SISTEMA DE CONTROL MICRONET PLUS PARA TURBINAS TM2500
yasserdek
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Sep 13, 2024
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About This Presentation
SISTEMA DE CONTROL MICRONET PLUS PARA TURBINAS TM2500
Size: 645.4 KB
Language: en
Added: Sep 13, 2024
Slides: 29 pages
Slide Content
MicroNet™ Plus
Slide 1
Energy Learning Center
g
MicroNet™Plus
Redundant and Simplex
Programmable Control Platform
MicroNet™ Plus
Slide 2
Energy Learning Center
g
What is it?
•The latest in a long line of electroni c control system platform (hardware
and software) used to perform speed, load, and process control for all
types of prime movers
.
•Modular hardware and software that can be expanded to fit most any
size application.
•A full compliment of standard MicroNet I/O modules are available to
build up a custom control system for any type or size application.
•Used for custom applications and as a basic platform for standard
products.
MicroNet™ Plus
Slide 3
Energy Learning Center
g Electronic Controls
Migration History
501DCS
1985
NetCon
Phase A & B
1990
MicroNet
1998
MicroNet
TMR
1997
MicroNet Plus
2005
Zilog (some 68020) Based CPU
with small I/O modules
without face plates
Phase A= 68020/030 Based CPU with 501DCS I/O modules
Phase B= 68030/040 Based CPU on VME bus With Larger
I/O modules with face plates
68040 & Pentium CPU on VME
bus with NetCon style I/O modules
Triple Modular Redundant
version MicroNet with 68040 CPU
Motorola 5200
Based CPU
(simplex or
redundant)
on VME bus
with MicroNet I/O
modules
MicroNet™ Plus
Slide 4
Energy Learning Center
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New MicroNet™Plus Hardware
•Chassis
–
Simplex or Redundant CPUs
•Power Supply
–
2 slot higher power density
•CPU
–
Motorola 5200
•RTN Expansion
–
Ethernet Expansion Capabilities
MicroNet™ Plus
Slide 5
Energy Learning Center
g
MicroNet™ Plus Features
New Features
•New, More Powerful CPU5200
–
Motorola MPC5200 PowerPC
–
Seamless upgrade from
simplex to redundant
•New 14-Slot VME Chassis
–
Same Footprint as 12-slot
MicroNet Simplex
•New 2-Slot Power Supply
–
Provides additional I/O slots
•RTN (Real Time Network)
–
Ethernet communications to
remote chassis
–
Eliminates expansion chassis
transceiver
Proven Technology
•Utilizes Standard MicroNet I/O
Modules
–
User choice of simplex,
redundant, or TMR I/O
–
Hot Swappable Modules for
On-Line Repairs
•GAP
– IEC1131-3 Functional
Block Programming Environment
–
Port existing applications
directly to MicroNet Plus
•Same Real Time, Rigid Rate
Group Execution
–
Rate groups as fast as 5mS
•VxWorks Operating System
–
As used in other WG Controls
•Powerful Service Tools
MicroNet™ Plus
Slide 6
Energy Learning Center
g
Environmental Specifications
•System temperature Limits
–
0º to +50ºC (32º to 122ºF)
–
Humidity up to 95% non-condensing
•UL/CUL Certified
–
Hazardous environments: Per NEC article 500 Class 1 Division 2
groups A,B,C,D Temperature Code (T-3C), Pollution degree 2. CE
Certified (24-32 Vdc Systems Only)
–
Conforms to EMC Directive 89/336/EEC. Conformity established by
test to EN 50081-2, EN 61000-6-2 when installed in a non-EMI
cabinet.
–
Conforms to Low Voltage Directive 73/23/EEC. Conformity
established by testing to EN50178 1997.
