Datasheet IC L293

Datasheet tentang motor driver dengan menggunakan IC L293

1. 2
1
7
10
9
15
3
6
11
14
1A
1,2EN
2A
3A
3,4EN
4A
1Y
2Y
3Y
4Y Product
Folder Sample &
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Documents Tools &
Software Support &
Community L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016
L293xQuadrupleHalf-HDrivers
1Features 3Description
TheL293andL293Ddevicesarequadruplehigh-
1•WideSupply-VoltageRange:4.5Vto36V
currenthalf-Hdrivers.TheL293isdesignedto
•SeparateInput-LogicSupply
providebidirectionaldrivecurrentsofupto1Aat
•InternalESDProtection voltagesfrom4.5Vto36V.TheL293Disdesigned
toprovidebidirectionaldrivecurrentsofupto600-mA•High-Noise-ImmunityInputs
atvoltagesfrom4.5Vto36V.Bothdevicesare
•OutputCurrent1APerChannel(600mAfor
designedtodriveinductiveloadssuchasrelays,
L293D)
solenoids,DCandbipolarsteppingmotors,aswellas
•PeakOutputCurrent2APerChannel(1.2Afor otherhigh-current/high-voltageloadsinpositive-
L293D) supplyapplications.
•OutputClampDiodesforInductiveTransient
Eachoutputisacompletetotem-poledrivecircuit,
Suppression(L293D)
withaDarlingtontransistorsinkandapseudo-
Darlingtonsource.Driversareenabledinpairs,with
2Applications drivers1and2enabledby1,2ENanddrivers3and4
enabledby3,4EN.
•StepperMotorDrivers
TheL293andL293Darecharacterizedforoperation•DCMotorDrivers
from0°Cto70°C.
•LatchingRelayDrivers
DeviceInformation
(1)
PARTNUMBER PACKAGE BODYSIZE(NOM)
L293NE PDIP(16) 19.80mm×6.35mm
L293DNE PDIP(16) 19.80mm×6.35mm
(1)Forallavailablepackages,seetheorderableaddendumat
theendofthedatasheet.
LogicDiagram
1
AnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailability,warranty,changes,useinsafety-criticalapplications,
intellectualpropertymattersandotherimportantdisclaimers.PRODUCTION DATA.

2. L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016 www.ti.com
TableofContents
8.3FeatureDescription...................................................71Features..................................................................1
8.4DeviceFunctionalModes..........................................82Applications...........................................................1
9ApplicationandImplementation..........................93Description.............................................................1
9.1ApplicationInformation..............................................9
4RevisionHistory.....................................................2
9.2TypicalApplication...................................................9
5PinConfigurationandFunctions.........................3
9.3SystemExamples...................................................10
6Specifications.........................................................4
10PowerSupplyRecommendations.....................13
6.1AbsoluteMaximumRatings......................................4
11Layout...................................................................14
6.2ESDRatings..............................................................4
11.1LayoutGuidelines.................................................14
6.3RecommendedOperatingConditions.......................4
11.2LayoutExample....................................................14
6.4ThermalInformation..................................................4
12DeviceandDocumentationSupport.................15
6.5ElectricalCharacteristics...........................................5
12.1RelatedLinks........................................................15
6.6SwitchingCharacteristics.........................................5
12.2CommunityResources..........................................15
6.7TypicalCharacteristics..............................................5
12.3Trademarks...........................................................15
7ParameterMeasurementInformation..................6
12.4ElectrostaticDischargeCaution............................15
8DetailedDescription..............................................7
12.5Glossary................................................................15
8.1Overview...................................................................7
13Mechanical,Packaging,andOrderable
8.2FunctionalBlockDiagram.........................................7
Information...........................................................15
4RevisionHistory
NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion.
