file.
The supported manufacturing processes are:

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a. inspection of layout data including design rule checks
b. penalization and creation of galvanic frames
c. data preparation for photo-plotter
d. conventional milling and drilling (contour routing), including optimization of tool-paths
e. insulation milling for prototyping
f. Laser cutting, drilling, and structuring, including Laser beam correction and optical scanners
g. SMT stencil and SMT pad optimizations
h. package and footprint recognition with library
i. generic geometric data engine for all kinds of custom requests.
After finishing CAM work, the design will send for manufacturing process.

9.4 How CAM working?
CAM can be implemented in software. So we have to install over required software which are available in
market. The software like view mate, circuit cam viewer, Collin cam etc.
 CAM can required two types of formats. They are gerbber and excellon format.
 CAM can generate excellon formats of drilling holes and routing pads.
 CAM can generate gerbber formats of dry film PIT, solder masking PIT, legendprinting.
Here we can explain with example through software called VIEWMATE.
9.5 View mate through example:-
Now we can take an device as example the device name is Arduino-ethernet. Here we don’t required circuit
diagram but we can display the final device given below.

 View mate can generate all over requirements but before starting ,first we have to plan as per
customer and over standard dimensions.
 Let us take over customer given device dimensions is 8.55x5.55cm. it is smaller section. So as per
over requirement we have to set as over standard dimensions.

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 Over standard dimensions are 50x40cms. So we have to make many sections in same panel.This
dimensions can setted in VIEWMATE software.x-axis can be make 5 sections and y-axis make 6
sections in single panel. Remaining space 1.5cm can be dedicated to outline from panels around.
1.1cm space between x-axis of two sections and 0.8cm space between y-axis of two sections in a
panel.
 At the time of cutting we can cut the epoxy CCL with 50x40cms from 1240x1092.
 The panel is setted to the posalux with panels of boards.
9.6 Making of drilling holes with excellon format:-
 Follow the steps, open viewmateimportdrl file from placed folderopen file.
 Measure the dimensions of customer. Please select entire sheet of pcbselect stepandrepeat with
over required fields given above. Then figure is look like this.

Fig show after imported drl file and sizes of drill bitts are shown above.
 Now over required files are generated. Now we have to save and export to excellon format for
drilling purpose. This file is send to manufacturing CNC process. Making of routing is same.
Fig shown 3x2 sections in
a panel of drilling holes.

9.7 Making of legend printing through gerbber format:-
 Follow the steps, open viewmateimportsilkscmp.pho file from placed folderopen file.

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 Measure the dimensions of customer. Please select entire sheet of pcbselect stepandrepeat with
over required fields given above. Then figure is look like this

Fig show imported of cmp file.

Fig show sections in a panel.
 This file have to save and export to gerbber file then send to photo lab for printing photo resist.
This photo resist is send to legend printing.
9.8 Making of dry film through gerbber file:-
 Follow the steps, open viewmateimportcopper.pho file from placed folderopen file.
 Measure the dimensions of customer. Please select entire sheet of pcbselect stepandrepeat with
over required fields given above. Then figure is look like below given. This file is send to photo
lab for printing photo resist. This photo resist is send to dry film at PIT.

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Fig shows after imported and selected of total tracks of pcb.

Fig show deselected sections in a panel.
9.9 Making of solder masking at PIT through gerbber file:-
 The process is same as making of dry film. So I have just show the diagram.

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Fig shows solder masking at PIT.

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CHAPTER-10 PCB MANUFACTURING
After finishing CAM work, the FILES will send for manufacturing process. In manufacturing
process, the manufacturing steps are different for different printed circuit board .like single side,
double side, multisided pcb but the most common manufacturing process is given below.
10.1 PCB MANUFATURING PROCESS STEPS: -
CNC

CCL CUTTING,PINNING,
STACKING&DRILLING
WET PROCESSING DPS

PIT (D/F)
D/F LAMINATION
EXPOSE & DEVELOPING

WET PROCESSING
CU PLATING
RESIST STRIPPING
ELECTING & TIN STRIPPING
ETCHINGINSPECTION ETECHING INSPECTION
SCREAN PRINTING BRUSHING & S/M PRINTING
PIT(SM) EXPOSE (S/M), DEVELOPING
S M INSPECTION S/M INSPECTION
WET PROCESSING HAL
SCREEN PRINTING L P
CNC V-GROOVE & ROUTING
BBT FIXURE FABRICATION & TESTING
FINAL INSPECTION PCB INSPECTION
PPE PRE PRODUCTION
ENGINNERING,(DATA,
FILMS,PANALISATION, CAM WORK )
STORES RAW MATERIALS &GENERAL STORE
ACTIVITIES
MANITENANCE PLANT MAINTENCE