•Meets Lloyd’s shock, vibration, and humidity specifications
•Surge: IEEE 472/ANSI 37.90a
MicroNet™ Plus
Slide 7
Energy Learning Center
g
MicroNet
TM
Plus Control Chassis
•NEW FEATURES
–
Redundant or Simplex CPU
Architecture
9
Simplex CPU is located in Slot 1
–
2 slot Power Supply
9
Frees up 2 I/O slots
–
Fan monitoring to detect fan failure
before temperature limit is reached
•EXISTING FEATURES
–
Uses standard MicroNet I/O modules
9
Module revisions must be checked for
compatibility
–
Physical mounting is exactly the same
at the simplex MicroNet
The Evolution of the Proven MicroNet Family
MicroNet™ Plus
Slide 8
Energy Learning Center
g
MicroNet™ Plus Chassis
•Standard Chassis - 18 Slots
–
CPU’s and I/O – 14 VME Slots
9
13 I/O modules max with simplex CPU
9
12 I/O modules max with redundant CPU’s
–
Power Supplies – 4 Reserved Slots
9
Option of redundant or simplex Power Supplies
– 24 VDC (18-36VDC)
– 110 VAC/DC (88-132VAC, 100-150VDC)
– 230 VAC (180-264VAC)
•Short Chassis – 12 Slots
–
CPU’s and I/O – 8 VME Slots
9
7 I/O modules max with simplex CPU
9
6 I/O modules max with redundant CPU’s
–
Power Supplies – 4 Reserved Slots
MicroNet™ Plus
Slide 9
Energy Learning Center
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MicroNet™ Plus Chassis
•Smart Fan speed
monitoring
–
6 fans are monitored for
actual speed
–
Fan fault bit is set if fan
stops rotating
9
Fan faults should be
connected to Alarm list
MicroNet™ Plus
Slide 10
Energy Learning Center
g
MicroNet™PlusChassis
Standard Chassis
is 18 Slots Wide
2-Slot
Power
Supply
PS1
2-Slot
Power
Supply
PS2
A1
A1 4
S
I
O A2
S
P
A
R
E A3
A4
A5
A6
A7
A8
A9
A1 0
A1 1
A1 2
A1 3
Fan 1
Fan 2
Fan 3
Fan 4
Fan 6
S
P
D
A
N
I
N
A
N
I
N
S
P
A
R
E
A
C
T
S
P
A
R
E
C
P
U
S
P
A
R
E
D
I
O
D
I
O
S
P
A
R
E
C
P
U
MicroNet™ Plus
Slide 11
Energy Learning Center
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Backplane
•Chassis Support
•P.S. Terminal Block Connectors
•VME Compatible in I/O section
•9 Electrically Isolated Data Paths
•Redundant Power Supply Paths
•12 Layers Thick
•No active components
–
resister networks
–
capacitors
–
connectors
•Layers are isolated by ground and power
planes.
MicroNet™ Plus
Slide 12
Energy Learning Center
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MicroNet™Plus Power Supply
•2 Slot Power Supply
•Power Inputs
–
24 VDC
–
115 VAC/125VDC
–
220 VAC
•220 VDC – No longer
supported
MicroNet™ Plus
Slide 13
Energy Learning Center
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MicroNet™Plus Power Supply
5466-1002 5466-1001 5466-1000 Part Number
* Reduced 5 VDC output current greater than 55°C
*-10 +65°C *-10 +65°C * -10 +65°C Ambient Temp
1250 VA 1250 VA (AC)
600 W (DC)
600 W Input Power
6.7 Amps 13.6 Amps (AC)
6 Amps (DC)
33 Amps Input Current
180-264 VAC 88-132 VAC
100-150 VDC
18-36 VDC Input Voltage
220 VAC 120VAC
125 VDC
24 VDC
MicroNet™ Plus
Slide 14
Energy Learning Center
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MicroNet™Plus Power Supply
•Simplex or Redundant Operation
–
Simplex should be located in PS#1
•On-Line replacement
–
Power Supplies can be replaced on-line
–
Power Supplies must be “cold” swapped
9
Turn off power to “failed” power supply
9
Disconnect input power to the power supply
9
Remove Power Supply
9
Insert new power supply
9
Connect input power
9
Turn power on to the new power supply
•Phoenix Connector simplifies input power connection
MicroNet™ Plus
Slide 15
Energy Learning Center
g
Woodward Designed CPU
•Woodward designed hardware and firmware
–
Utilized 5200 Core CPU design
–
Added peripherals required by industrial control around the