ChangesfromRevisionC(November2004)toRevisionD Page
•RemovedOrderingInformationtable....................................................................................................................................1
•AddedESDRatingsandThermalInformationtables,FeatureDescriptionsection,DeviceFunctionalModes,
ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Deviceand
DocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection.....................................1
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3. HEAT SINK AND
GROUND
HEAT SINK AND
GROUND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1,2EN
1A
1Y
2Y
2A
V
CC2
V
CC1
4A
4Y
3Y
3A
3,4EN L293,L293D
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5PinConfigurationandFunctions
NEPackage
16-PinPDIP
TopView
PinFunctions
PIN
TYPE DESCRIPTION
NAME NO.
1,2EN 1 I Enabledriverchannels1and2(activehighinput)
<1:4>A 2,7,10,15 I Driverinputs,noninverting
<1:4>Y 3,6,11,14 O Driveroutputs
3,4EN 9 I Enabledriverchannels3and4(activehighinput)
Devicegroundandheatsinkpin.Connecttoprinted-circuit-boardgroundplanewithmultiple
GROUND 4,5,12,13 —
solidvias
V
CC1 16 — 5-Vsupplyforinternallogictranslation
V
CC2 8 — PowerVCCfordrivers4.5Vto36V
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4. L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016 www.ti.com
6Specifications
6.1AbsoluteMaximumRatings
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
(1)
MIN MAX UNIT
Supplyvoltage,V
CC1
(2)
36 V
Outputsupplyvoltage,V
CC2 36 V
Inputvoltage,V
I 7 V
Outputvoltage,V
O –3 V
CC2+3 V
Peakoutputcurrent,I
O(nonrepetitive,t≤5ms):L293 –2 2 A
Peakoutputcurrent,I
O(nonrepetitive,t≤100µs):L293D –1.2 1.2 A
Continuousoutputcurrent,I
O:L293 –1 1 A
Continuousoutputcurrent,I
O:L293D –600 600 mA
Maximumjunctiontemperature,T
J 150 °C
Storagetemperature,T
stg –65 150 °C
(1)StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings
only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended
OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.
(2)Allvoltagevaluesarewithrespecttothenetworkgroundterminal.
6.2ESDRatings
VALUE UNIT
Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001
(1)
±2000
Electrostatic
V
(ESD) V
discharge
Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101
(2)
±1000
(1)JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.
(2)JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.
6.3RecommendedOperatingConditions
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
MIN NOM MAX UNIT
V
CC1 4.5 7
Supplyvoltage V
V
CC2 V
CC1 36
V
CC1≤7V 2.3 V
CC1 V
V
IH High-levelinputvoltage
V
CC1≥7V 2.3 7 V
V
IL Low-leveloutputvoltage –0.3
(1)
1.5 V
T
A Operatingfree-airtemperature 0 70 °C
(1)Thealgebraicconvention,inwhichtheleastpositive(mostnegative)designatedminimum,isusedinthisdatasheetforlogicvoltage
levels.
6.4ThermalInformation
L293,L293D
THERMALMETRIC
(1)
NE(PDIP) UNIT
16PINS
R
θJA Junction-to-ambientthermalresistance
(2)
36.4 °C/W
R
θJC(top) Junction-to-case(top)thermalresistance 22.5 °C/W
R
θJB Junction-to-boardthermalresistance 16.5 °C/W
ψ
JT Junction-to-topcharacterizationparameter 7.1 °C/W
ψ
JB Junction-to-boardcharacterizationparameter 16.3 °C/W
(1)Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication
report,SPRA953.
(2)ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7.