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10.1 Process Sequences for Single, Double and Multi-layer PCB
Single side PCB Double side PCB Multi layer PCB
File inspection File inspection File inspection
Drill data generation Drill data generation Drill data generation
Cutting Cutting Cutting
Drilling Drilling I/L Tooling Holes
Photo imaging DPS I/L Photo image
Etching Photo imaging I/L Etching
Solder masking PTH Oxide Treatment
HASL Etching Pressing
Legend print Solder Masking Drilling
V-grooving / routing HASL De smear
BBT Legend print DPS
FQC V-grooving / routing Photo image
Stores BBT PTH
FQC Etching
Stores Solder masking
HASL
Legend Printing
V-grooving / routing
BBT
FQC
Stores

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CHAPTER – 11
MANUFACTURING PROCESS
11.1 THE STEPS INVOLVED IN MANUFACTURING OF PRINTED CIRCUIT BOARD
ARE:-
1) Pre production engineering:- In this process , two steps are involved they are file
inspection and drill data generation, the engineers will generate through software
called CAM work zone. As we explained in above chapter. the engineer will generate
Circuit films, Solder Masking films, Legend Printing films at photo lab. Later these
generated films are taken for production. Before the board is manufactured in the photo
lab the circuit films, SM films, LP films are generated. It is called the pre production
engineering.
 The customer gives the original circuit and it is transferred on to the sheet in the photo
lab process i.e. pre-production engineering. After the tasks are completed in photo lab
then the film is taken for the exposing.

Fig3.1.a photo lab
DIAZO EXPOSING
 For circuit we use diazo film.
 The master film and diazo film are put in emulsion to emulsion contact in the exposure
and the exposure is turned on.
 The exposed diazo film is developed in the developer machine by bringing the emulsion
in contact with ammonia vapour, and then films are developed.
 Developed films are inspected and given for working to PIT.

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LITH EXPOSING
 For SM and LP we use lith films.If the originals are negatives take positive copy.
 The master film and lith film are put in emulsion to emulsion contact in the exposure and
the exposure is turned on.
 The exposed lith film is developed in the developer machine by bringing the emulsion in
contact with developer solution, and then films are developed.
 Developed films are inspected and given for working.Inspect SM films are given to PIT.

2) CNC computer numberical counter:-
 In the first manufacturing step of CNC(computer numberical counter ) , the materials
required are copper clade laminate, aluminum entry sheet, white tapes ,drill and router
bits, emery paper, smooth files.
 In this process we have using equipments like power sharing, stack master, wood
backend, banioun waste, cotton gloves, tooth brush, DNC(data numerical counter), CNC
driller(posalux), laminate, drill bits and router bits, aluminum entry sheets , backup and
white tapes, emery paper, bunion waste, cotton gloves, smooth files, tooth brush, HSR
drill bits.
 In CNC process, CCL (copper clad laminate) is have to made into over customer required
size.
CCL MANUFACTURING: -

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 CCL has made up of chemical components which are resin and solvent both are
compounding with each other because to make material hard. Now this chemical
compounding will attach with glass cloth by the help of impregnation and drying now the
chemical compounding becomes sheeting. This sheeting have to do pre-preg. Now pre-
preg have to make ply-up. Now this whole process is known as “glass epoxy”.
 Now this glass epoxy and copper/iron(cu/f) has combined with each other as over
required.
 For example there is 3 types of single side,double side, multi-side pcb. So as over
required for single side pcb , we have to combine one side with glass epoxy and other
side with copper or iron.
 Same to double side and multi side pcbs .
 i.e for double side PCB, glass epoxy and around copper /iron coating . whereas multi
layer pcb is differ from others.
 For multi layer pcb, they have to arrange one after another, first they arrange glass epoxy
then coated with copper then again epoxy, as process repeat as over requirement.
 Maximum 38 layers have done upto now . construction of layers will be depends upon
thickness of copper
.
Fig. copper claded laminate with dimensions of 1245x1092 rectangle shape.
 Glass epoxy has thickness of 0.2,0.4,0.6,0.8,1,1.2,1.6,2.4,3.2 mm. thickness is measure
in microns.