5200 core CPU
–
CPU module manufactured by Woodward
•Freedom to select what inputs went on the faceplate
–
More industrialized CPU than the Xycom Pentium CPU
•Freedom to select CPU functionality
•Freedom to design fail-over mechanisms
MicroNet™ Plus
Slide 16
Energy Learning Center
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MicroNet™ Plus CPU Module
•CPU5200
–
Simplex or Redundant operation
–
Motorola MPC5200 Power PC
Microprocessor
9
400 MHz
9
128 MB DRAM
9
64 MB Flash
9
1.5X Computing Power of Pentium
MicroNet™ Plus
Slide 17
Energy Learning Center
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MicroNet™ Plus CPU Module
•CPU5200 PowerPC Module
–
Two Customer Ethernet Ports
9
Ports are Isolated
9
Ethernet FTM is not required with 5200
9
Ports must be on different domains to function as
redundant
–
Two Real Time Network ports
9
Dedicated for RTN expansion
9
No other devices should be connected to these
networks
–
Two Can Ports
9
Interface to GS6 Valves and DVP Driver (Future)
–
One Serial Port
9
Fully isolated port
9
Supports RS-232, RS-422, RS-485
MicroNet™ Plus
Slide 18
Energy Learning Center
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MicroNet™Plus CPU Module
Reset Switch = CPU hardware reset switch
Woodward Debug Port = Troubleshooting
Run/Reset GRN/RED LED = CPU status
2 Ethernet Ports = Communications
to external system and distributed I/O
2 Real Time Network Ports
GREEN LED = CPU SYSCON
RED Fault LEDs = CPU Faults
Serial Port (RS-232, RS-485, RS-422)
= Communication port
CAN Port = Communication port
CAN Port Status
CAN Port = Communication portUSB Port - Removed on initial release of CPU
MicroNet™ Plus
Slide 19
Energy Learning Center
g
CPU COMPARISON
GAP CODER 4.XX GAP CODER 3.XX GAP CODER 2.XX 3.XX APPLICATION CODE
Modbus Serial UDP TCP/IP
ServLink OPC Server
EGD
CAN
Modbus Serial UDP
TCP/IP
ServLink Serial
Embedded OPC
EGD
Modbus Serial UDP
ServLink Serial
COMMUNICATIONS
VxWorks VenturCom/WinNT Woodward XINU OPERATING SYSTEM
030 - 2MB RAM,
8MB FLASH
040/060 - 8MB RAM,
8MB FLASH
030 – 10 mips @
33MHz
040 – 36 mips @
33MHz
NetCon
MicroNet Simplex
Motorola CPU
(030s, 040s, 060s)
64 MB Flash
128 MB RAM
64 MB RAM
96 MB FLASH
MEMORY
700 mips @ 400MHz
1.5 times the Pentium
550 mips @ 233MHz
2.5 Times the 040
COMPUTING
POWER
MicroNet Plus
MicroNet Simplex
NetCon
MicroNet Simplex
CHASSIS
Motorola 5200 CPU
Pentium CPU
MicroNet™ Plus
Slide 20
Energy Learning Center
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MicroNet™ Plus I/O Modules
MicroNet Plus – Same Proven I/O as MicroNet Simplex
–
Analog Inputs and Outputs
9
Speed MPU/Prox Inputs
9
Thermocouple and RTD Inputs
9
mA and Voltage Inputs and Outputs
9
Actuator Controller mA Output with RVDT/LVDT Feedback
–
Discrete Inputs and Outputs
9
Discrete Contact Inputs
9
Relay Driver Outputs and Relay Boxes
–
Communications and Network
9
LinkNet Controller
– LinkNet Distributed I/O Modules
9
Ethernet (on CPU5200)
9
Serial I/O
9
Real Time SIO (Communications to DLE drivers)
9
Pressure Input (Comms to Honeywell DLE Pressure XDCR)
MicroNet™ Plus
Slide 21
Energy Learning Center
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I/O Modules
Chassis
Cable
I/O
Module
Field
Termination
Module
(FTM)
Field
Wiring
MicroNet™ Plus
Slide 22
Energy Learning Center
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8Ch Current Output
(4-20 mA) Module
Each 8Ch Current Output (4-20 mA) Module has eight
channels for outputting 0-25mA. The module is connected
through one Low Density Analog cable to one Analog
Input FTM for field wiring connections.