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5. 5
3
1
0
2
−50 0 50
4
100
T
A− Ambient Temperature −°C
With Infinite Heat Sink
Free Air
Heat Sink Withθ
JA= 25°C/W
150
PTOT− Power Dissipation − W L293,L293D
www.ti.com SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016
6.5ElectricalCharacteristics
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
L293:I
OH=−1A
V
OH High-leveloutputvoltage V
CC2–1.8 V
CC2–1.4 V
L293D:I
OH=−0.6A
L293:I
OL=1A
V
OL Low-leveloutputvoltage 1.2 1.8 V
L293D:I
OL=0.6A
V
OKH High-leveloutputclampvoltage L293D:I
OK=–0.6A V
CC2+1.3 V
V
OKL Low-leveloutputclampvoltage L293D:I
OK=0.6A 1.3 V
A 0.2 100
I
IH High-levelinputcurrent V
I=7V µA
EN 0.2 10
A –3 –10
I
IL Low-levelinputcurrent V
I=0 µA
EN –2 –100
Alloutputsathighlevel 13 22
Alloutputsatlowlevel 35 60
I
CC1 Logicsupplycurrent I
O=0 mA
Alloutputsathigh
8 24
impedance
Alloutputsathighlevel 14 24
Alloutputsatlowlevel 2 6
I
CC2 Outputsupplycurrent I
O=0 mA
Alloutputsathigh
2 4
impedance
6.6SwitchingCharacteristics
overoperatingfree-airtemperaturerange(unlessotherwisenoted)V
CC1=5V,V
CC2=24V,T
A=25°C
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
L293NE,L293DNE 800
Propagationdelaytime,low-to-
t
PLH ns
high-leveloutputfromAinput
L293DWP,L293NL293DN 750
L293NE,L293DNE 400
Propagationdelaytime,high-to-
t
PHL ns
low-leveloutputfromAinput
L293DWP,L293NL293DN 200
C
L=30pF,
SeeFigure2
L293NE,L293DNE 300
Transitiontime,low-to-high-level
t
TLH ns
output
L293DWP,L293NL293DN 100
L293NE,L293DNE 300
Transitiontime,high-to-low-level
t
THL ns
output
L293DWP,L293NL293DN 350
6.7TypicalCharacteristics
Figure1.MaximumPowerDissipationvsAmbientTemperature
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6. Output
C
L= 30 pF
(see Note A)
V
CC1
Input
3 V
TEST CIRCUIT
t t
f r
3 V
0
t
PHL
V
OH
t
THL t
TLH
VOLTAGE WAVEFORMS
t
PLH
Output
Input
V
OL
t
w
NOTES: A. C
Lincludes probe and jig capacitance.
B. The pulse generator has the following characteristics: t
r≤10 ns, t
f≤10 ns, t
w= 10 μs, PRR = 5 kHz, Z
O= 50 Ω.
Pulse
Generator
(see Note B)
5 V 24 V
V
CC2
A
EN
Y
90% 90%
50%
10%
50%
10%
90% 90%
50%
10%
50%
10% L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016 www.ti.com
7ParameterMeasurementInformation
Figure2.TestCircuitandVoltageWaveforms
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7. 1
0
3
4
5
6
7
8
9
10
11
12
13
14
15
161
2
1
0
1
1
0
2
4
3
M
M
M
1
0
1
0
1
0
V
CC2
V
CC1 L293,L293D
www.ti.com SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016
8DetailedDescription
8.1Overview
TheL293andL293Darequadruplehigh-currenthalf-Hdrivers.Thesedevicesaredesignedtodriveawidearray
ofinductiveloadssuchasrelays,solenoids,DCandbipolarsteppingmotors,aswellasotherhigh-currentand
high-voltageloads.AllinputsareTTLcompatibleandtolerantupto7V.
Eachoutputisacompletetotem-poledrivecircuit,withaDarlingtontransistorsinkandapseudo-Darlington
source.Driversareenabledinpairs,withdrivers1and2enabledby1,2ENanddrivers3and4enabledby
3,4EN.Whenanenableinputishigh,theassociateddriversareenabled,andtheiroutputsareactiveandin
phasewiththeirinputs.Whentheenableinputislow,thosedriversaredisabled,andtheiroutputsareoffandin
thehigh-impedancestate.Withtheproperdatainputs,eachpairofdriversformsafull-H(orbridge)reversible
drivesuitableforsolenoidormotorapplications.