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 Copper has thickness of standard sizes they are




 Single side pcbs have a standard thickness of pcb board they are
 1/0  35 microns
 2/0  70 microns
 Glass epoxy thickness of single side pcb is 0.8,1,1.6,1.2 mm.
 For double side and multi side pcbs , thickness of the standard sizes of CCL sheet .
o Length 1042x1245width
o 1245x1092
o 1245x1042
o 1245x942
 This sheet is packed with 10 nos and make a bandle.
 Now customer will given circuit which sheet size is L2.03X110.29B now wander will
plane how to generate required size of pcb.
 Let us take an example as 1245x1042 sheet ,thickness of 1.6microns , this 1245x1042
sheet will cut sizes of L230X5=1150 and width w 250x4=1000. Remaining sheet is
removed. Customer designed circuit size is 2.03x110.29, this will arrange the ciruit with
more number of circuit on same boarded. So that 4 panel will be necessary in 230x48
board.This CCL sheet is cutted with the help of POWER SHARING which consists of
blades with fixed sizes.
 Now this sheet is send to “PINING”
 Now other materials like backend sheet,aluminum entry sheet are also cutted in fixed
sizes . this are used at the time of drilling .
 H/H  17.5 microns
 1/1  35 microns
 2/2  70 microns

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Fig. power sharing with cutting of CCL
PINING:-(22-8-14 to 30-8-14)
 After receving from cutting , now the sheet is pining with the help of STACK MASTER
(barnaby) which consist of drill bit with standard size of 3mm in this company.
 This machine pins on both sides .
STACKING:-
 In stacking process, the panels have to arrange in a one bundle because while
drilling, to reduce the power consumption and time, we have to make this stcking
process.
 Stacking will be depends upon thickness of board, i.e for example
 1.6 mm  4panels can arrange in one bundle
 2.4mm  2
 0.8  5
 1  5
 Aluminum entry sheet is used because the copper boared will be damaged during the
process of drilling , so aluminu entry sheet is used as a protection to the panel board.
 Backend is used because will drilling the panels are shacking, so that damage will occurs
, to avoid such damages, backend is used.With this both aluminum sheet and backend
attach with bundles ,then send to drilling process.

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DRILLING PROCESS:-
 During drilling process, different industries use diff drilling process but at sulakshana
ciruit used specification drilling machines name called “POSALUX”, which has capable
of drilling spindles no -8 and it will runs with a posalux software. After generating code
for posalux, they insert a code to posalux software, posalux language is EXTELLOL .
 Pre production engineer will generate this code with the help of CAD work. After
inserting code to posalux, spindles starting working , before starting we have to insert
the drills to spindles. the drillers sizes will be starts from 0.3mm to 6.5mm.
 After inserting code and drillers, the work will starts and finished with required time.
 If any errors detected, automatically system will stops and after finishing error correction
by manually, the system work continuously. This is the process how to manufacture and
materials required at CNC. After this process, the boared is send to wet processing.

Fig posalux drilling machine with excellon software for viewer.

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3) Direct plating system DPS(wet processing):-

 It is the second step in the printed circuit board manufacturing.It is a direct
plating system.It is an electroless copper deposition. It is a chemical bath .There
will be a various combination of chemicals called shipyard chemicals.
 Before processing of this stage the holes are not conductive. After the completion
of this stage the holes are covered with palladium to make it conductive.
 In this process we required to converting the insulated material into a
conducting material by doing some electro less process. See in below fig.
 That means “palladium material” is forming the conductive layer on the surface of
the insulator.

Fig.showing ship yard chemicall which boared is dumbed in this bunks for various times.

 In direct plating system, the materials used in ship yard chemicals are sensitizer 5100B,
sensitizer 5123M,activator 5300R, activator 5300B,enchancer 5400,stabilizer
5600,microtech 5700A,microtech 5700B,Sulphuric acid, hydrogen peroxide etc. they are
different chemical have to used it depends upon customer required.

