Slide3_History_and_Evolutions_FIXED.pptx

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1. History and Evolution 1990s-2000s Origins: Evolved from multi-chip modules (MCMs) in the 1990s–2000s; gained traction in 2010s for heterogeneous integration 2017 AMD’s EPYC processors introduce Infinity Fabric to link chiplets 2018-2019 Intel’s Foveros (3D stacking) and EMIB (2.5D bridges) for efficient interconnects 2020s Standardization with UCIe alliance (2022) by Intel, AMD, TSMC; widespread in AI chips like NVIDIA Blackwell Recent Focus on yield and cost, with academic studies on thermal management (e.g., Kang et al., 2018)