OntheL293,externalhigh-speedoutputclampdiodesshouldbeusedforinductivetransientsuppression.On
theL293D,thesediodesareintegratedtoreducesystemcomplexityandoverallsystemsize.AV
CC1terminal,
separatefromV
CC2,isprovidedforthelogicinputstominimizedevicepowerdissipation.TheL293andL293D
arecharacterizedforoperationfrom0°Cto70°C.
8.2FunctionalBlockDiagram
OutputdiodesareinternalinL293D.
8.3FeatureDescription
TheL293xhasTTL-compatibleinputsandhighvoltageoutputsforinductiveloaddriving.Currentoutputscanget
upto2AusingtheL293.
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8. V
CC2
Output
GND V
CC2
Output
GND Input
V
CC1
Current
Source
GND L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016 www.ti.com
8.4DeviceFunctionalModes
Table1liststhefuctionalmodesoftheL293x.
Table1.FunctionTable(EachDriver)
(1)
INPUTS
(2)
OUTPUT(Y)
A EN
H H H
L H L
X L Z
(1)H=highlevel,L=lowlevel,X=irrelevant,Z=highimpedance(off)
(2)Inthethermalshutdownmode,theoutputisinthehigh-impedance
state,regardlessoftheinputlevels.
Figure3.SchematicofInputsfortheL293x
Figure4.SchematicofOutputsfortheL293 Figure5.SchematicofOutputsfortheL293D
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9. 24 V5 V
10 kΩ
V
CC1
V
CC2
Control A
Control B
4, 5, 12, 13
GND
Thermal
Shutdown
Motor
16 8
3
6
11
14
4Y
3Y
2Y
1Y
1,2EN
1A
2A
3,4EN
3A
4A
15
10
9
7
2
1 L293,L293D
www.ti.com SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016
9ApplicationandImplementation
NOTE
InformationinthefollowingapplicationssectionsisnotpartoftheTIcomponent
specification,andTIdoesnotwarrantitsaccuracyorcompleteness.TI’scustomersare
responsiblefordeterminingsuitabilityofcomponentsfortheirpurposes.Customersshould
validateandtesttheirdesignimplementationtoconfirmsystemfunctionality.
9.1ApplicationInformation
AtypicalapplicationfortheL293deviceisdrivingatwo-phasemotor.Belowisanexampleschematicdisplaying
howtoproperlyconnectatwo-phasemotortotheL293device.
Providea5-VsupplytoV
CC1andvalidlogicinputlevelstodataandenableinputs.V
CC2mustbeconnectedtoa
powersupplycapableofsupplyingtheneededcurrentandvoltagedemandfortheloadsconnectedtothe
outputs.
9.2TypicalApplication
Figure6.Two-PhaseMotorDriver(L293)
9.2.1DesignRequirements
Thedesigntechniquesintheapplicationaboveaswellastheapplicationsbelowshouldfallwithinthefollowing
designrequirements.
1.V
CC1shouldfallwithinthelimitsdescribedintheRecommendedOperatingConditions.
2.V
CC2shouldfallwithinthelimitsdescribedintheRecommendedOperatingConditions.
3.Thecurrentperchannelshouldnotexceed1AfortheL293(600mAfortheL293D).
9.2.2DetailedDesignProcedure
WhendesigningwiththeL293orL293D,carefulconsiderationshouldbemadetoensurethedevicedoesnot
exceedtheoperatingtemperatureofthedevice.Properheatsinkingwillallowforoperationoveralargerrangeof
currentperchannel.RefertothePowerSupplyRecommendationsaswellastheLayoutExample.