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4) Photo image transform PIT(D/F):-
In this process, it is important step in manufacturing process because transfer the image
from art work inspected and issued by the photo lab. Photo imaging process is done in
three stages.
I. lamination ,
II. Exposing ,
III. Developing
I. Lamination:-The whole board surface is laminated with a thin layer of
photosensitive/etch resist (Photo Polymer Film) either by a liquid process or as a film.
II. Exposing: - This resist layer is exposed to ultra-violet light through a photo tool (art
work), so that the uncovered area is polymerized and hardened. Unhardened photo resist
is removed by developing. The most commonly used phot resists are ‘negative’-working,
which means they polymerize on exposure with ultraviolet light and hence become
insoluble in a direct developer. Non-polymerized resist is removed by ‘developing’ to
expose copper areas ready for electroplating.

Fig showing laminating thin layer on board with help of achine and stacking the another
thin layer for exposing and checking the circuit with drilles.

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.
Fig exposing the dry film with machine which uv light exposing to boared.

III. Developing:-In the developing process the non-polymerized film is soluble in the
developing solution at certain concentration, pressure and speed of the conveyor. Then
the boards are rinsed with water and dried in the dryer is given below. dry film is
removed and washed with water and chemicals.

Fig after exposing, the board is look like this and next step is drying with dryer.
 The Mylar or dry film which protected the photo resist is now removed and the panel is
moved out of the clean room and through a developer which removes the unhardened
resist. For inner layers the copper pattern we want was covered by the resist. For outer
layers it is exposed ready to be plated. The panels should have the copper surface is clean
and all the unwanted resist has been removed. After finishing , the board is send to
electro plating at wet processing.

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5) Electro plating at wet processing or copper plating:-
 In this we electrolyte the boards with copper .The operator loads the panels on the flight
bars. Here we check for all the clamps to ensure good electric connection and a thin layer
of tin is added. The panels themselves act as cathode for electro plating. Next we
electroplate the boards with copper. The operator loads the panels onto the flight bars.
He checks all the clamps to ensure a good electrical connection. The panels themselves
act as cathodes for electroplating and we can plate the hole walls thanks to the conductive
carbon layer already deposited there. The operator starts the automated plating line. The
copper surface of the panels is cleaned and activated in a number of baths and then
electroplated.
 The whole process is computer controlled to ensure that each set or flight of panels stays
in each bath exactly the right amount of time. You can see the copper anodes in their
bags.
 To ensure good conductivity through the holes we need to plate an average of 25 microns
of copper on the hole walls. This means that we also plate 25 – 30 microns on the surface
tracks. So if we start with a typical 17.5 micron copper foil it will be 40 – 42 microns
after processing.
 The baths are designed to produce an even copper thickness across the panel. Modern
chemical solutions also have good “throwing power” to produce an even thickness of
copper right through the hole.
 Once we have plated the copper onto the board we then plate a thin layer of tin. This we
will use in the next step of the process when we etch off the unwanted copper foil.

Fig shows electro plating in which copper plating and tin plating.

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Fig shows the etching the unwanted material on bored by ship yard chemicals.
 In simple word, in process we have to do “ electro plating system”. In this copper
anode is present , sheet is presented in this copper is deposited on the board. After
this ,Resist tripping have done acid base neutralization will done. After this the
board is send to electing where it remove the unwanted copper. Then tin stripping
where only tin is exposed.
 After finishing electro plating , the board is send to etching inspection.

Fig shows after finshing electro plating the boared become like this.

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6) Etching inspection:-Where they detected the errors in board and send to next
process or if errors are more they remove the board. In this process, basically
inspection may be two types 1) manual optical inseption. 2) automatic optical inseption.
 Automated optical inspection (AOI) is an automated visual inspection of a wide
range of products, such as PCBs, LCDs, transistors, automotive parts, lids
and labels on product packages .In case of PCB-inspection, a camera autonomously
scans the device under test (DUT) for variety of surface feature defects such as
scratches and stains, open circuits, short circuits, thinning of the solder as well as
missing components, incorrect components, and incorrectly placed components.
 Manual optical inspection(MOI) is a manual visual inspection range of products,
such as PCBs, LCDs, transistors, automotive parts, lids and labels on product
packages or agricultural products (seed corn or fruits). In pcb inspection man can be
done through the help of light brightness and zooming mirror.
 Errors deteting during inspection are as follows
a. Line width violations.
b. Spacing violation.
c. Excess copper.
d. Missing pad. (e.g. a feature that should be on the board is missing.)
e. Short circuits.
f. Cuts/Open circuits.
g. Whole breakage.
 These are errors detecting during manual optical inspection. But where as auto optical
inspection there are few more errors detected by machines they are
 Area Defects,
 Billboarding
 Component offset
 Component polarity
 Component presence/absence
 Component skew
 Excessive solder joints

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 Flipped component
 Height Defects
 Insufficient paste around Leads
 Insufficient solder joints
 Lifted leads
 No-population tests
 Paste registration
 Severely damaged components
 Solder bridges
 Tombstoning
 Volume defects
 Wrong part.
This error will done in all inspections like Etching inspection, soldermasking inspection,
final inspection. Where they detected the errors in board and send to next process or
if errors are more they remove the board.

