Advantages Of Multi-Objective Optimization
ICEMMM2018 Paper ID: MMM164
15 16 February 2018, SSN College of Engineering, Chennai
Multi Objective Optimization using Taguchi s Loss Function based Principal
Component Analysis in Electrochemical Discharge Machining of Micro Channels on
Borosilicate Glass with Direct and Hybrid Electrolytes
Jinka Ranganayakulu1* and P. V. Srihari1
1Department of Mechanical Engineering, R. V. College of Engineering, Bengaluru
560 059, Karnataka, India
*
[email protected],
[email protected]
Abstract. Machining of hard and brittle materials like borosilicate glass has imposed
challenges due to its low machinability. Among various non traditional machining
methods electrochemical discharge machining (ECDM) or spark assisted chemical
engraving ... Show more content on Helpwriting.net ...
Wuthrich, R., Spaelter, U., Wu, Y., Bleuler, H.: A syatematic characterization
method for gravity feed micro hole drilling in glass with spark assisted chemical
engraving (SACE), J. Micromech. Microeng. 16, 1891 1896 (2006).
3. Mousa, M., Allagui, A., Ng, H.D., Wuthrich, R.: The effect of thermal conductivity
of the tool electrode in spark assisted chemical engraving gravity feed micro drilling,
J. Micromech. Microeng. 19, 015010 (7pp) (2009).
4. Han, M.S., Min, B.K., Jo Lee, S.: Modelling gas film formation in electrochemical
discharge machining processes using a side insulated electrode, J. Micromech.
Microeng. 18, 045019 (2008).
5. Mallik, B., Sarkar, B.R., Doli, B., Bhattachryya, B.: Multi criteria optimization of
Electrochemical Discharge Micro machining process during micro channel
generation on glass, Applied Mechanics and Materials. 592 594, 525 529 (2014).
6. Jonathan, W., Amol., J.: ECDM methods for fludic interfacing through thin glass
substrates and the formation of spherical microcavities, J. Micromech. Microeng. 17,
403 409 (2007).
7. Zhi Ping, Z., Wei Hsin, C., Fuang Yuan, H., Biing Hwa, Y.: 3D microstructuring of
Pyrex glass using the electrochemical discharge machining process, J. Micromech.
Microeng. 17, 960 966