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10. 24 V5 V
10 kΩ
V
CC1
V
CC2
16 8
1,2EN
1
1A
2
2A
7
3,4EN
9
3A
10
4A
15
Control A
Control B
4, 5, 12, 13
GND
Thermal
Shutdown
Motor
1Y
3
2Y
6
3Y
11
4Y
14 3
1
0
2
0 10 20
P
4
30
TOT− Power Dissipation − W
60
20
0
40
80
θJA− Thermal Resistance −°C/W
40
Side − mm
θ
JA
P
TOT(T
A= 70°C)
50 L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016 www.ti.com
TypicalApplication(continued)
9.2.3ApplicationCurve
RefertoPowerSupplyRecommendationsforadditionalinformationwithregardstoappropriatepower
dissipation.Figure7describesthermaldissipationbasedonFigure14.
Figure7.MaximumPowerandJunctionvsThermalResistance
9.3SystemExamples
9.3.1L293DasaTwo-PhaseMotorDriver
Figure8belowdepictsatypicalsetupforusingtheL293Dasatwo-phasemotordriver.Refertothe
RecommendedOperatingConditionswhenconsideringtheappropriateinputhighandinputlowvoltagelevelsto
enableeachchannelofthedevice.
Figure8.Two-PhaseMotorDriver(L293D)
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11. 2×SES5001
1/2 L293
4, 5, 12, 13
367
8
1
2
16
V
CC2
2×SES5001
2A 1A
V
CC1
EN
M
GND V
CC2
SES5001
1/2 L293
4, 5, 12, 13
10
SES5001
V
CC1
EN
1511 14
16
9
M2
M1
3A 4A
8
GND L293,L293D
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SystemExamples(continued)
9.3.2DCMotorControls
Figure9andFigure10belowdepictatypicalsetupforusingtheL293deviceasacontrollerforDCmotors.Note
thattheL293devicecanbeusedasasimpledriverforamotortoturnonandoffinonedirection,andcanalso
beusedtodriveamotorinbothdirections.Refertothefunctiontablesbelowtounderstandunidirectionalvs
bidirectionalmotorcontrol.RefertotheRecommendedOperatingConditionswhenconsideringtheappropriate
inputhighandinputlowvoltagelevelstoenableeachchannelofthedevice.
Connectionstogroundandtosupplyvoltage
Figure9.DCMotorControls
Table2.UnidirectionalDCMotorControl
EN 3A M1
(1)
4A M2
H H Fastmotorstop H Run
H L run L Fastmotorstop
L X Free-runningmotorstop X Free-runningmotorstop
(1)L=low,H=high,X=don’tcare
Figure10.BidirectionalDCMotorControl
Table3.BidrectionalDCMotorControl
EN 1A 2A FUNCTION
(1)
H L H Turnright
H H L Turnleft
(1)L=low,H=high,X=don’tcare
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12. 3
4
5
6
7
8
1
2
9
10
11
12
13
14
15
16
+
+
+
+
D7
D8 D4
D3
L2 IL2
C1
D5 D1
D6 D2
V
CC1
L293
IL1/IL2 = 300 mA
0.22μF
V
CC2
L1 IL1
D1−D8 = SES5001 L293,L293D
SLRS008D–SEPTEMBER1986–REVISEDJANUARY2016 www.ti.com
Table3.BidrectionalDCMotorControl(continued)
EN 1A 2A FUNCTION
(1)
H L L Fastmotorstop
H H H Fastmotorstop
L X X Free-runningmotorstop
9.3.3BipolarStepping-MotorControl
Figure11belowdepictsatypicalsetupforusingtheL293Dasatwo-phasemotordriver.Refertothe
RecommendedOperatingConditionswhenconsideringtheappropriateinputhighandinputlowvoltagelevelsto
enableeachchannelofthedevice.
Figure11.BipolarStepping-MotorControl
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13. 11.9 mm
17.0 mm
38.0 mm L293,L293D
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10PowerSupplyRecommendations
V
CC1is5V±0.5VandV
CC2canbesamesupplyasV
CC1orahighervoltagesupplywithpeakvoltageupto36
V.Bypasscapacitorsof0.1uForgreatershouldbeusedatV
CC1andV
CC2pins.Therearenopowerupor
powerdownsupplysequenceorderrequirements.