Fig show inpection in brightness if errors came, they detect and clear it with some technical
equipment.

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7) Screen printing:-
 There are two tasks involved in it .They are brushing and S/M printing. Brushing
is to remove roughness (or) to make the material smooth.
 After brushing, we apply solder masking. We have epoxy ink solder mask on to
each side of the board to protect the copper surface and prevent solder shorting
between the components during assembly.
 The electra glasses are used for the ink purpose in the manufacturing of printed
circuit boards.

fig show screen printing machine , board will be placed in middle part of machine pour ink.
 EPOXY INK: It is the ink that is used to transfer the image on to the board. The colour
of the ink is of different types. It depends on the customer specification, normally green
colour is used.
 They are acetone, brown tape, chromline, electra dark glass, electra light glass, electra
black glass, rubber gloves, paper tape, soap oil, bleaching powder are materials required
at screen printing.
 After finishing screen printing, the board is send to heat the boards in over up to 70
degrees and cool them.

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8) PIT photo image transfer (Solder Masking):- after completion of screen printing the
ink is present in the holes of board to make the holes open. we use this method.we
develop the boards using uv light, to observe whether all holes are open, are there are any
short circuits.
 Most boards have a epoxy-ink solder mask printed onto each side to protect the copper
surface and prevent solder shorting between components during assembly
 The panels are first cleaned and brushed to remove any surface tarnish. Each panel is
given a final clean to remove any dust from the surface and loaded into the vertical
coater. The coating machine simultaneously covers both sides of the panel with the
epoxy solder mask ink. The double action ensures that the ink completely encapsulates
the copper tracking, typically now 35 – 40 microns higher than the surface of the panel.
fig solder mask epoxy ink.

 The panels are now racked and put through a drier which hardens the resist just enough to
allow it to be printed (“tack-dried”).
 Next the coated panels are imaged. For this we use a two drawer UV printer. The
operator mounts the photo tool films on the machine and then places the panel onto the
registration pins.
 The other areas which are not to be solderable are covered with a solder resist material. It
is basically a polymer coating that prevents the solder from bringing traces and possibly
creating shortcuts to nearby component leads.

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 The imaged panels are put out of the clean room and into the developer which strips off
the unhardened and unwanted resist. Later the required resist will be further hardened or
“cured” to provide a robust and permanent coat.
 It is exposing and developing of a board, after the image is transferred on to the board
using an ink called epoxy ink. Normally we use green colour. After solder masking we
heat the boards in oven up to 70 degrees and cool them. Later we develop the boards
using uv light, to observe whether all holes are open.


Fig solder mask pcb heated and cooled
 After finishing, this boared is send to sm inspection.
9) SM INSPECTION:-
 It is to inspect the boards, whether all holes are open (or) any short circuits.
10)HOT AIR LEAVLING:-
 The printed circuit board is dipped in to a bath of molten solder so that all the exposed
copper surface is covered by solder. Excess solder is removed by passing the printed
circuit board between hot air and knives.

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Fig show HAL , dipp the pcb in machine and after leveing hot air is leved out side see above.
 Advantages of HAL are: Excellent wetting during component soldering.
 Disadvantages of HAL are: High thermal stress during process may introduce the defects
in printed circuit board.

10) Legend printing:-
 In this process we have to print the colour on the component identification purpose.
So that we used this process. We can print with white or red or other colours as our
required with the help of machine. The machine is similar to screen printing machine as
given in above page.

Fig after legend printing, the board looks like this with this we can identify components
placement.
 After finishing legend printing, the PCB board is send to heat the boards in over up to
70 degrees and cool them. So that the board become hard.

11) CNC V-GROOVING AND ROUTING
 These are used for creating break away tabs (or) lines. Routing builds a preceding step
called placement which determines the location of each active element of an IC (or)
component on printed circuit board.
 After placement, the routing step adds wires needed to properly connects the placed
components.

