UNIT V - PPT-MIC S6 measurement tech.pdf

MIC measurement tech

1. 18ECE304T -MICROWAVE INTEGRATED
CIRCUITS
UNIT V -MIC Measurement Techniques
S6-Miniaturization techniques
Dr.S. Bashyam
Assistant Professor
Department of ECE, SRM IST

2. S6-Miniaturization techniques
Microsystems:
•Setsofmicrodevicescapableofintegratedsensing,analysisandactuation.
Microdevices:
•Microstructurescapableofactuation,orsignaltransduction,orchemical
reaction,etc.

3. Miniaturization techniques
NEEDOFMINIATURIZATION:
•Reductiononmassandsize.
•Integrationwithelectronics.
•Exploitationofneweffectsduetosmallsize.
•Cost/performanceadvantages.
•Improvedreproducibility,accuracyandreliability.
•Redundancyandarrays.
•Lowpowerconsumption.
•Lessmaterialusedformanufacturing.
•Avoidingofrareoraggressivetoenvironmentmaterial.
•Easydisposal.

4. Miniaturization techniques

5. Miniaturization techniques
•Semiconductor-Shrinkingthesizeoftransistorsandtheirinterconnections
•QuantumEffectDevices-switchingdevices(usedtomakecomputerlogic)
•MolecularandBiologicalComputing-useindividualmoleculesasswitchingdevicesin
placeoftoday’ssemiconductortransistors
•PackagingandInterconnection–surfacemounttechnologies(SMT),multichip
module(MCM)technology
•BiosensorsandChemicalSensors-Diverseapplicationsareseeninmedicaldiagnosis,
industrialprocessmonitoringandcontrol,fermentationprocesscontrol,andfoodquality
monitoring
•Micro-MechanicalSystems
•FabricationTechnologyResearchandDevelopment–Lithography,electron-beamand
ion-beam

6. Miniaturization techniques

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