These modules have no potentiometers and require no
calibration. A module may be replaced with another
module of the same part number without any adjustment.
MicroNet™ Plus
Slide 23
Energy Learning Center
g
Analog Combo Module
Each High Density Analog Combo module contains
circuitry for four speed sensor inputs, eight analog inputs,
four analog outputs, and two proportional actuator driver
outputs. Each speed sensor input may be from a magnetic
pickup or from a proximity probe, each analog input may
be 4–20 mA or 0-5 V, and each actuator driver may be
configured as 4–20 mA or 20–160 mA.
This module includes no potentiometers and requires no
calibration. An Analog Combo module may be replaced
with another module of the sa me part number without any
adjustment.
MicroNet™ Plus
Slide 24
Energy Learning Center
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48/24 Discrete Combo Module
A 48/24 Discrete Combo module contains circuitry for
forty-eight discrete inputs and twenty-four discrete
outputs. These modules have no potentiometers and
require no calibration. A module may be replaced with
another module of the same part number without any
adjustment.
It’s configuration consists of two 24/12 Discrete FTMs
(DIN rail mounted) connected to the 48/24 Discrete
Combo module via two High Density Analog/Discrete
cables.
MicroNet™ Plus
Slide 25
Energy Learning Center
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MicroNet™Plus System
Overview
MicroNet™ Plus
Slide 26
Energy Learning Center
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MicroNet™Plus
Redundant CPU Operation
•One CPU runs in Master mode (System Controller)
–
Controls the system I/O and application
–
The 2
nd
CPU runs in Standby mode
•Both CPUs
–
Run the same Gap program
–
Have access to the same I/O
9
Back-up CPU gets I/O signals from the Master CPU
9
I/O signal are delayed by 1 Rate Group
•The I/O hardware can be simplex, duplex, or triplex
–
Uses GAP redundancy management
9
HSS, LSS, Averaging, Median
I/O Bus
Simplex
I/O
Duplex
I/O
Triplex I/O
System Control
Master
CPU
Hot
Standby
CPU
MicroNet™ Plus
Slide 27
Energy Learning Center
g
MicroNet™Plus
Redundant CPU Transfer
•Both CPUs contain extensive and compartmentalized health monitoring
–
hardware
–
software
•The Master CPU writes its “state” variable conditions into the Standby
CPU at the end of each RateGroup.
•If the Master CPU’s independent health monitor detects an internal fault or
there is a transfer request and the Standby CPU is available:
–
The Master CPU transfers control of the I/O bus to the Standby CPU
–
The Master CPU isolates itself from the I/O bus
•After the transfer is completed to the Standby CPU
–
The Standby CPU becomes the Master CPU
–
Transfer occurs without disturbance to the I/O or prime mover
–
CPU can operate as Master CPU indefinitely.
•Control can be transferred back to the original Master CPU
any time it’s
available.
MicroNet™ Plus
Slide 28
Energy Learning Center
g
•Forced Transfer
–
Master CPU detects internal failure
–
Standby CPU detects Watchdog
failure
•Application REQ_FOVER
–
Preferred method of transferring
control
–
Toggle input to CHAS_STAT block
–
Operating system confirms backup
CPU is healthy
–
Operating system transfer occurs on
MFT tick
Methods of Transferring
CPU Control
MicroNet™ Plus
Slide 29
Energy Learning Center
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Methods of Transferring
CPU Control
•Pressing the reset button on front panel
–
Less desirable that software REQ_FOVER
9
Validation of the backup CPU is not performed
–
Master CPU stops running
–
System control is taken by backup CPU
–
Occurs when reset is pressed
•Extracting CPU Module
–
Not recommended
9
Validation of the backup CPU is not performed
9
Bus signals are not cleanly broken
–
Master CPU no long installed in system
–
System control is taken by the backup CPU
–
Occurs at the point when CPU is extracted