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ROUTING PROCESS
 It is a step in which the board is shaped as per as customer requirement for the placement
of the components. After component placement, the most important stage of the PCB
design process is routing the connections.
 for customer required we have to desired the boarded with shaped with the help
of electronic machine.
 The routing file is received from the photo lab is inserted in the machine with customer
required.

Fig shown that routing the shall of pcbs with posalux machine by the help of excellon file.
V –GROVVING PROCESS
 It is process, the machine will just drawn the cutting shape on the PCB board for cutting
the board into small sized pcb as required. After this, the pcb is send to routing process.

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12) Bare boared testing BBT :-
 It is a bear board testing .It is used for the checking of errors in the printed circuit board.
If there are any errors the board will be rejected and it will be indicated in the monitor
screen.
 The fixure fabrication & testing where we have to test the boared whether it is
work or not with the help of machines.

Fig show pcb is testing with the help of machines.
 It is an Auto optimization inseption, which mean it can check with the board is working
correctly or not. It will detect the errors as I mentioned in etching inseption. If more
errors the board will be cancelled.

13) FINAL INSEPTION.
 It is the last step in the printed circuit board manufacturing process. It is a manual
optical inseption.can is done with man.
 To check whether all the boards are perfect without any errors. If error is found the
boards are rejected. If the boards are perfect the board is make into required customer
size and then packed given to the customer in a given period of time.
 After bear board testing i.e. Once again manually the boards are inspected to find errors
i.e. whether the circuit is correct, any short circuits, and improper connections….etc.

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14) Stores & manufacturing :-
 In this process, they have to pack the product and make the payment and deliver
to the customer.
fig shown final packege of pcb.

 With this manufactureing process is finished. Same process is repet for all boards
like single side, double side, multi layer PCBs.
 Next step is send to customer, there company they have to placement the
component as per position in pcb and required wires and external protection
layer is connected and tested the device whether it is working or not.

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CHAPTER -12
MARKETING MANAGEMENT IN PCB
12.1 Supply chain management
We have learned about the Supply chain management Supply chain management place a
crucial role in industry because it provides a great deal of interaction and trust between
companies to work it provides an over site of materials information and finances as they
move in suppler to the manufacturer to wholesaler to retailer to customer. It involves the
coordinating and integrating these flows both within and among the companies.

12.2 COMPONENTS OF SUPPLY CHAIN MANAGEMENT
Five basic components of Supply chain management are:
 Planning: It is strategic portion of Supply chain management .In this companies need a
strategy for managing all the resources.
 Source: In this the companies must choose suppliers to deliver the goods and services that
they need to create their product
 Making/manufacturing: It is the manufacturing step. The company managers schedule the
activities necessary for production, testing, packing and preparation for delivery.
 Deliver: In this step the company coordinates the receipt of orders from customers pick
carriers to get products to customers.
 Return: In this step the supply chain planners (or) company managers to create
responsive and flexible network for receiving defective and excess products back from

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customers and to support customers if they have any problem with the product.
12.3 IDEAS OF SUPPLY CHAIN MANAGEMENT
It is based on the two core ideas they are:
 Practically every product that reaches an end user represents the cumulative effect of
multiple organizations are referred to collectively as supply chain. While supply
chains have existed for a long time most organizations have paid attention to what
was happening with in their “four walls”.
Supply chain management (SCM) is "the systemic, strategic coordination of the traditional
business functions and the tactics across these business functions within a particular company
and across businesses within the supply chain, for the purposes of improving the long term
performance of the individual companies and the supply chain as a whole." It has also been
defined as the "design, planning, execution, control, and monitoring of supply chain activities
with the objective of creating net value, building a competitive infrastructure, leveraging
worldwide logistics, synchronizing supply with demand and measuring performance
globally."Supply chain management provides the oversight of materials, information,
finances as they move from supplier to manufacturer to whole seller to retailer to customer.It
involves the coordinating and integrating these flows both within and among companies. It is
said that the ultimate goal of any effective supply chain management is to reduce the costs.



