SEM and TEM

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About This Presentation

SEM and TEM techniques


Slide Content

Lecture 5.1
Scanning Electron Microscopy
(SEM)

(SEM) and TEM

Scanning electron microscopy is used for inspecting topographies of specimens at
very high magnifications using a piece of equipment called the scanning electron
microscope. SEM magnifications can go to more than 300,000 Xbut most
semiconductor manufacturing applications require magnifications of less than 3,000
Xonly. SEM inspection is often used in the analysis of die/package cracks and
fracture surfaces, bond failures, and physical defects on the die or package surface.
During SEM inspection, a beam of electrons is focused on a spot volume of the
specimen, resulting in the transfer of energy to the spot. These bombarding
electrons, also referred to as primary electrons, dislodge electrons from the
specimen itself. The dislodged electrons, also known as secondary electrons, are
attracted and collectedby a positively biased grid or detector, and then translated
into a signal.
To produce the SEM image, the electron beam is swept across the area being
inspected, producing many such signals. These signals are then amplified, analyzed,
and translated into images of the topography being inspected. Finally, the image is
shown on a CRT.
Scanning Electron Microscopy (SEM)

Scanning Electron Microscopy (SEM)
•The energy of the primary electrons determines the quantity of
secondary electrons collected during inspection. The emission of
secondary electrons from the specimen increases as the energy of
the primary electron beam increases, until a certain limit is reached.
Beyond this limit, the collected secondary electrons diminishas the
energy of the primary beam is increased, because the primary beam
is already activating electrons deepbelow the surface of the
specimen. Electrons coming from such depths usually recombine
before reaching the surface for emission.

•Aside from secondary electrons, the primary electronbeam results
in the emission of backscattered (or reflected) electronsfrom the
specimen. Backscattered electrons possess more energy than
secondary electrons, and have a definite direction. As such, they
can not be collected by a secondary electron detector, unless the
detector is directly in their path of travel. All emissions above 50 eV
are considered to be backscattered electrons.

•Backscattered electron imaging is useful in distinguishing one
material from another, since the yield of the collected backscattered
electrons increases monotonically with the specimen's atomic
number. Backscatter imaging can distinguish elements with atomic
number differences of at least 3, i.e., materials with atomic number
differences of at least 3 would appear with good contrast on the
image. For example, inspecting the remaining Au on an Al bond pad
after its Au ball bond has lifted off would be easier using backscatter
imaging, since the Au islets would stand out from the Al background.

•A SEM may be equipped with an EDX analysissystem to enable it
to perform compositional analysis on specimens.EDX analysis is
useful in identifying materials and contaminants, as well as
estimating their relative concentrations on the surface of the
specimen.
Scanning Electron Microscopy (SEM)

http://www.matter.org.uk/tem/default.htm

Electron Microscopy

Lecture 5.2
Transmission Electron Microscopy
(TEM)

A transmission Electron Microscope is anologous to a slide projector as indicated by
Philipsbelow

In a conventional transmission electron microscope, a thin specimen is irradiated with
an electron beam of uniform current density. Electrons are emitted from the electron
gun and illuminate the specimenthrough a two or three stage condenser lens system.
Objective lens provides the formation of either image or diffraction pattern of the
specimen. The electron intensity distribution behind the specimen is magnified with a
three or four stage lens system and viewed on a fluorescent screen. The image can be
recorded by direct exposure of a photographic emulsion or an image plate or digitally
by a CCD camera.
The acceleration voltage of up to date routine instruments is 120 to 200 kV. Medium-
voltage instruments work at 200-500 kVto provide a better transmission and
resolution, and in high voltage electron microscopy (HVEM) the acceleration voltage is
in the range 500 kV to 3 MV. Accelerationvoltagedetermines the velocity, wavelength
and hence the resolution(ability to distinguish the neighbouring microstructural
features) of the microscope.
Depending on the aim of the investigation and configuration of the microscope,
transmission electron microscopy can be categorized as :
Conventional Transmission Electron Microscopy
High Resolution Electron Microscopy
Analytical Electron Microscopy
Energy-Filtering Electron Microscopy
High Voltage Electron Microscopy
Dedicated Scanning Transmission Electron Microscopy

(SEM) and TEM

http://www.matter.org.uk/tem/default.htm

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