ProperlyheatsinkingtheL293whendrivinghigh-currentiscriticaltodesign.TheRthj-ampoftheL293canbe
reducedbysolderingtheGNDpinstoasuitablecopperareaoftheprintedcircuitboardortoanexternalheat
sink.
Figure14showsthemaximumpackagepowerPTOTandtheθJAasafunctionofthesideoftwoequalsquare
copperareashavingathicknessof35μm(seeFigure14).Inaddition,anexternalheatsinkcanbeused(see
Figure12).
Duringsoldering,thepintemperaturemustnotexceed260°C,andthesolderingtimemustnotexceed12
seconds.
Theexternalheatsinkorprintedcircuitcopperareamustbeconnectedtoelectricalground.
Figure12.ExternalHeatSinkMountingExample(θ
JA=25°C/W)
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14. Copper Area 35-µm Thickness
Printed Circuit Board 5V
TTL Logic
1 Ampere
TTL Logic
1 Ampere
GND
VIAS
TTL Logic
5V to 36V
1 Ampere
TTL Logic
1 Ampere
TTL Logic
TTL Logic
14
13
15
1
2
3
4
16
GND
0.1!F
1,2EN
1A
1Y
VCC1
4A
4Y
10
9
11
12
7
8
6
5
2Y
2A
VCC2
3Y
3A
3,4EN
GND
1!F L293,L293D
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11Layout
11.1LayoutGuidelines
PlacethedeviceneartheloadtokeepoutputtracesshorttoreduceEMI.Usesolidviastotransferheatfrom
groundpinstogroundplaneoftheprinted-circuit-board.
11.2LayoutExample
Figure13.LayoutDiagram
Figure14.ExampleofPrinted-Circuit-BoardCopperArea(UsedasHeatSink)
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15. L293,L293D
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12DeviceandDocumentationSupport
12.1RelatedLinks
Thetablebelowlistsquickaccesslinks.Categoriesincludetechnicaldocuments,supportandcommunity
resources,toolsandsoftware,andquickaccesstosampleorbuy.
Table4.RelatedLinks
TECHNICAL TOOLS& SUPPORT&
PARTS PRODUCTFOLDER SAMPLE&BUY
DOCUMENTS SOFTWARE COMMUNITY
L293 Clickhere Clickhere Clickhere Clickhere Clickhere
L293D Clickhere Clickhere Clickhere Clickhere Clickhere
12.2CommunityResources
ThefollowinglinksconnecttoTIcommunityresources.Linkedcontentsareprovided"ASIS"bytherespective
contributors.TheydonotconstituteTIspecificationsanddonotnecessarilyreflectTI'sviews;seeTI'sTermsof
Use.
TIE2E™OnlineCommunityTI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration
amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp
solveproblemswithfellowengineers.
DesignSupportTI'sDesignSupportQuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand
contactinformationfortechnicalsupport.
12.3Trademarks
E2EisatrademarkofTexasInstruments.
Allothertrademarksarethepropertyoftheirrespectiveowners.
12.4ElectrostaticDischargeCaution
Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam
duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates.
12.5Glossary
SLYZ022—TIGlossary.
Thisglossarylistsandexplainsterms,acronyms,anddefinitions.
13Mechanical,Packaging,andOrderableInformation
Thefollowingpagesincludemechanical,packaging,andorderableinformation.Thisinformationisthemost
currentdataavailableforthedesignateddevices.Thisdataissubjecttochangewithoutnoticeandrevisionof
thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation.
Copyright©1986–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15
ProductFolderLinks:L293L293D

16. PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package TypePackage
Drawing
PinsPackage
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
L293DNE ACTIVE PDIP NE 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE
L293DNEE4 ACTIVE PDIP NE 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE
L293NE ACTIVE PDIP NE 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 L293NE
L293NEE4 ACTIVE PDIP NE 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 L293NE

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

17. PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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