Fig 5.3.a chain of supply chain management

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CHAPTER – 13 PCB marketing in world .
13.1 Pcb market size:-
 Indian PCB Market Size,
Imports INR 2650
 Imports come mainly from China, Taiwan, Hong Kong, Korea and the US.
 The import prices are almost at par with domestic prices with difference narrowing down
to just 5-8%. The imports are largely due to huge demand-supply gap. However,
domestic prices in medium volumes are competitive and do notface any threat from
imports.
 Exports INR 400
India is exporting about 24 percent of its production to the US, Germany, Malaysia,
Austria, Belgium,Netherlands, the UK, Italy, Spain, Thailand and New Zealand. India
exports single-side, double-side, andmultilayer PCBs.
 Domestic INR 1250PCB manufacturers in India mostly cater across electronics
applications in India except motherboards,mobiles and high-end telecom equipment.
 Total Indian PCB Market Size = INR 4000 crores
13.2 An impressive 17% CAGR growing PCB demand
The market demand is expected to grow to over 45Mn SQM by 2014 from existing 17.7Mn
SQM at a
CAGR of 17%.
• The market is fairly large and there is no dependence on single or few suppliers or customers.
Linaks will be able to encash this opportunity in the Domestic market.
I. Consumer Electronics (CE) 38350
II. IndustrialElectronics/Automation (IE) 1150
III. Computers and peripherals 780
IV. Comn.& Broadcast eqpt. 4250
V. Strategic Electronics (SE) 220
VI. Automotive Electronics (AE) 720
Total 45470 17.00%

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13.3 PCB Demand

The main demands for PCBs come from consumer, industrial, and automotive electronics
markets, as well as from Power & telecommunications.
• PCB manufacturers in India mostly caters to the small to medium volumes across
all sectors.
• The mobile phone, PC and communication technology sectors which are biggest
consumers of PCBs still rely a lot on imports.
13.4 PCB Usage Practices in India

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\

Fig shows aggregated demand in different devices with consumers and types of pcbs used by
different sectors .

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CHAPTER- 14
Optimization of materials in pcb
14.1 Optimization in pcb manufacturing
• In the first manufacturing step of CNC (Computer numericalcounter) the materials
required are laminate, drill bits, router bits, aluminum entry sheet, white tapes, emery
paper, banioun waste, cotton gloves, tooth brush, smooth files.
• In the CNC ,This materials are necessary to manufacture the pcb . so there is no scope
to optimize or to remove of this materials because this materials are used for
designing and manufacturing purpose . hence there is no possible way to optimization of
materials but in this step we can reduce the power usage only.
• In the wet processing ,Various chemicals are used such as copper sulphate, stannous
sulphate , sulphuricacid, sodium carbonate. sensitizer 5100B, sensitizer 5123M,activator
5300R, activator 5300B,enchancer 5400,stabilizer 5600,microtech 5700A,microtech
5700B,Sulphuric acid, hydrogen peroxide..etc.
• In the wet processing, we use different chemicals and different combinations of
chemicals because customer required different type of chemical in their making
purpose so they require purpose we are using different chemical .
• Different chemicals and different combinations of chemicals called shipyard chemicals.
• In this wet processing we can optimize the usage of chemicals .we are using different
chemicals after using every chemical we can prevent for another purpose or using for
further steps. Like that we can do there is utilization of chemicals with out wasting.
• In PIT(Photo image transfer ), there is no scope to optimization of materials in
manufacturing .
• In SM and LP(solder masking and laser printing), we can print the screen with
customer required cheimicals . here we can optimize the chemical with less quantity
using the chemicals will mixing the solutions.
• After finising V-grovving and Routing in CNC, the unwanted metal or board can be
send to copper cladding laminate manufacturing process because it will do again
making of ccl.
• In etching or sm or final inseption , the unwanted board and remove board can used
for ccl making .

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• In HAL (hot air leavel), we can reduce the air pressure level .
• This is all possible ways to optimize the chemicals and materials in pcb
manufacturing .
• By optimizing , the cost of pcb board also influences or in other worlds TO
OPTIMIZE THE MATERIALS IN PCB MANUFACTURING , IT EFFECTS
TO MANUFACTURING COST SIMULATION.
• Failure Mode and Effect Analysis (FMEA) is that tool. FMEA is a formal process of
identifying all the ways a process or product can fail, and then determining how to reduce
or eliminate them.
• Overall Equipment Effectiveness (OEE) is a metric that includes throughput, availability
and quality. It is a metric that allows organizations to view performance of assets in the
factory.
• Availability = operating time/planned production time
• Throughput (run rate) = (total pieces/operating time) / planned cycle time.
• Quality = TPY = (good pieces / total pieces)
• Since statistically over 80% of components are placed with automated SMT equipment,
we move our focus on those specific assets. There are 3 main elements to optimizing
process performance in SMT equipment, and ensuring high OEE:
1) Ensuring maximum availability of assets by minimizing downtime
2) Ensuring high throughput by ensuring optimal machine efficiency
3) Ensuring high quality by monitoring placement quality real-time.

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14.2 Optimization of errors in CAD and CAM
Some of the techniques how to optimize the PCB.As the given bellow this are few steps given by
■ Minimizing capture pads
Altera’s boards regularly use 18-mil to 20-mil capture pads on 9-mil to 10-mil drill diameters,
respectively.
■ Removing all non-functional pads
Altera recommends removing all NFPs for designs with high aspect ratio vias. Altera regularly
uses 9-mil and 10-mil drills on 90-mil and 100-mil thick PCBs, respectively (an aspect ratio of
10:1).
■ Increasing anti-pad diameter
Altera recommends using 40-mil to 50-mil anti-pad clearances. Altera boards have achieved
good performance results with 40-mil and 50-mil anti-pad via designs.
■ Minimizing via stubs
Altera recommends using stripline routing on layers near the opposite surface of where the signal
enters the via to minimize stub lengthsAdding AC return vias adjacent to each signal via:
Altera recommends adding ground vias placed within 35 mils center-to-center adjacent to each
signal via for providing better AC return path.
■ Using back drilling to remove stubs when appropriate.
Example of how optimization is applicable to automated drilling operations for PCB , which
has potential reduction of cost of PCB manufacturing.


Fig Automated drilling operations for PCB.

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CHAPTER -15
Applications of PCB
15.1 Applications of PCB in electronic industries:
 Applications in varied areas
 Large and small
 Rigid and flexible
 Conventional electronics driver circuits like as below
 Computerized Reflow Oven
 Stencil Printer
 Digital Oscilloscopes
 Soldering Station
 Multiple power supply
 Frequency Generator
 Multi Meter
 Variact
 EPROM Programmer.

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CHAPTER -16
RESULTS OF PROJECT.
I had done project which results are given below. The results of CAD,CAM,FINAL PCB.
16.1 Result of CAD and CAM:

Fig show circuit diagram for CAM schematic editor.

Fig show result tracks of CAD.

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Figure shows CAM files of drilling files,routing,solder masking,legend printing and dry filmPIT.

Fig show final pcb after manufacturing.

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Conclusion
Optimization of materials and optimization in size reducing and error detection play a crucial
role in printed circuit board. To reduce the size of pcb’s the current materials should be replaced
by alternative materials .So that the size of pcb’s is reduced and cost of pcb’s is also reduced.
There are many raw materials are used in the printed circuit board. As the size of printed circuit
board plays a crucial role in today’s electronic industry. The main aim of the industry to supply
the goods to the customer in a time limit. So in order meet target they should follow the supply
chain management .Supply chain management gives the oversight of different departments
together and coordinates them to meet the demand. Printed circuit boards (PCB) are one of the
most important parts of electrical and electronic devices. It provides mechanical support for the
electronic components. It interconnects the components to each other and provides input/output
connections so that the electronics can interact with the user. PCBs are used in both desktop and
laptop computers. They serve as the foundation for many internal computer components, such as
video cards, controller cards, network interface cards, and expansion cards. These components
all connect to the motherboard, which is also a printed circuit board. So these raw materials plays
most important role in pcb manufacturing So in detail study of these raw materials will helps us
to create different sizes of pcb’s which in turn reduces the cost and time for manufacturing.
As the size of printed circuit board is reducing gradually and reasons for its gradual decrease in
size is of usage of raw materials. There are around 150 raw materials are used and these raw
materials plays a crucial role in the reduction of size of printed circuit board. To optimize the
reducing of errors we have to use manual optical inspection. The costs of printed circuit board
also intern should be reduced and also time for the manufacturing of printed circuit board.

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References
1) http://www.engineersgarage.com/contribution/kicad-tutorial?page=5
2) Sulakshana ckt ltd for manufacturing process.
3) Achieving Optimal Manufacturing Flow using OEE (Part 4)January 2011
4) http://communities.mentor.com/mgcx/community/manufacturing_solutions)
5) Viewmate pentlogon for CAM work.
6) KIicad for CAD simulation.
7) www.wikipedia.com and www.google.co.in.
8) www.sclpcb.com.